A 3D Printing Strategy for Hard Curved Surfaced Circuits: From Materials to Applications Article Swipe
YOU?
·
· 2025
· Open Access
·
· DOI: https://doi.org/10.1002/advs.202417648
With the continuous development of digital surface circuit manufacturing technology, the three‐dimensional (3D) printing strategy of structural electronics has shown an increasingly wide application prospect in the field of electronics, especially in its main subfields such as conformal antennas, sensors, and aerospace. However, there are still many technical challenges in manufacturing high‐precision circuits on complex curved surfaces and within structures. In view of that, this study summarizes the latest development trends and results in 3D printing technology for structural electronics, focusing on the materials, conformal manufacturing technology, printing process control strategies, and their practical applications. In addition, this study analyzes the characteristics, advantages, and limitations of different digital surface circuit manufacturing processes and discusses their application potentials in practice. Finally, this study presents possible future development directions in the field of structural electronics 3D printing and emphasizes the opportunities and challenges in manufacturing conformal electronics on arbitrary surfaces.
Related Topics
- Type
- review
- Language
- en
- Landing Page
- https://doi.org/10.1002/advs.202417648
- https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/advs.202417648
- OA Status
- gold
- References
- 304
- Related Works
- 10
- OpenAlex ID
- https://openalex.org/W4413794837
Raw OpenAlex JSON
- OpenAlex ID
-
https://openalex.org/W4413794837Canonical identifier for this work in OpenAlex
- DOI
-
https://doi.org/10.1002/advs.202417648Digital Object Identifier
- Title
-
A 3D Printing Strategy for Hard Curved Surfaced Circuits: From Materials to ApplicationsWork title
- Type
-
reviewOpenAlex work type
- Language
-
enPrimary language
- Publication year
-
2025Year of publication
- Publication date
-
2025-08-28Full publication date if available
- Authors
-
Wang Qin, Shujuan Li, Wei Wei, Haiqing Bai, Shikui Jia, Robert G. Landers, Yunlong Ma, Wei E. I. Sha, Tuo Kang, Miao Zhang, Weipei Zhang, Mingkun Wang, Tongxin GuanList of authors in order
- Landing page
-
https://doi.org/10.1002/advs.202417648Publisher landing page
- PDF URL
-
https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/advs.202417648Direct link to full text PDF
- Open access
-
YesWhether a free full text is available
- OA status
-
goldOpen access status per OpenAlex
- OA URL
-
https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/advs.202417648Direct OA link when available
- Concepts
-
3D printing, Electronic circuit, Computer science, Engineering drawing, Materials science, Mechanical engineering, Electrical engineering, EngineeringTop concepts (fields/topics) attached by OpenAlex
- Cited by
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0Total citation count in OpenAlex
- References (count)
-
304Number of works referenced by this work
- Related works (count)
-
10Other works algorithmically related by OpenAlex
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