International Journal of Reconfigurable and Embedded Systems (IJRES) • Vol 5 • No 1
An Automated Way of Baking Process for Moisture Sensitive Components
January 2016 • Aravind Ramamoorthy, M. Jagadeeshraja, L. Manivannan, Gunasekaran Raja
<p>The objective of my project is to the new technology termed as “baking process” to remove the moisture content available in the particular electronics devices which is used in Rea time industrial application. In Industries there are certain policies are maintained for semiconductor devices, which referred as “Shelf life” of the material. Once it crossed its lifetime, some process need to done to extend this. Depends on the moisture sensitive characteristics baking is employed mainly to shelf life extensio…