Bonding Processing and 3D Integration of High-Performance Silicon PIN Detector for ΔE-E telescope Article Swipe
Zhiyuan Zhu
,
Maoqiu Pu
,
Jiang Min
,
Sixiang Zhang
,
Min Yu
·
YOU?
·
· 2023
· Open Access
·
· DOI: https://doi.org/10.3390/pr11020627
YOU?
·
· 2023
· Open Access
·
· DOI: https://doi.org/10.3390/pr11020627
Currently, the integration method of silicon PIN radiation detectors faces challenges such as complex processes, poor reliability and thick dead layers. Novel integration methods based on metal bonding technology for realizing the integration of thick and thin PIN detectors are needed with the requirement of reducing signal crosstalk, package volume and weight. Combined with the current research on metal bonding technology, this paper presents an extensive review of metal bonding technology, especially metal Al bonding technology, to provide a certain reference to future research on the bonding processing of high-performance silicon PIN detector devices.
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Metadata
- Type
- article
- Language
- en
- Landing Page
- https://doi.org/10.3390/pr11020627
- https://www.mdpi.com/2227-9717/11/2/627/pdf?version=1676971362
- OA Status
- gold
- Cited By
- 3
- References
- 41
- Related Works
- 10
- OpenAlex ID
- https://openalex.org/W4321378156
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Raw OpenAlex JSON
- OpenAlex ID
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https://openalex.org/W4321378156Canonical identifier for this work in OpenAlex
- DOI
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https://doi.org/10.3390/pr11020627Digital Object Identifier
- Title
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Bonding Processing and 3D Integration of High-Performance Silicon PIN Detector for ΔE-E telescopeWork title
- Type
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articleOpenAlex work type
- Language
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enPrimary language
- Publication year
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2023Year of publication
- Publication date
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2023-02-18Full publication date if available
- Authors
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Zhiyuan Zhu, Maoqiu Pu, Jiang Min, Sixiang Zhang, Min YuList of authors in order
- Landing page
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https://doi.org/10.3390/pr11020627Publisher landing page
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https://www.mdpi.com/2227-9717/11/2/627/pdf?version=1676971362Direct link to full text PDF
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- OA status
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goldOpen access status per OpenAlex
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https://www.mdpi.com/2227-9717/11/2/627/pdf?version=1676971362Direct OA link when available
- Concepts
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Detector, Wire bonding, Silicon, Materials science, Reliability (semiconductor), Optoelectronics, Crosstalk, Through-silicon via, Electronic engineering, Computer science, Engineering physics, Electrical engineering, Engineering, Physics, Chip, Quantum mechanics, Power (physics)Top concepts (fields/topics) attached by OpenAlex
- Cited by
-
3Total citation count in OpenAlex
- Citations by year (recent)
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2025: 1, 2024: 1, 2023: 1Per-year citation counts (last 5 years)
- References (count)
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41Number of works referenced by this work
- Related works (count)
-
10Other works algorithmically related by OpenAlex
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| best_oa_location.source.host_organization_name | Multidisciplinary Digital Publishing Institute |
| best_oa_location.source.host_organization_lineage | https://openalex.org/P4310310987 |
| best_oa_location.source.host_organization_lineage_names | Multidisciplinary Digital Publishing Institute |
| best_oa_location.license | cc-by |
| best_oa_location.pdf_url | https://www.mdpi.com/2227-9717/11/2/627/pdf?version=1676971362 |
| best_oa_location.version | publishedVersion |
| best_oa_location.raw_type | journal-article |
| best_oa_location.license_id | https://openalex.org/licenses/cc-by |
| best_oa_location.is_accepted | True |
| best_oa_location.is_published | True |
| best_oa_location.raw_source_name | Processes |
| best_oa_location.landing_page_url | https://doi.org/10.3390/pr11020627 |
| primary_location.id | doi:10.3390/pr11020627 |
| primary_location.is_oa | True |
| primary_location.source.id | https://openalex.org/S4210201879 |
| primary_location.source.issn | 2227-9717 |
| primary_location.source.type | journal |
| primary_location.source.is_oa | True |
| primary_location.source.issn_l | 2227-9717 |
| primary_location.source.is_core | True |
| primary_location.source.is_in_doaj | False |
| primary_location.source.display_name | Processes |
| primary_location.source.host_organization | https://openalex.org/P4310310987 |
| primary_location.source.host_organization_name | Multidisciplinary Digital Publishing Institute |
| primary_location.source.host_organization_lineage | https://openalex.org/P4310310987 |
| primary_location.source.host_organization_lineage_names | Multidisciplinary Digital Publishing Institute |
| primary_location.license | cc-by |
| primary_location.pdf_url | https://www.mdpi.com/2227-9717/11/2/627/pdf?version=1676971362 |
| primary_location.version | publishedVersion |
| primary_location.raw_type | journal-article |
| primary_location.license_id | https://openalex.org/licenses/cc-by |
| primary_location.is_accepted | True |
| primary_location.is_published | True |
| primary_location.raw_source_name | Processes |
| primary_location.landing_page_url | https://doi.org/10.3390/pr11020627 |
| publication_date | 2023-02-18 |
| publication_year | 2023 |
| referenced_works | https://openalex.org/W6995760532, https://openalex.org/W2592764958, https://openalex.org/W2242023958, https://openalex.org/W2026990490, https://openalex.org/W1978983484, https://openalex.org/W2006921968, https://openalex.org/W3185560914, https://openalex.org/W2783728014, https://openalex.org/W1992743617, https://openalex.org/W1981885961, https://openalex.org/W1969209202, https://openalex.org/W2318561878, https://openalex.org/W2322261850, https://openalex.org/W2036054168, https://openalex.org/W1991375580, https://openalex.org/W1963890763, https://openalex.org/W2353416906, https://openalex.org/W2036579206, https://openalex.org/W2384240935, https://openalex.org/W6673550101, https://openalex.org/W1993126309, https://openalex.org/W4233340483, https://openalex.org/W2001024637, https://openalex.org/W2153689344, https://openalex.org/W6664720620, https://openalex.org/W2164271668, https://openalex.org/W1996128645, https://openalex.org/W2508287539, https://openalex.org/W4213357087, https://openalex.org/W2746807507, https://openalex.org/W2331715794, https://openalex.org/W2112161471, https://openalex.org/W2057390751, https://openalex.org/W2894884921, https://openalex.org/W2094273959, https://openalex.org/W2427433428, https://openalex.org/W2793572678, https://openalex.org/W2003490788, https://openalex.org/W2093333193, https://openalex.org/W2056297986, https://openalex.org/W2379945399 |
| referenced_works_count | 41 |
| abstract_inverted_index.a | 78 |
| abstract_inverted_index.Al | 73 |
| abstract_inverted_index.an | 64 |
| abstract_inverted_index.as | 12 |
| abstract_inverted_index.of | 4, 33, 44, 67, 88 |
| abstract_inverted_index.on | 25, 57, 84 |
| abstract_inverted_index.to | 76, 81 |
| abstract_inverted_index.PIN | 6, 37, 91 |
| abstract_inverted_index.and | 17, 35, 50 |
| abstract_inverted_index.are | 39 |
| abstract_inverted_index.for | 29 |
| abstract_inverted_index.the | 1, 31, 42, 54, 85 |
| abstract_inverted_index.dead | 19 |
| abstract_inverted_index.poor | 15 |
| abstract_inverted_index.such | 11 |
| abstract_inverted_index.thin | 36 |
| abstract_inverted_index.this | 61 |
| abstract_inverted_index.with | 41, 53 |
| abstract_inverted_index.Novel | 21 |
| abstract_inverted_index.based | 24 |
| abstract_inverted_index.faces | 9 |
| abstract_inverted_index.metal | 26, 58, 68, 72 |
| abstract_inverted_index.paper | 62 |
| abstract_inverted_index.thick | 18, 34 |
| abstract_inverted_index.future | 82 |
| abstract_inverted_index.method | 3 |
| abstract_inverted_index.needed | 40 |
| abstract_inverted_index.review | 66 |
| abstract_inverted_index.signal | 46 |
| abstract_inverted_index.volume | 49 |
| abstract_inverted_index.bonding | 27, 59, 69, 74, 86 |
| abstract_inverted_index.certain | 79 |
| abstract_inverted_index.complex | 13 |
| abstract_inverted_index.current | 55 |
| abstract_inverted_index.layers. | 20 |
| abstract_inverted_index.methods | 23 |
| abstract_inverted_index.package | 48 |
| abstract_inverted_index.provide | 77 |
| abstract_inverted_index.silicon | 5, 90 |
| abstract_inverted_index.weight. | 51 |
| abstract_inverted_index.Combined | 52 |
| abstract_inverted_index.detector | 92 |
| abstract_inverted_index.devices. | 93 |
| abstract_inverted_index.presents | 63 |
| abstract_inverted_index.reducing | 45 |
| abstract_inverted_index.research | 56, 83 |
| abstract_inverted_index.detectors | 8, 38 |
| abstract_inverted_index.extensive | 65 |
| abstract_inverted_index.radiation | 7 |
| abstract_inverted_index.realizing | 30 |
| abstract_inverted_index.reference | 80 |
| abstract_inverted_index.Currently, | 0 |
| abstract_inverted_index.challenges | 10 |
| abstract_inverted_index.crosstalk, | 47 |
| abstract_inverted_index.especially | 71 |
| abstract_inverted_index.processes, | 14 |
| abstract_inverted_index.processing | 87 |
| abstract_inverted_index.technology | 28 |
| abstract_inverted_index.integration | 2, 22, 32 |
| abstract_inverted_index.reliability | 16 |
| abstract_inverted_index.requirement | 43 |
| abstract_inverted_index.technology, | 60, 70, 75 |
| abstract_inverted_index.high-performance | 89 |
| cited_by_percentile_year.max | 95 |
| cited_by_percentile_year.min | 89 |
| corresponding_author_ids | https://openalex.org/A5103277287, https://openalex.org/A5101860335 |
| countries_distinct_count | 1 |
| institutions_distinct_count | 5 |
| corresponding_institution_ids | https://openalex.org/I142108993, https://openalex.org/I20231570 |
| citation_normalized_percentile.value | 0.61149175 |
| citation_normalized_percentile.is_in_top_1_percent | False |
| citation_normalized_percentile.is_in_top_10_percent | False |