Cascaded die mountings with spring-loaded contact-bond options Article Swipe
Related Concepts
Spring (device)
Bond
Die (integrated circuit)
Materials science
Engineering
Nanotechnology
Structural engineering
Economics
Finance
J.S. Hsu
,
D.J. Adams
,
Gui-Jia Su
,
Laura D. Marlino
,
C.W. Ayers
,
Chester Coomer
·
YOU?
·
· 2023
· Open Access
·
· OA: W4302972723
YOU?
·
· 2023
· Open Access
·
· OA: W4302972723
A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.
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