Effects of Bonding Materials on Optical–Thermal Performances and High-Temperature Reliability of High-Power LED Article Swipe
YOU?
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· 2022
· Open Access
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· DOI: https://doi.org/10.3390/mi13060958
The die-bonding layer between chips and substrate determinates the heat conduction efficiency of high-power LED. Sn-based solder, AuSn20 eutectic, and nano-Ag paste were widely applied to LED interconnection. In this paper, the optical–thermal performances and high-temperature reliability of LED with these bonding materials have systematically compared and studied. The thermal conductivity, electrical resistivity, and mechanical property of these bonding materials were characterized. The LED module packaged with nano-Ag has a minimum working temperature of 21.5 °C. The total thermal resistance of LED packaged with nano-Ag, Au80Sn20, and SAC305 is 4.82, 7.84, and 8.75 K/W, respectively, which is 4.72, 6.14, and 7.84 K/W higher after aging for 500 h. Meanwhile, the junction temperature change of these LEDs increases from 2.33, 3.76, and 4.25 °C to 4.34, 4.81, and 6.41 °C after aging, respectively. The thermal resistance of the nano-Ag, Au80Sn20 and SAC305 layer after aging is 1.5%, 65.7%, and 151.5% higher than before aging, respectively. After aging, the LED bonded with nano-Ag has the better optical performances in spectral intensity and light output power, which indicates its excellent heat dissipation can improve the light efficiency. These results demonstrate the nano-Ag bonding material could enhance the optical-thermal performances and high-temperature reliability of high-power LED.
Related Topics
- Type
- article
- Language
- en
- Landing Page
- https://doi.org/10.3390/mi13060958
- https://www.mdpi.com/2072-666X/13/6/958/pdf?version=1655445471
- OA Status
- gold
- Cited By
- 11
- References
- 22
- Related Works
- 10
- OpenAlex ID
- https://openalex.org/W4283019205
Raw OpenAlex JSON
- OpenAlex ID
-
https://openalex.org/W4283019205Canonical identifier for this work in OpenAlex
- DOI
-
https://doi.org/10.3390/mi13060958Digital Object Identifier
- Title
-
Effects of Bonding Materials on Optical–Thermal Performances and High-Temperature Reliability of High-Power LEDWork title
- Type
-
articleOpenAlex work type
- Language
-
enPrimary language
- Publication year
-
2022Year of publication
- Publication date
-
2022-06-17Full publication date if available
- Authors
-
Jiaxin Liu, Yun Mou, Yueming Huang, Jiuzhou Zhao, Yang Peng, Mingxiang ChenList of authors in order
- Landing page
-
https://doi.org/10.3390/mi13060958Publisher landing page
- PDF URL
-
https://www.mdpi.com/2072-666X/13/6/958/pdf?version=1655445471Direct link to full text PDF
- Open access
-
YesWhether a free full text is available
- OA status
-
goldOpen access status per OpenAlex
- OA URL
-
https://www.mdpi.com/2072-666X/13/6/958/pdf?version=1655445471Direct OA link when available
- Concepts
-
Materials science, Junction temperature, Thermal resistance, Eutectic system, Light-emitting diode, Thermal conductivity, Thermal management of high-power LEDs, Nano-, Composite material, Optoelectronics, Reliability (semiconductor), Interconnection, Soldering, Thermal, Power (physics), Alloy, Physics, Meteorology, Quantum mechanics, Computer science, Computer networkTop concepts (fields/topics) attached by OpenAlex
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-
11Total citation count in OpenAlex
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2025: 3, 2024: 3, 2023: 3, 2022: 2Per-year citation counts (last 5 years)
- References (count)
-
22Number of works referenced by this work
- Related works (count)
-
10Other works algorithmically related by OpenAlex
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