Encapsulant Void Breakdown Voltage Modeling & Experiments Article Swipe
Christopher Moore
,
Paul G. Clem
,
Laura Biedermann
,
William V. Miller
,
Mark E. Stavig
,
Christian Turner
·
YOU?
·
· 2020
· Open Access
·
· DOI: https://doi.org/10.2172/1808742
YOU?
·
· 2020
· Open Access
·
· DOI: https://doi.org/10.2172/1808742
For high voltage electrical devices, prevention of high voltage breakdown is critical for device function. Use of polymeric encapsulation such as epoxies is common, but these may include air bubbles or other voids of varying size. The present work aimed to model and experimentally determine the size dependence of breakdown voltage for voids in an epoxy matrix, as a step toward establishing size criteria for void screening. Effects were investigated experimentally for both one-dimensional metal/epoxy/air/epoxy/metal gap sizes from 50 μm to 10 mm, as well as spherical voids of 250 μm, 500 μm, 1 mm and 2 mm sizes. These experimental results were compared to modified Paschen curve and particle-in-cell discharge models; minimum breakdown voltages of 6 - 8.5 kV appeared to be predicted by 1D models and experiments, with minimum breakdown voltage for void sizes of 0.2 - 1 mm. In a limited set of 3D experiments on 250 μm, 500 μm, 1 mm and 2 mm voids within epoxy, the minimum breakdown voltages observed were 18.5 - 20 kV, for 500 μm void sizes. These experiments and models are aimed at providing initial size and voltage criteria for tolerable void sizes and expected discharge voltages to support design of encapsulated high voltage components.
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Metadata
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- en
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- https://doi.org/10.2172/1808742
- OA Status
- green
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- https://openalex.org/W3202240117
All OpenAlex metadata
Raw OpenAlex JSON
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https://openalex.org/W3202240117Canonical identifier for this work in OpenAlex
- DOI
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https://doi.org/10.2172/1808742Digital Object Identifier
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Encapsulant Void Breakdown Voltage Modeling & ExperimentsWork title
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reportOpenAlex work type
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enPrimary language
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2020Year of publication
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2020-11-01Full publication date if available
- Authors
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Christopher Moore, Paul G. Clem, Laura Biedermann, William V. Miller, Mark E. Stavig, Christian TurnerList of authors in order
- Landing page
-
https://doi.org/10.2172/1808742Publisher landing page
- Open access
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YesWhether a free full text is available
- OA status
-
greenOpen access status per OpenAlex
- OA URL
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https://www.osti.gov/biblio/1808742Direct OA link when available
- Concepts
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Void (composites), Materials science, Composite materialTop concepts (fields/topics) attached by OpenAlex
- Cited by
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0Total citation count in OpenAlex
- Related works (count)
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10Other works algorithmically related by OpenAlex
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| abstract_inverted_index.providing | 183 |
| abstract_inverted_index.spherical | 86 |
| abstract_inverted_index.tolerable | 190 |
| abstract_inverted_index.dependence | 47 |
| abstract_inverted_index.electrical | 3 |
| abstract_inverted_index.prevention | 5 |
| abstract_inverted_index.screening. | 66 |
| abstract_inverted_index.components. | 204 |
| abstract_inverted_index.experiments | 147, 177 |
| abstract_inverted_index.encapsulated | 201 |
| abstract_inverted_index.establishing | 61 |
| abstract_inverted_index.experimental | 100 |
| abstract_inverted_index.experiments, | 128 |
| abstract_inverted_index.investigated | 69 |
| abstract_inverted_index.encapsulation | 18 |
| abstract_inverted_index.experimentally | 43, 70 |
| abstract_inverted_index.one-dimensional | 73 |
| abstract_inverted_index.particle-in-cell | 109 |
| abstract_inverted_index.metal/epoxy/air/epoxy/metal | 74 |
| cited_by_percentile_year | |
| countries_distinct_count | 1 |
| institutions_distinct_count | 6 |
| citation_normalized_percentile |