Frequency- and bandwidth-controllable electromagnetic absorber using 3D-printed shape memory meta-wires Article Swipe
Kyounghwan Kim
,
Yelim Kim
,
Eiyong Park
,
Heijun Jeong
,
Sungjoon Lim
·
YOU?
·
· 2024
· Open Access
·
· DOI: https://doi.org/10.1080/17452759.2024.2351143
YOU?
·
· 2024
· Open Access
·
· DOI: https://doi.org/10.1080/17452759.2024.2351143
A metamaterial can be used for fabricating an electromagnetic absorber by tailoring its effective permittivity and permeability. In general, a metamaterial absorber works at a specific resonant frequency, and its absorption frequency does not change after the structure is fabricated. A three-dimensionally (3D)-printed shape memory polymer (SMP) is a potential candidate for overcoming this limitation and realising reconfigurability with its fabrication versatility. In this work, we propose a frequency – and bandwidth-controllable electromagnetic absorber using 3D-printed shape memory meta-wires (SMMWs). Unlike the conventional usage of SMPs with two states, thermally deformable SMMWs have three different modes that are realised by controlling the states of each column. Multi-material additive manufacturing is used to print the SMMW, with an SMP substrate and a high-temperature filament being the materials that are printed. The high absorptivity and frequency – and bandwidth-tuning capability are numerically and experimentally demonstrated for three different modes.
Related Topics
Concepts
Metadata
- Type
- article
- Language
- en
- Landing Page
- https://doi.org/10.1080/17452759.2024.2351143
- https://www.tandfonline.com/doi/pdf/10.1080/17452759.2024.2351143?needAccess=true
- OA Status
- gold
- Cited By
- 9
- References
- 49
- Related Works
- 10
- OpenAlex ID
- https://openalex.org/W4398237913
All OpenAlex metadata
Raw OpenAlex JSON
- OpenAlex ID
-
https://openalex.org/W4398237913Canonical identifier for this work in OpenAlex
- DOI
-
https://doi.org/10.1080/17452759.2024.2351143Digital Object Identifier
- Title
-
Frequency- and bandwidth-controllable electromagnetic absorber using 3D-printed shape memory meta-wiresWork title
- Type
-
articleOpenAlex work type
- Language
-
enPrimary language
- Publication year
-
2024Year of publication
- Publication date
-
2024-05-23Full publication date if available
- Authors
-
Kyounghwan Kim, Yelim Kim, Eiyong Park, Heijun Jeong, Sungjoon LimList of authors in order
- Landing page
-
https://doi.org/10.1080/17452759.2024.2351143Publisher landing page
- PDF URL
-
https://www.tandfonline.com/doi/pdf/10.1080/17452759.2024.2351143?needAccess=trueDirect link to full text PDF
- Open access
-
YesWhether a free full text is available
- OA status
-
goldOpen access status per OpenAlex
- OA URL
-
https://www.tandfonline.com/doi/pdf/10.1080/17452759.2024.2351143?needAccess=trueDirect OA link when available
- Concepts
-
3d printed, Bandwidth (computing), Materials science, Shape-memory alloy, Acoustics, Electronic engineering, Engineering, Composite material, Telecommunications, Physics, Biomedical engineeringTop concepts (fields/topics) attached by OpenAlex
- Cited by
-
9Total citation count in OpenAlex
- Citations by year (recent)
-
2025: 5, 2024: 4Per-year citation counts (last 5 years)
- References (count)
-
49Number of works referenced by this work
- Related works (count)
-
10Other works algorithmically related by OpenAlex
Full payload
| id | https://openalex.org/W4398237913 |
|---|---|
| doi | https://doi.org/10.1080/17452759.2024.2351143 |
| ids.doi | https://doi.org/10.1080/17452759.2024.2351143 |
| ids.openalex | https://openalex.org/W4398237913 |
| fwci | 1.92674766 |
| type | article |
| title | Frequency- and bandwidth-controllable electromagnetic absorber using 3D-printed shape memory meta-wires |
| awards[0].id | https://openalex.org/G203014104 |
| awards[0].funder_id | https://openalex.org/F4320321202 |
| awards[0].display_name | |
| awards[0].funder_award_id | 2021 |
| awards[0].funder_display_name | Chung-Ang University |
| awards[1].id | https://openalex.org/G2576072199 |
| awards[1].funder_id | https://openalex.org/F4320322120 |
| awards[1].display_name | |
| awards[1].funder_award_id | 2021R1A2C3005239 |
| awards[1].funder_display_name | National Research Foundation of Korea |
| awards[2].id | https://openalex.org/G6826179063 |
| awards[2].funder_id | https://openalex.org/F4320335489 |
| awards[2].display_name | |
| awards[2].funder_award_id | IITP-2023-RS-2022-00156353 |
| awards[2].funder_display_name | Institute for Information and Communications Technology Promotion |
| biblio.issue | 1 |
| biblio.volume | 19 |
| biblio.last_page | |
| biblio.first_page | |
| topics[0].id | https://openalex.org/T10245 |
| topics[0].field.id | https://openalex.org/fields/25 |
| topics[0].field.display_name | Materials Science |
| topics[0].score | 0.9930999875068665 |
| topics[0].domain.id | https://openalex.org/domains/3 |
| topics[0].domain.display_name | Physical Sciences |
| topics[0].subfield.id | https://openalex.org/subfields/2504 |
| topics[0].subfield.display_name | Electronic, Optical and Magnetic Materials |
| topics[0].display_name | Metamaterials and Metasurfaces Applications |
| topics[1].id | https://openalex.org/T11383 |
| topics[1].field.id | https://openalex.org/fields/22 |
| topics[1].field.display_name | Engineering |
| topics[1].score | 0.9781000018119812 |
| topics[1].domain.id | https://openalex.org/domains/3 |
| topics[1].domain.display_name | Physical Sciences |
| topics[1].subfield.id | https://openalex.org/subfields/2202 |
| topics[1].subfield.display_name | Aerospace Engineering |
| topics[1].display_name | Advanced Antenna and Metasurface Technologies |
| topics[2].id | https://openalex.org/T11737 |
| topics[2].field.id | https://openalex.org/fields/22 |
| topics[2].field.display_name | Engineering |
| topics[2].score | 0.9648000001907349 |
| topics[2].domain.id | https://openalex.org/domains/3 |
| topics[2].domain.display_name | Physical Sciences |
| topics[2].subfield.id | https://openalex.org/subfields/2210 |
| topics[2].subfield.display_name | Mechanical Engineering |
| topics[2].display_name | Advanced Materials and Mechanics |
| funders[0].id | https://openalex.org/F4320321202 |
| funders[0].ror | https://ror.org/01r024a98 |
| funders[0].display_name | Chung-Ang University |
| funders[1].id | https://openalex.org/F4320322120 |
| funders[1].ror | https://ror.org/013aysd81 |
| funders[1].display_name | National Research Foundation of Korea |
| funders[2].id | https://openalex.org/F4320335489 |
| funders[2].ror | https://ror.org/01g0hqq23 |
| funders[2].display_name | Institute for Information and Communications Technology Promotion |
| is_xpac | False |
| apc_list.value | 2825 |
| apc_list.currency | AUD |
| apc_list.value_usd | 2070 |
| apc_paid.value | 2825 |
| apc_paid.currency | AUD |
| apc_paid.value_usd | 2070 |
| concepts[0].id | https://openalex.org/C3019308078 |
| concepts[0].level | 2 |
| concepts[0].score | 0.7959102392196655 |
| concepts[0].wikidata | https://www.wikidata.org/wiki/Q229367 |
| concepts[0].display_name | 3d printed |
| concepts[1].id | https://openalex.org/C2776257435 |
| concepts[1].level | 2 |
| concepts[1].score | 0.6149410605430603 |
| concepts[1].wikidata | https://www.wikidata.org/wiki/Q1576430 |
| concepts[1].display_name | Bandwidth (computing) |
| concepts[2].id | https://openalex.org/C192562407 |
| concepts[2].level | 0 |
| concepts[2].score | 0.5774581432342529 |
| concepts[2].wikidata | https://www.wikidata.org/wiki/Q228736 |
| concepts[2].display_name | Materials science |
| concepts[3].id | https://openalex.org/C49097943 |
| concepts[3].level | 2 |
| concepts[3].score | 0.43887490034103394 |
| concepts[3].wikidata | https://www.wikidata.org/wiki/Q898455 |
| concepts[3].display_name | Shape-memory alloy |
| concepts[4].id | https://openalex.org/C24890656 |
| concepts[4].level | 1 |
| concepts[4].score | 0.4166601300239563 |
| concepts[4].wikidata | https://www.wikidata.org/wiki/Q82811 |
| concepts[4].display_name | Acoustics |
| concepts[5].id | https://openalex.org/C24326235 |
| concepts[5].level | 1 |
| concepts[5].score | 0.34312376379966736 |
| concepts[5].wikidata | https://www.wikidata.org/wiki/Q126095 |
| concepts[5].display_name | Electronic engineering |
| concepts[6].id | https://openalex.org/C127413603 |
| concepts[6].level | 0 |
| concepts[6].score | 0.3388078212738037 |
| concepts[6].wikidata | https://www.wikidata.org/wiki/Q11023 |
| concepts[6].display_name | Engineering |
| concepts[7].id | https://openalex.org/C159985019 |
| concepts[7].level | 1 |
| concepts[7].score | 0.2110053300857544 |
| concepts[7].wikidata | https://www.wikidata.org/wiki/Q181790 |
| concepts[7].display_name | Composite material |
| concepts[8].id | https://openalex.org/C76155785 |
| concepts[8].level | 1 |
| concepts[8].score | 0.16543400287628174 |
| concepts[8].wikidata | https://www.wikidata.org/wiki/Q418 |
| concepts[8].display_name | Telecommunications |
| concepts[9].id | https://openalex.org/C121332964 |
| concepts[9].level | 0 |
| concepts[9].score | 0.12547603249549866 |
| concepts[9].wikidata | https://www.wikidata.org/wiki/Q413 |
| concepts[9].display_name | Physics |
| concepts[10].id | https://openalex.org/C136229726 |
| concepts[10].level | 1 |
| concepts[10].score | 0.0 |
| concepts[10].wikidata | https://www.wikidata.org/wiki/Q327092 |
| concepts[10].display_name | Biomedical engineering |
| keywords[0].id | https://openalex.org/keywords/3d-printed |
| keywords[0].score | 0.7959102392196655 |
| keywords[0].display_name | 3d printed |
| keywords[1].id | https://openalex.org/keywords/bandwidth |
| keywords[1].score | 0.6149410605430603 |
| keywords[1].display_name | Bandwidth (computing) |
| keywords[2].id | https://openalex.org/keywords/materials-science |
| keywords[2].score | 0.5774581432342529 |
| keywords[2].display_name | Materials science |
| keywords[3].id | https://openalex.org/keywords/shape-memory-alloy |
| keywords[3].score | 0.43887490034103394 |
| keywords[3].display_name | Shape-memory alloy |
| keywords[4].id | https://openalex.org/keywords/acoustics |
| keywords[4].score | 0.4166601300239563 |
| keywords[4].display_name | Acoustics |
| keywords[5].id | https://openalex.org/keywords/electronic-engineering |
| keywords[5].score | 0.34312376379966736 |
| keywords[5].display_name | Electronic engineering |
| keywords[6].id | https://openalex.org/keywords/engineering |
| keywords[6].score | 0.3388078212738037 |
| keywords[6].display_name | Engineering |
| keywords[7].id | https://openalex.org/keywords/composite-material |
| keywords[7].score | 0.2110053300857544 |
| keywords[7].display_name | Composite material |
| keywords[8].id | https://openalex.org/keywords/telecommunications |
| keywords[8].score | 0.16543400287628174 |
| keywords[8].display_name | Telecommunications |
| keywords[9].id | https://openalex.org/keywords/physics |
| keywords[9].score | 0.12547603249549866 |
| keywords[9].display_name | Physics |
| language | en |
| locations[0].id | doi:10.1080/17452759.2024.2351143 |
| locations[0].is_oa | True |
| locations[0].source.id | https://openalex.org/S152936027 |
| locations[0].source.issn | 1745-2759, 1745-2767 |
| locations[0].source.type | journal |
| locations[0].source.is_oa | True |
| locations[0].source.issn_l | 1745-2759 |
| locations[0].source.is_core | True |
| locations[0].source.is_in_doaj | True |
| locations[0].source.display_name | Virtual and Physical Prototyping |
| locations[0].source.host_organization | https://openalex.org/P4310320547 |
| locations[0].source.host_organization_name | Taylor & Francis |
| locations[0].source.host_organization_lineage | https://openalex.org/P4310320547 |
| locations[0].source.host_organization_lineage_names | Taylor & Francis |
| locations[0].license | |
| locations[0].pdf_url | https://www.tandfonline.com/doi/pdf/10.1080/17452759.2024.2351143?needAccess=true |
| locations[0].version | publishedVersion |
| locations[0].raw_type | journal-article |
| locations[0].license_id | |
| locations[0].is_accepted | True |
| locations[0].is_published | True |
| locations[0].raw_source_name | Virtual and Physical Prototyping |
| locations[0].landing_page_url | https://doi.org/10.1080/17452759.2024.2351143 |
| locations[1].id | pmh:oai:doaj.org/article:f2c8edfd43cd4ca79d49009dba52db26 |
| locations[1].is_oa | False |
| locations[1].source.id | https://openalex.org/S4306401280 |
| locations[1].source.issn | |
| locations[1].source.type | repository |
| locations[1].source.is_oa | False |
| locations[1].source.issn_l | |
| locations[1].source.is_core | False |
| locations[1].source.is_in_doaj | False |
| locations[1].source.display_name | DOAJ (DOAJ: Directory of Open Access Journals) |
| locations[1].source.host_organization | |
| locations[1].source.host_organization_name | |
| locations[1].license | |
| locations[1].pdf_url | |
| locations[1].version | submittedVersion |
| locations[1].raw_type | article |
| locations[1].license_id | |
| locations[1].is_accepted | False |
| locations[1].is_published | False |
| locations[1].raw_source_name | Virtual and Physical Prototyping, Vol 19, Iss 1 (2024) |
| locations[1].landing_page_url | https://doaj.org/article/f2c8edfd43cd4ca79d49009dba52db26 |
| indexed_in | crossref, doaj |
| authorships[0].author.id | https://openalex.org/A5047021792 |
| authorships[0].author.orcid | https://orcid.org/0009-0004-6740-8884 |
| authorships[0].author.display_name | Kyounghwan Kim |
| authorships[0].countries | KR |
| authorships[0].affiliations[0].institution_ids | https://openalex.org/I67900169 |
| authorships[0].affiliations[0].raw_affiliation_string | Department of Intelligent Semiconductor Engineering, Chung-Ang University, Seoul, Republic of Korea |
| authorships[0].institutions[0].id | https://openalex.org/I67900169 |
| authorships[0].institutions[0].ror | https://ror.org/01r024a98 |
| authorships[0].institutions[0].type | education |
| authorships[0].institutions[0].lineage | https://openalex.org/I67900169 |
| authorships[0].institutions[0].country_code | KR |
| authorships[0].institutions[0].display_name | Chung-Ang University |
| authorships[0].author_position | first |
| authorships[0].raw_author_name | Kyounghwan Kim |
| authorships[0].is_corresponding | False |
| authorships[0].raw_affiliation_strings | Department of Intelligent Semiconductor Engineering, Chung-Ang University, Seoul, Republic of Korea |
| authorships[1].author.id | https://openalex.org/A5069603555 |
| authorships[1].author.orcid | https://orcid.org/0009-0009-1254-2863 |
| authorships[1].author.display_name | Yelim Kim |
| authorships[1].countries | KR |
| authorships[1].affiliations[0].institution_ids | https://openalex.org/I67900169 |
| authorships[1].affiliations[0].raw_affiliation_string | School of Electrical and Electronics Engineering, Chung-Ang University, Seoul, Republic of Korea |
| authorships[1].institutions[0].id | https://openalex.org/I67900169 |
| authorships[1].institutions[0].ror | https://ror.org/01r024a98 |
| authorships[1].institutions[0].type | education |
| authorships[1].institutions[0].lineage | https://openalex.org/I67900169 |
| authorships[1].institutions[0].country_code | KR |
| authorships[1].institutions[0].display_name | Chung-Ang University |
| authorships[1].author_position | middle |
| authorships[1].raw_author_name | Yelim Kim |
| authorships[1].is_corresponding | False |
| authorships[1].raw_affiliation_strings | School of Electrical and Electronics Engineering, Chung-Ang University, Seoul, Republic of Korea |
| authorships[2].author.id | https://openalex.org/A5083094792 |
| authorships[2].author.orcid | |
| authorships[2].author.display_name | Eiyong Park |
| authorships[2].countries | KR |
| authorships[2].affiliations[0].institution_ids | https://openalex.org/I67900169 |
| authorships[2].affiliations[0].raw_affiliation_string | School of Electrical and Electronics Engineering, Chung-Ang University, Seoul, Republic of Korea |
| authorships[2].institutions[0].id | https://openalex.org/I67900169 |
| authorships[2].institutions[0].ror | https://ror.org/01r024a98 |
| authorships[2].institutions[0].type | education |
| authorships[2].institutions[0].lineage | https://openalex.org/I67900169 |
| authorships[2].institutions[0].country_code | KR |
| authorships[2].institutions[0].display_name | Chung-Ang University |
| authorships[2].author_position | middle |
| authorships[2].raw_author_name | Eiyong Park |
| authorships[2].is_corresponding | False |
| authorships[2].raw_affiliation_strings | School of Electrical and Electronics Engineering, Chung-Ang University, Seoul, Republic of Korea |
| authorships[3].author.id | https://openalex.org/A5002982177 |
| authorships[3].author.orcid | https://orcid.org/0000-0001-5179-817X |
| authorships[3].author.display_name | Heijun Jeong |
| authorships[3].countries | US |
| authorships[3].affiliations[0].institution_ids | https://openalex.org/I86501945 |
| authorships[3].affiliations[0].raw_affiliation_string | Department of Electrical and Computer Engineering, University of Delaware, Newark, DE, USA |
| authorships[3].institutions[0].id | https://openalex.org/I86501945 |
| authorships[3].institutions[0].ror | https://ror.org/01sbq1a82 |
| authorships[3].institutions[0].type | education |
| authorships[3].institutions[0].lineage | https://openalex.org/I86501945 |
| authorships[3].institutions[0].country_code | US |
| authorships[3].institutions[0].display_name | University of Delaware |
| authorships[3].author_position | middle |
| authorships[3].raw_author_name | Heijun Jeong |
| authorships[3].is_corresponding | False |
| authorships[3].raw_affiliation_strings | Department of Electrical and Computer Engineering, University of Delaware, Newark, DE, USA |
| authorships[4].author.id | https://openalex.org/A5006339259 |
| authorships[4].author.orcid | https://orcid.org/0000-0002-5049-9300 |
| authorships[4].author.display_name | Sungjoon Lim |
| authorships[4].countries | KR |
| authorships[4].affiliations[0].institution_ids | https://openalex.org/I67900169 |
| authorships[4].affiliations[0].raw_affiliation_string | School of Electrical and Electronics Engineering, Chung-Ang University, Seoul, Republic of Korea |
| authorships[4].affiliations[1].institution_ids | https://openalex.org/I67900169 |
| authorships[4].affiliations[1].raw_affiliation_string | Department of Intelligent Semiconductor Engineering, Chung-Ang University, Seoul, Republic of Korea |
| authorships[4].institutions[0].id | https://openalex.org/I67900169 |
| authorships[4].institutions[0].ror | https://ror.org/01r024a98 |
| authorships[4].institutions[0].type | education |
| authorships[4].institutions[0].lineage | https://openalex.org/I67900169 |
| authorships[4].institutions[0].country_code | KR |
| authorships[4].institutions[0].display_name | Chung-Ang University |
| authorships[4].author_position | last |
| authorships[4].raw_author_name | Sungjoon Lim |
| authorships[4].is_corresponding | True |
| authorships[4].raw_affiliation_strings | Department of Intelligent Semiconductor Engineering, Chung-Ang University, Seoul, Republic of Korea, School of Electrical and Electronics Engineering, Chung-Ang University, Seoul, Republic of Korea |
| has_content.pdf | True |
| has_content.grobid_xml | False |
| is_paratext | False |
| open_access.is_oa | True |
| open_access.oa_url | https://www.tandfonline.com/doi/pdf/10.1080/17452759.2024.2351143?needAccess=true |
| open_access.oa_status | gold |
| open_access.any_repository_has_fulltext | False |
| created_date | 2025-10-10T00:00:00 |
| display_name | Frequency- and bandwidth-controllable electromagnetic absorber using 3D-printed shape memory meta-wires |
| has_fulltext | False |
| is_retracted | False |
| updated_date | 2025-11-06T03:46:38.306776 |
| primary_topic.id | https://openalex.org/T10245 |
| primary_topic.field.id | https://openalex.org/fields/25 |
| primary_topic.field.display_name | Materials Science |
| primary_topic.score | 0.9930999875068665 |
| primary_topic.domain.id | https://openalex.org/domains/3 |
| primary_topic.domain.display_name | Physical Sciences |
| primary_topic.subfield.id | https://openalex.org/subfields/2504 |
| primary_topic.subfield.display_name | Electronic, Optical and Magnetic Materials |
| primary_topic.display_name | Metamaterials and Metasurfaces Applications |
| related_works | https://openalex.org/W569866225, https://openalex.org/W4317821343, https://openalex.org/W2900265245, https://openalex.org/W2056723064, https://openalex.org/W4248728923, https://openalex.org/W607830317, https://openalex.org/W2039163447, https://openalex.org/W3131570391, https://openalex.org/W653245379, https://openalex.org/W2127840721 |
| cited_by_count | 9 |
| counts_by_year[0].year | 2025 |
| counts_by_year[0].cited_by_count | 5 |
| counts_by_year[1].year | 2024 |
| counts_by_year[1].cited_by_count | 4 |
| locations_count | 2 |
| best_oa_location.id | doi:10.1080/17452759.2024.2351143 |
| best_oa_location.is_oa | True |
| best_oa_location.source.id | https://openalex.org/S152936027 |
| best_oa_location.source.issn | 1745-2759, 1745-2767 |
| best_oa_location.source.type | journal |
| best_oa_location.source.is_oa | True |
| best_oa_location.source.issn_l | 1745-2759 |
| best_oa_location.source.is_core | True |
| best_oa_location.source.is_in_doaj | True |
| best_oa_location.source.display_name | Virtual and Physical Prototyping |
| best_oa_location.source.host_organization | https://openalex.org/P4310320547 |
| best_oa_location.source.host_organization_name | Taylor & Francis |
| best_oa_location.source.host_organization_lineage | https://openalex.org/P4310320547 |
| best_oa_location.source.host_organization_lineage_names | Taylor & Francis |
| best_oa_location.license | |
| best_oa_location.pdf_url | https://www.tandfonline.com/doi/pdf/10.1080/17452759.2024.2351143?needAccess=true |
| best_oa_location.version | publishedVersion |
| best_oa_location.raw_type | journal-article |
| best_oa_location.license_id | |
| best_oa_location.is_accepted | True |
| best_oa_location.is_published | True |
| best_oa_location.raw_source_name | Virtual and Physical Prototyping |
| best_oa_location.landing_page_url | https://doi.org/10.1080/17452759.2024.2351143 |
| primary_location.id | doi:10.1080/17452759.2024.2351143 |
| primary_location.is_oa | True |
| primary_location.source.id | https://openalex.org/S152936027 |
| primary_location.source.issn | 1745-2759, 1745-2767 |
| primary_location.source.type | journal |
| primary_location.source.is_oa | True |
| primary_location.source.issn_l | 1745-2759 |
| primary_location.source.is_core | True |
| primary_location.source.is_in_doaj | True |
| primary_location.source.display_name | Virtual and Physical Prototyping |
| primary_location.source.host_organization | https://openalex.org/P4310320547 |
| primary_location.source.host_organization_name | Taylor & Francis |
| primary_location.source.host_organization_lineage | https://openalex.org/P4310320547 |
| primary_location.source.host_organization_lineage_names | Taylor & Francis |
| primary_location.license | |
| primary_location.pdf_url | https://www.tandfonline.com/doi/pdf/10.1080/17452759.2024.2351143?needAccess=true |
| primary_location.version | publishedVersion |
| primary_location.raw_type | journal-article |
| primary_location.license_id | |
| primary_location.is_accepted | True |
| primary_location.is_published | True |
| primary_location.raw_source_name | Virtual and Physical Prototyping |
| primary_location.landing_page_url | https://doi.org/10.1080/17452759.2024.2351143 |
| publication_date | 2024-05-23 |
| publication_year | 2024 |
| referenced_works | https://openalex.org/W1984943151, https://openalex.org/W2025784946, https://openalex.org/W2903106051, https://openalex.org/W2094393199, https://openalex.org/W2009333488, https://openalex.org/W2999331447, https://openalex.org/W2100174539, https://openalex.org/W4226270235, https://openalex.org/W4387496149, https://openalex.org/W1778707277, https://openalex.org/W4389384503, https://openalex.org/W2560837422, https://openalex.org/W2756227780, https://openalex.org/W2144899086, https://openalex.org/W1974223718, https://openalex.org/W2783450913, https://openalex.org/W2807342158, https://openalex.org/W4310837334, https://openalex.org/W2964480879, https://openalex.org/W2808244700, https://openalex.org/W2359116423, https://openalex.org/W3158743873, https://openalex.org/W2010167396, https://openalex.org/W2117238355, https://openalex.org/W2155494080, https://openalex.org/W3037053231, https://openalex.org/W3011502809, https://openalex.org/W3157894688, https://openalex.org/W2079422550, https://openalex.org/W2974782475, https://openalex.org/W2810140474, https://openalex.org/W2509931284, https://openalex.org/W2884739141, https://openalex.org/W3207483321, https://openalex.org/W3131702149, https://openalex.org/W3142999281, https://openalex.org/W4244569713, https://openalex.org/W4205765055, https://openalex.org/W2922999625, https://openalex.org/W2942539847, https://openalex.org/W3043348598, https://openalex.org/W4206986823, https://openalex.org/W2993858031, https://openalex.org/W2771577010, https://openalex.org/W2904133007, https://openalex.org/W2967464127, https://openalex.org/W2580767461, https://openalex.org/W4283321094, https://openalex.org/W4387661705 |
| referenced_works_count | 49 |
| abstract_inverted_index.A | 40 |
| abstract_inverted_index.a | 19, 24, 48, 67, 120 |
| abstract_inverted_index.In | 17, 62 |
| abstract_inverted_index.an | 7, 116 |
| abstract_inverted_index.at | 23 |
| abstract_inverted_index.be | 3 |
| abstract_inverted_index.by | 10, 99 |
| abstract_inverted_index.is | 38, 47, 109 |
| abstract_inverted_index.of | 84, 103 |
| abstract_inverted_index.to | 111 |
| abstract_inverted_index.we | 65 |
| abstract_inverted_index.SMP | 117 |
| abstract_inverted_index.The | 129 |
| abstract_inverted_index.and | 15, 28, 55, 70, 119, 132, 135, 140 |
| abstract_inverted_index.are | 97, 127, 138 |
| abstract_inverted_index.can | 2 |
| abstract_inverted_index.for | 5, 51, 143 |
| abstract_inverted_index.its | 12, 29, 59 |
| abstract_inverted_index.not | 33 |
| abstract_inverted_index.the | 36, 81, 101, 113, 124 |
| abstract_inverted_index.two | 87 |
| abstract_inverted_index.– | 69, 134 |
| abstract_inverted_index.SMPs | 85 |
| abstract_inverted_index.does | 32 |
| abstract_inverted_index.each | 104 |
| abstract_inverted_index.have | 92 |
| abstract_inverted_index.high | 130 |
| abstract_inverted_index.that | 96, 126 |
| abstract_inverted_index.this | 53, 63 |
| abstract_inverted_index.used | 4, 110 |
| abstract_inverted_index.with | 58, 86, 115 |
| abstract_inverted_index.(SMP) | 46 |
| abstract_inverted_index.SMMW, | 114 |
| abstract_inverted_index.SMMWs | 91 |
| abstract_inverted_index.after | 35 |
| abstract_inverted_index.being | 123 |
| abstract_inverted_index.modes | 95 |
| abstract_inverted_index.print | 112 |
| abstract_inverted_index.shape | 43, 76 |
| abstract_inverted_index.three | 93, 144 |
| abstract_inverted_index.usage | 83 |
| abstract_inverted_index.using | 74 |
| abstract_inverted_index.work, | 64 |
| abstract_inverted_index.works | 22 |
| abstract_inverted_index.Unlike | 80 |
| abstract_inverted_index.change | 34 |
| abstract_inverted_index.memory | 44, 77 |
| abstract_inverted_index.modes. | 146 |
| abstract_inverted_index.states | 102 |
| abstract_inverted_index.column. | 105 |
| abstract_inverted_index.polymer | 45 |
| abstract_inverted_index.propose | 66 |
| abstract_inverted_index.states, | 88 |
| abstract_inverted_index.(SMMWs). | 79 |
| abstract_inverted_index.absorber | 9, 21, 73 |
| abstract_inverted_index.additive | 107 |
| abstract_inverted_index.filament | 122 |
| abstract_inverted_index.general, | 18 |
| abstract_inverted_index.printed. | 128 |
| abstract_inverted_index.realised | 98 |
| abstract_inverted_index.resonant | 26 |
| abstract_inverted_index.specific | 25 |
| abstract_inverted_index.ABSTRACTA | 0 |
| abstract_inverted_index.candidate | 50 |
| abstract_inverted_index.different | 94, 145 |
| abstract_inverted_index.effective | 13 |
| abstract_inverted_index.frequency | 31, 68, 133 |
| abstract_inverted_index.materials | 125 |
| abstract_inverted_index.potential | 49 |
| abstract_inverted_index.realising | 56 |
| abstract_inverted_index.structure | 37 |
| abstract_inverted_index.substrate | 118 |
| abstract_inverted_index.tailoring | 11 |
| abstract_inverted_index.thermally | 89 |
| abstract_inverted_index.3D-printed | 75 |
| abstract_inverted_index.absorption | 30 |
| abstract_inverted_index.capability | 137 |
| abstract_inverted_index.deformable | 90 |
| abstract_inverted_index.frequency, | 27 |
| abstract_inverted_index.limitation | 54 |
| abstract_inverted_index.meta-wires | 78 |
| abstract_inverted_index.overcoming | 52 |
| abstract_inverted_index.controlling | 100 |
| abstract_inverted_index.fabricated. | 39 |
| abstract_inverted_index.fabricating | 6 |
| abstract_inverted_index.fabrication | 60 |
| abstract_inverted_index.numerically | 139 |
| abstract_inverted_index.(3D)-printed | 42 |
| abstract_inverted_index.absorptivity | 131 |
| abstract_inverted_index.conventional | 82 |
| abstract_inverted_index.demonstrated | 142 |
| abstract_inverted_index.metamaterial | 1, 20 |
| abstract_inverted_index.permittivity | 14 |
| abstract_inverted_index.versatility. | 61 |
| abstract_inverted_index.manufacturing | 108 |
| abstract_inverted_index.permeability. | 16 |
| abstract_inverted_index.Multi-material | 106 |
| abstract_inverted_index.experimentally | 141 |
| abstract_inverted_index.electromagnetic | 8, 72 |
| abstract_inverted_index.bandwidth-tuning | 136 |
| abstract_inverted_index.high-temperature | 121 |
| abstract_inverted_index.reconfigurability | 57 |
| abstract_inverted_index.three-dimensionally | 41 |
| abstract_inverted_index.bandwidth-controllable | 71 |
| cited_by_percentile_year.max | 98 |
| cited_by_percentile_year.min | 97 |
| corresponding_author_ids | https://openalex.org/A5006339259 |
| countries_distinct_count | 2 |
| institutions_distinct_count | 5 |
| corresponding_institution_ids | https://openalex.org/I67900169 |
| sustainable_development_goals[0].id | https://metadata.un.org/sdg/7 |
| sustainable_development_goals[0].score | 0.8500000238418579 |
| sustainable_development_goals[0].display_name | Affordable and clean energy |
| citation_normalized_percentile.value | 0.81082365 |
| citation_normalized_percentile.is_in_top_1_percent | False |
| citation_normalized_percentile.is_in_top_10_percent | False |