Front-end Electronics for Timing with pico-seconds precision using 3D Trench Silicon Sensors Article Swipe

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YOU? · · 2022 · Open Access · · DOI: https://doi.org/10.48550/arxiv.2209.11147

The next generation of collider experiments require tracking detectors with extreme performance capabilities in terms of spatial resolution (tens of $μ\text{m}$), radiation hardness ($10^{17}~1~$MeV n$_{eq}/$cm$^2$) and timing resolution (tens of ps). 3D silicon sensors, recently developed within the TimeSPOT initiative, offer a viable solution to cope with such demanding requirements. In order to accurately characterize the timing performance of these new sensors, several read-out boards, based on discrete active components, have been designed, assembled, and tested. The same electronics is also suitable for characterization of similar pixel sensors whenever timing performance in the order and below 10 ps is a requirement. This paper describes the general characteristics needed by front-end electronics to exploit solid-state sensors with fast timing capabilities and in particular, showcases the performance of the developed electronics in the testing and characterization of fast 3D silicon sensors.

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Electronics

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Electronics Detector Computer science Tracking (education) Characterization (materials science) Computer hardware Electrical engineering Engineering Physics Optics Telecommunications Psychology Pedagogy

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Type: preprint
Language: en
Landing Page: http://arxiv.org/abs/2209.11147
PDF: https://arxiv.org/pdf/2209.11147
OA Status: green
Related Works: 10
OpenAlex ID: https://openalex.org/W4296957600

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DOI: https://doi.org/10.48550/arxiv.2209.11147

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Title: Front-end Electronics for Timing with pico-seconds precision using 3D Trench Silicon Sensors

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Type: preprint

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Language: en

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Publication year: 2022

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Publication date: 2022-09-22

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Authors: Gian Matteo Cossu, A. Lai

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Landing page: https://arxiv.org/abs/2209.11147

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PDF URL: https://arxiv.org/pdf/2209.11147

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Concepts: Electronics, Detector, Computer science, Tracking (education), Characterization (materials science), Computer hardware, Electrical engineering, Engineering, Physics, Optics, Telecommunications, Psychology, Pedagogy

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