High throughput, spatially resolved thermal properties measurement using attachable and reusable 3ω sensors Article Swipe
Divya Chalise
,
Richard Tee
,
Yuqiang Zeng
,
Sumanjeet Kaur
,
Himanshu Pokharna
,
Ravi Prasher
·
YOU?
·
· 2023
· Open Access
·
· DOI: https://doi.org/10.1063/5.0151160
YOU?
·
· 2023
· Open Access
·
· DOI: https://doi.org/10.1063/5.0151160
The 3ω method is a well-established thermal technique used to measure the thermal conductivity of materials and the thermal resistance of interfaces. It has significant advantages over other steady state and transient thermal techniques in its ability to provide spatially resolved thermal property measurements over a wide range of thermal conductivity. Despite its advantages, it has been restricted to lab-scale use because of the difficulty involved in sample preparation and sensor fabrication and is limited to non-metallic substrates. High-throughput 3ω measurements with reusable sensors have not been realized yet. In this work, we demonstrate a method of applying reusable 3ω sensors fabricated on flexible polyimide films to measure bulk and spatially resolved thermal properties. We establish the limits of thermal conductivity measurement with the method to be 1 to 200 W/mK, and within the measurement limit, we verify the method by comparing the measured thermal conductivities of standard samples with established values. From the 3ω measurements, we also determine the thermal resistance of an interlayer of thermal grease as a function of pressure and compare it against the resistance calculated from direct thickness measurements to demonstrate the ability of this method to provide spatially resolved subsurface information. The technique presented is general and applicable to both metallic and non-metallic substrates, providing a method for high-throughput 3ω measurements with reusable sensors and without considerable sample preparation.
Related Topics
Concepts
Materials science
Thermal conductivity
Fabrication
Thermal conductivity measurement
Thermal
Thermal resistance
Throughput
Transient (computer programming)
Optoelectronics
Work (physics)
Composite material
Computer science
Mechanical engineering
Thermodynamics
Telecommunications
Operating system
Pathology
Physics
Alternative medicine
Wireless
Engineering
Medicine
Metadata
- Type
- article
- Language
- en
- Landing Page
- https://doi.org/10.1063/5.0151160
- OA Status
- green
- Cited By
- 4
- References
- 19
- Related Works
- 10
- OpenAlex ID
- https://openalex.org/W4386496976
All OpenAlex metadata
Raw OpenAlex JSON
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https://openalex.org/W4386496976Canonical identifier for this work in OpenAlex
- DOI
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https://doi.org/10.1063/5.0151160Digital Object Identifier
- Title
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High throughput, spatially resolved thermal properties measurement using attachable and reusable 3ω sensorsWork title
- Type
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articleOpenAlex work type
- Language
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enPrimary language
- Publication year
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2023Year of publication
- Publication date
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2023-09-01Full publication date if available
- Authors
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Divya Chalise, Richard Tee, Yuqiang Zeng, Sumanjeet Kaur, Himanshu Pokharna, Ravi PrasherList of authors in order
- Landing page
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https://doi.org/10.1063/5.0151160Publisher landing page
- Open access
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YesWhether a free full text is available
- OA status
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greenOpen access status per OpenAlex
- OA URL
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https://www.osti.gov/biblio/2294068Direct OA link when available
- Concepts
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Materials science, Thermal conductivity, Fabrication, Thermal conductivity measurement, Thermal, Thermal resistance, Throughput, Transient (computer programming), Optoelectronics, Work (physics), Composite material, Computer science, Mechanical engineering, Thermodynamics, Telecommunications, Operating system, Pathology, Physics, Alternative medicine, Wireless, Engineering, MedicineTop concepts (fields/topics) attached by OpenAlex
- Cited by
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4Total citation count in OpenAlex
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2025: 4Per-year citation counts (last 5 years)
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10Other works algorithmically related by OpenAlex
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