Hybrid integration of deterministic quantum dots-based single-photon sources with CMOS-compatible silicon carbide photonics Article Swipe
YOU?
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· 2022
· Open Access
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· DOI: https://doi.org/10.48550/arxiv.2203.12202
Thin film 4H-silicon carbide (4H-SiC) is emerging as a contender for realizing large-scale optical quantum circuits due to its high CMOS technology compatibility and large optical nonlinearities. Though, challenges remain in producing wafer-scale 4H-SiC thin film on insulator (4H-SiCOI) for dense integration of photonic circuits, and in efficient coupling of deterministic quantum emitters that are essential for scalable quantum photonics. Here we demonstrate hybrid integration of self-assembled InGaAs quantum dots (QDs) based single-photon sources (SPSs) with wafer-scale 4H-SiC photonic chips prepared by ion slicing technique. By designing a bilayer vertical coupler, we realize generation and highly efficient routing of single-photon emission in the hybrid quantum photonic chip. Furthermore, we realize a chip-integrated beamsplitter operation for triggered single photons through fabricating a 1x2 multi-mode interferometer (MMI) with a symmetric power splitting ratio of 50:50. The successful demonstration of heterogeneously integrating QDs-based SPSs on 4H-SiC photonic chip prepared by ion slicing technique constitutes an important step toward CMOS-compatible, fast reconfigurable quantum photonic circuits with deterministic SPSs.
Related Topics
- Type
- preprint
- Language
- en
- Landing Page
- http://arxiv.org/abs/2203.12202
- https://arxiv.org/pdf/2203.12202
- OA Status
- green
- Related Works
- 10
- OpenAlex ID
- https://openalex.org/W4226265158
Raw OpenAlex JSON
- OpenAlex ID
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https://openalex.org/W4226265158Canonical identifier for this work in OpenAlex
- DOI
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https://doi.org/10.48550/arxiv.2203.12202Digital Object Identifier
- Title
-
Hybrid integration of deterministic quantum dots-based single-photon sources with CMOS-compatible silicon carbide photonicsWork title
- Type
-
preprintOpenAlex work type
- Language
-
enPrimary language
- Publication year
-
2022Year of publication
- Publication date
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2022-03-23Full publication date if available
- Authors
-
Yifan Zhu, Wenqi Wei, Ailun Yi, Tingting Jin, Chen Shen, Xudong Wang, Liping Zhou, Chengli Wang, Weiwen Ou, Sannian Song, Ting Wang, Jianjun Zhang, Xin Ou, Jiaxiang ZhangList of authors in order
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https://arxiv.org/abs/2203.12202Publisher landing page
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https://arxiv.org/pdf/2203.12202Direct link to full text PDF
- Open access
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YesWhether a free full text is available
- OA status
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greenOpen access status per OpenAlex
- OA URL
-
https://arxiv.org/pdf/2203.12202Direct OA link when available
- Concepts
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Photonics, Optoelectronics, Materials science, Quantum dot, Photonic integrated circuit, Photon, Silicon photonics, CMOS, Electronic engineering, Physics, Optics, EngineeringTop concepts (fields/topics) attached by OpenAlex
- Cited by
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0Total citation count in OpenAlex
- Related works (count)
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10Other works algorithmically related by OpenAlex
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| abstract_inverted_index.(MMI) | 124 |
| abstract_inverted_index.(QDs) | 70 |
| abstract_inverted_index.SPSs. | 163 |
| abstract_inverted_index.based | 71 |
| abstract_inverted_index.chip. | 106 |
| abstract_inverted_index.chips | 79 |
| abstract_inverted_index.dense | 40 |
| abstract_inverted_index.large | 24 |
| abstract_inverted_index.power | 128 |
| abstract_inverted_index.ratio | 130 |
| abstract_inverted_index.(SPSs) | 74 |
| abstract_inverted_index.4H-SiC | 33, 77, 142 |
| abstract_inverted_index.50:50. | 132 |
| abstract_inverted_index.InGaAs | 67 |
| abstract_inverted_index.highly | 95 |
| abstract_inverted_index.hybrid | 63, 103 |
| abstract_inverted_index.remain | 29 |
| abstract_inverted_index.single | 116 |
| abstract_inverted_index.toward | 154 |
| abstract_inverted_index.Though, | 27 |
| abstract_inverted_index.bilayer | 88 |
| abstract_inverted_index.carbide | 3 |
| abstract_inverted_index.optical | 13, 25 |
| abstract_inverted_index.photons | 117 |
| abstract_inverted_index.quantum | 14, 51, 58, 68, 104, 158 |
| abstract_inverted_index.realize | 92, 109 |
| abstract_inverted_index.routing | 97 |
| abstract_inverted_index.slicing | 83, 148 |
| abstract_inverted_index.sources | 73 |
| abstract_inverted_index.through | 118 |
| abstract_inverted_index.(4H-SiC) | 4 |
| abstract_inverted_index.circuits | 15, 160 |
| abstract_inverted_index.coupler, | 90 |
| abstract_inverted_index.coupling | 48 |
| abstract_inverted_index.emerging | 6 |
| abstract_inverted_index.emission | 100 |
| abstract_inverted_index.emitters | 52 |
| abstract_inverted_index.photonic | 43, 78, 105, 143, 159 |
| abstract_inverted_index.prepared | 80, 145 |
| abstract_inverted_index.scalable | 57 |
| abstract_inverted_index.vertical | 89 |
| abstract_inverted_index.QDs-based | 139 |
| abstract_inverted_index.circuits, | 44 |
| abstract_inverted_index.contender | 9 |
| abstract_inverted_index.designing | 86 |
| abstract_inverted_index.efficient | 47, 96 |
| abstract_inverted_index.essential | 55 |
| abstract_inverted_index.important | 152 |
| abstract_inverted_index.insulator | 37 |
| abstract_inverted_index.operation | 113 |
| abstract_inverted_index.producing | 31 |
| abstract_inverted_index.realizing | 11 |
| abstract_inverted_index.splitting | 129 |
| abstract_inverted_index.symmetric | 127 |
| abstract_inverted_index.technique | 149 |
| abstract_inverted_index.triggered | 115 |
| abstract_inverted_index.(4H-SiCOI) | 38 |
| abstract_inverted_index.4H-silicon | 2 |
| abstract_inverted_index.challenges | 28 |
| abstract_inverted_index.generation | 93 |
| abstract_inverted_index.multi-mode | 122 |
| abstract_inverted_index.photonics. | 59 |
| abstract_inverted_index.successful | 134 |
| abstract_inverted_index.technique. | 84 |
| abstract_inverted_index.technology | 21 |
| abstract_inverted_index.constitutes | 150 |
| abstract_inverted_index.demonstrate | 62 |
| abstract_inverted_index.fabricating | 119 |
| abstract_inverted_index.integrating | 138 |
| abstract_inverted_index.integration | 41, 64 |
| abstract_inverted_index.large-scale | 12 |
| abstract_inverted_index.wafer-scale | 32, 76 |
| abstract_inverted_index.Furthermore, | 107 |
| abstract_inverted_index.beamsplitter | 112 |
| abstract_inverted_index.compatibility | 22 |
| abstract_inverted_index.demonstration | 135 |
| abstract_inverted_index.deterministic | 50, 162 |
| abstract_inverted_index.single-photon | 72, 99 |
| abstract_inverted_index.interferometer | 123 |
| abstract_inverted_index.reconfigurable | 157 |
| abstract_inverted_index.self-assembled | 66 |
| abstract_inverted_index.chip-integrated | 111 |
| abstract_inverted_index.heterogeneously | 137 |
| abstract_inverted_index.nonlinearities. | 26 |
| abstract_inverted_index.CMOS-compatible, | 155 |
| cited_by_percentile_year | |
| countries_distinct_count | 0 |
| institutions_distinct_count | 14 |
| sustainable_development_goals[0].id | https://metadata.un.org/sdg/7 |
| sustainable_development_goals[0].score | 0.4699999988079071 |
| sustainable_development_goals[0].display_name | Affordable and clean energy |
| citation_normalized_percentile |