Increasing the Adhesion of W to Si Substrates Using Cr/Ti Interlayers Article Swipe

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Matthew J. Lloyd , Colin Teoh , Glenn Lim , D. Nguyen-Manh , Damian Sobieraj , Jan Wróbel , Robert E. Simpson ·

YOU? · · 2022 · Open Access · · DOI: https://doi.org/10.2139/ssrn.4156057

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Materials science Adhesion Metallurgy Chemical engineering Composite material Engineering

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Type: article
Language: en
Landing Page: https://doi.org/10.2139/ssrn.4156057
OA Status: green
Cited By: 1
References: 49
Related Works: 10
OpenAlex ID: https://openalex.org/W4285060460

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OpenAlex ID: https://openalex.org/W4285060460

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DOI: https://doi.org/10.2139/ssrn.4156057

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Title: Increasing the Adhesion of W to Si Substrates Using Cr/Ti Interlayers

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Type: article

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Language: en

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Publication year: 2022

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Publication date: 2022-01-01

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Authors: Matthew J. Lloyd, Colin Teoh, Glenn Lim, D. Nguyen-Manh, Damian Sobieraj, Jan Wróbel, Robert E. Simpson

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Landing page: https://doi.org/10.2139/ssrn.4156057

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OA status: green

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OA URL: https://doi.org/10.2139/ssrn.4156057

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Concepts: Materials science, Adhesion, Metallurgy, Chemical engineering, Composite material, Engineering

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Cited by: 1

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Citations by year (recent): 2024: 1

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References (count): 49

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Related works (count): 10

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