Mechanistic understanding of microstructural effects on the thermal fatigue resistance of solder joints Article Swipe
Yilun Xu
,
Jingwei Xian
,
Richard Coyle
,
C.M. Gourlay
,
Fionn P.E. Dunne
·
YOU?
·
· 2024
· Open Access
·
· DOI: https://doi.org/10.1016/j.jmps.2024.105623
YOU?
·
· 2024
· Open Access
·
· DOI: https://doi.org/10.1016/j.jmps.2024.105623
This paper uses a multi-scale crystal plasticity modelling approach to investigate the role of microstructure in the damage of Sn-3Ag-0.5Cu (wt%, SAC305) solder joints subject to thermal cycling. Faithful microstructure modelling has been developed to explicitly represent the complex microstructure characterized in the experiments. The mechanisms for the experimental finding that single crystal joints systematically outperform interlaced and beachball joints, in terms of damage development during thermal cycling, are found to be the localization of stored energy due to the grain boundaries. Interlaced regions, however, benefit the lifetime of solder joints versus a beachball microstructure by virtue of energy diffusion. The modelling results, together with experimental characterization, provide practical suggestions on how the microstructure could be designed to optimize the in-service lifetime of solder joints subject to thermal fatigue.
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Metadata
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- Language
- en
- Landing Page
- https://doi.org/10.1016/j.jmps.2024.105623
- OA Status
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All OpenAlex metadata
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https://openalex.org/W4393237080Canonical identifier for this work in OpenAlex
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https://doi.org/10.1016/j.jmps.2024.105623Digital Object Identifier
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Mechanistic understanding of microstructural effects on the thermal fatigue resistance of solder jointsWork title
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articleOpenAlex work type
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enPrimary language
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2024Year of publication
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2024-03-27Full publication date if available
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Yilun Xu, Jingwei Xian, Richard Coyle, C.M. Gourlay, Fionn P.E. DunneList of authors in order
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https://doi.org/10.1016/j.jmps.2024.105623Publisher landing page
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hybridOpen access status per OpenAlex
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https://doi.org/10.1016/j.jmps.2024.105623Direct OA link when available
- Concepts
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Microstructure, Soldering, Materials science, Temperature cycling, Grain boundary, Thermal, Metallurgy, Diffusion, Service life, Composite material, Thermodynamics, PhysicsTop concepts (fields/topics) attached by OpenAlex
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14Total citation count in OpenAlex
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2025: 10, 2024: 4Per-year citation counts (last 5 years)
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57Number of works referenced by this work
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10Other works algorithmically related by OpenAlex
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