Microstrip broadband thin-film attenuators without via-hole-ground at millimeter wave frequencies Article Swipe

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Broadband Microstrip Wideband Attenuation Resistor Extremely high frequency Materials science Monolithic microwave integrated circuit Substrate (aquarium) Cascade Acoustics Electronic engineering Optoelectronics Telecommunications Optics Bandwidth (computing) Electrical engineering Engineering Physics Amplifier Geology Oceanography Voltage Chemical engineering

B. Aja , E. Artal , Enrique Villa , Luisa de la Fuente , Juan Pablo Pascual Gutiérrez ·

YOU? · · 2019 · Open Access · · DOI: https://doi.org/10.1016/j.aeue.2019.01.005 · OA: W2909906640

A comprehensive design methodology for microstrip broadband attenuators is presented. Closed-form design equations are given for two types of distributed attenuators. The attenuators are based on a cascade connection of thin-film resistors and microstrip line sections. The structure provides maximally flat attenuation and wideband performance without the need of plated via holes to ground, facilitating manufacture as well as achieving proper performance at millimeter wave frequencies. Experimental results demonstrate the validity of the technique applied to 3 dB and 13 dB broadband attenuators on aluminasubstrate up to 67 GHz. The proposed topology can be applied not only to MIC, but also to MMIC designs at the highest frequencies.