Rapid calculation method to evaluate thermal management of LED systems based on an improved multi-layer model Article Swipe
Haotian Meng
,
Fanmin Kong
,
Kang Li
·
YOU?
·
· 2022
· Open Access
·
· DOI: https://doi.org/10.1016/j.rinp.2022.106046
YOU?
·
· 2022
· Open Access
·
· DOI: https://doi.org/10.1016/j.rinp.2022.106046
An improved laminated structure model of LED systems is proposed. Besides the light-emitting diode (LED) chip, printed circuit board (PCB) substrate, heat sink, etc, additional interface layers are applied to model the non-ideal surface of thermal interface materials (TIMs). And a rapid calculation method is developed for temperature-related calculations. Through comparisons, the method is proved to be valid, and the execution time can be greatly reduced. It is found that the air gap at the TIM surface does hinder heat conduction but the effect is not obvious. The influence of LED chips on system thermal management is comprehensively analyzed. For a single LED chip, the junction temperature shows a linear relationship with its thermal resistance and heat power. The chip size, as well as the aspect ratio between the chip and the PCB substrate, has great effects on the junction temperature. For a multi-chip array, the impact of the chip quantity is suggested to be considered combined with the chip layout. The mutual thermal interaction among LED chips is of most concern, which will become more serious with an increasing number of chips. The work provides a rapid and flexible evaluation method for thermal management of LED systems.
Related Topics
Concepts
Junction temperature
Thermal management of high-power LEDs
Heat sink
Chip
Materials science
Thermal resistance
Thermal conduction
Thermal
Light-emitting diode
Printed circuit board
Diode
Optoelectronics
Substrate (aquarium)
Thermal grease
Electronic engineering
Mechanical engineering
Computer science
Electrical engineering
Engineering
Composite material
Thermodynamics
Physics
Telecommunications
Oceanography
Geology
Metadata
- Type
- article
- Language
- en
- Landing Page
- https://doi.org/10.1016/j.rinp.2022.106046
- OA Status
- gold
- Cited By
- 1
- References
- 26
- Related Works
- 10
- OpenAlex ID
- https://openalex.org/W4304688774
All OpenAlex metadata
Raw OpenAlex JSON
- OpenAlex ID
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https://openalex.org/W4304688774Canonical identifier for this work in OpenAlex
- DOI
-
https://doi.org/10.1016/j.rinp.2022.106046Digital Object Identifier
- Title
-
Rapid calculation method to evaluate thermal management of LED systems based on an improved multi-layer modelWork title
- Type
-
articleOpenAlex work type
- Language
-
enPrimary language
- Publication year
-
2022Year of publication
- Publication date
-
2022-10-12Full publication date if available
- Authors
-
Haotian Meng, Fanmin Kong, Kang LiList of authors in order
- Landing page
-
https://doi.org/10.1016/j.rinp.2022.106046Publisher landing page
- Open access
-
YesWhether a free full text is available
- OA status
-
goldOpen access status per OpenAlex
- OA URL
-
https://doi.org/10.1016/j.rinp.2022.106046Direct OA link when available
- Concepts
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Junction temperature, Thermal management of high-power LEDs, Heat sink, Chip, Materials science, Thermal resistance, Thermal conduction, Thermal, Light-emitting diode, Printed circuit board, Diode, Optoelectronics, Substrate (aquarium), Thermal grease, Electronic engineering, Mechanical engineering, Computer science, Electrical engineering, Engineering, Composite material, Thermodynamics, Physics, Telecommunications, Oceanography, GeologyTop concepts (fields/topics) attached by OpenAlex
- Cited by
-
1Total citation count in OpenAlex
- Citations by year (recent)
-
2024: 1Per-year citation counts (last 5 years)
- References (count)
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26Number of works referenced by this work
- Related works (count)
-
10Other works algorithmically related by OpenAlex
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