Smaller is better: reducing silver nanoparticle size without excess ligands enhances conductivity and flexibility in printed thin films Article Swipe
Tyler Kirscht
,
Abhijit Bera
,
Matthew Marander
,
Collin Grota
,
Fei Liu
,
Shan Jiang
·
YOU?
·
· 2025
· Open Access
·
· DOI: https://doi.org/10.1038/s41528-025-00496-3
YOU?
·
· 2025
· Open Access
·
· DOI: https://doi.org/10.1038/s41528-025-00496-3
Achieving simultaneous high conductivity and mechanical durability in printed flexible electronics remains a central challenge. Here we report a systematic investigation of silver nanoparticle (AgNP) size effects on film performance using a pH-mediated synthesis that decouples particle size from organic content. This strategy enables direct assessment of size-dependent sintering and mechanical behaviors, previously obscured by varied polymer concentrations of traditional size control methods. With consistent organic content, AgNPs of smaller size demonstrated more effective sintering, forming denser and more cohesive microstructures, contrary to prior reports with varied organic concentration. This yielded highly conductive films with resistivities as low as 2.34 μΩ cm, approaching bulk silver. Additionally, electrohydrodynamic (EHD) printing of these inks produced flexible circuits with significantly improved mechanical resilience. The resistance of a printed pattern remained stable over 1,000 bending cycles at a 2.9 mm radius and increased by only 56.7% after 50,000 cycles, with no visible microstructural cracking.
Related Topics
Concepts
Materials science
Printed electronics
Bend radius
Silver nanoparticle
Nanoparticle
Conductivity
Electrical conductor
Composite material
Particle size
Nanotechnology
Thin film
Flexible electronics
Polymer
Bending
Electrical resistivity and conductivity
Flexibility (engineering)
Sintering
Sheet resistance
Particle (ecology)
Flexible display
Electronics
Electrohydrodynamics
Organic electronics
RADIUS
Durability
Electrode
Optoelectronics
Screen printing
Electronic circuit
Conductive polymer
Electronic packaging
Metadata
- Type
- article
- Language
- en
- Landing Page
- https://doi.org/10.1038/s41528-025-00496-3
- https://www.nature.com/articles/s41528-025-00496-3.pdf
- OA Status
- gold
- References
- 45
- OpenAlex ID
- https://openalex.org/W7105659417
All OpenAlex metadata
Raw OpenAlex JSON
- OpenAlex ID
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https://openalex.org/W7105659417Canonical identifier for this work in OpenAlex
- DOI
-
https://doi.org/10.1038/s41528-025-00496-3Digital Object Identifier
- Title
-
Smaller is better: reducing silver nanoparticle size without excess ligands enhances conductivity and flexibility in printed thin filmsWork title
- Type
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articleOpenAlex work type
- Language
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enPrimary language
- Publication year
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2025Year of publication
- Publication date
-
2025-11-14Full publication date if available
- Authors
-
Tyler Kirscht, Abhijit Bera, Matthew Marander, Collin Grota, Fei Liu, Shan JiangList of authors in order
- Landing page
-
https://doi.org/10.1038/s41528-025-00496-3Publisher landing page
- PDF URL
-
https://www.nature.com/articles/s41528-025-00496-3.pdfDirect link to full text PDF
- Open access
-
YesWhether a free full text is available
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-
goldOpen access status per OpenAlex
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https://www.nature.com/articles/s41528-025-00496-3.pdfDirect OA link when available
- Concepts
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Materials science, Printed electronics, Bend radius, Silver nanoparticle, Nanoparticle, Conductivity, Electrical conductor, Composite material, Particle size, Nanotechnology, Thin film, Flexible electronics, Polymer, Bending, Electrical resistivity and conductivity, Flexibility (engineering), Sintering, Sheet resistance, Particle (ecology), Flexible display, Electronics, Electrohydrodynamics, Organic electronics, RADIUS, Durability, Electrode, Optoelectronics, Screen printing, Electronic circuit, Conductive polymer, Electronic packagingTop concepts (fields/topics) attached by OpenAlex
- Cited by
-
0Total citation count in OpenAlex
- References (count)
-
45Number of works referenced by this work
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| primary_location.pdf_url | https://www.nature.com/articles/s41528-025-00496-3.pdf |
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| primary_location.raw_source_name | npj Flexible Electronics |
| primary_location.landing_page_url | https://doi.org/10.1038/s41528-025-00496-3 |
| publication_date | 2025-11-14 |
| publication_year | 2025 |
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