Test Methods for Evaluation of Silicon Interposer Manufacturing Process Article Swipe
Lei Chen
,
Hang Su
,
Xiaotian Zhang
,
Zhiyuan Jin
,
Rong Hong Cui
,
Jing Wu
,
Jie Wu
,
Hongze Zhang
,
Zhen Huang
,
Min Huang
,
Guoqing Jiang
·
YOU?
·
· 2025
· Open Access
·
· DOI: https://doi.org/10.1088/1742-6596/2982/1/012007
YOU?
·
· 2025
· Open Access
·
· DOI: https://doi.org/10.1088/1742-6596/2982/1/012007
Silicon interposer is a new-style 3D packaging, which mainly consists Through Silicon Via (TSV) technique and wafer bonding process. TSV is a way to make interconnections between chips by creating vertical wafer-to-wafer vias. Silicon interposer manufacturing process can be evaluated by the Construction Analysis (CA) or Destructive Physical Analysis (DPA) test. Devices sectional sample obtained by testing, and process quality through-hole cross section is the focus of the study. A sample section which is clearer than the traditional ones has obtained through a new test method. The method consists of three steps: fixing, grinding and polishing the sample, and it can effectively expose the vulnerability of the workmanship samples. Therefore, it can be widely applied as an effective test method to evaluate the quality of silicon interposer manufacturing process.
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- Type
- article
- Language
- en
- Landing Page
- https://doi.org/10.1088/1742-6596/2982/1/012007
- OA Status
- diamond
- References
- 3
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- OpenAlex ID
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All OpenAlex metadata
Raw OpenAlex JSON
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https://openalex.org/W4410008376Canonical identifier for this work in OpenAlex
- DOI
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https://doi.org/10.1088/1742-6596/2982/1/012007Digital Object Identifier
- Title
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Test Methods for Evaluation of Silicon Interposer Manufacturing ProcessWork title
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articleOpenAlex work type
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enPrimary language
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2025Year of publication
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2025-04-01Full publication date if available
- Authors
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Lei Chen, Hang Su, Xiaotian Zhang, Zhiyuan Jin, Rong Hong Cui, Jing Wu, Jie Wu, Hongze Zhang, Zhen Huang, Min Huang, Guoqing JiangList of authors in order
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https://doi.org/10.1088/1742-6596/2982/1/012007Publisher landing page
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YesWhether a free full text is available
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diamondOpen access status per OpenAlex
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https://doi.org/10.1088/1742-6596/2982/1/012007Direct OA link when available
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Interposer, Test (biology), Process (computing), Manufacturing engineering, Manufacturing process, Silicon, Computer science, Materials science, Engineering, Nanotechnology, Metallurgy, Operating system, Geology, Composite material, Layer (electronics), Etching (microfabrication), PaleontologyTop concepts (fields/topics) attached by OpenAlex
- Cited by
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0Total citation count in OpenAlex
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3Number of works referenced by this work
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10Other works algorithmically related by OpenAlex
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| abstract_inverted_index.fixing, | 93 |
| abstract_inverted_index.method. | 86 |
| abstract_inverted_index.process | 37, 59 |
| abstract_inverted_index.quality | 60, 124 |
| abstract_inverted_index.sample, | 98 |
| abstract_inverted_index.section | 63, 72 |
| abstract_inverted_index.silicon | 126 |
| abstract_inverted_index.through | 82 |
| abstract_inverted_index.Abstract | 0 |
| abstract_inverted_index.Analysis | 44, 49 |
| abstract_inverted_index.Physical | 48 |
| abstract_inverted_index.consists | 10, 89 |
| abstract_inverted_index.creating | 30 |
| abstract_inverted_index.evaluate | 122 |
| abstract_inverted_index.grinding | 94 |
| abstract_inverted_index.obtained | 55, 81 |
| abstract_inverted_index.process. | 19, 129 |
| abstract_inverted_index.samples. | 109 |
| abstract_inverted_index.testing, | 57 |
| abstract_inverted_index.vertical | 31 |
| abstract_inverted_index.effective | 118 |
| abstract_inverted_index.evaluated | 40 |
| abstract_inverted_index.new-style | 5 |
| abstract_inverted_index.polishing | 96 |
| abstract_inverted_index.sectional | 53 |
| abstract_inverted_index.technique | 15 |
| abstract_inverted_index.Therefore, | 110 |
| abstract_inverted_index.interposer | 2, 35, 127 |
| abstract_inverted_index.packaging, | 7 |
| abstract_inverted_index.Destructive | 47 |
| abstract_inverted_index.effectively | 102 |
| abstract_inverted_index.traditional | 78 |
| abstract_inverted_index.workmanship | 108 |
| abstract_inverted_index.Construction | 43 |
| abstract_inverted_index.through-hole | 61 |
| abstract_inverted_index.manufacturing | 36, 128 |
| abstract_inverted_index.vulnerability | 105 |
| abstract_inverted_index.wafer-to-wafer | 32 |
| abstract_inverted_index.interconnections | 26 |
| cited_by_percentile_year | |
| countries_distinct_count | 0 |
| institutions_distinct_count | 11 |
| citation_normalized_percentile.value | 0.14815259 |
| citation_normalized_percentile.is_in_top_1_percent | False |
| citation_normalized_percentile.is_in_top_10_percent | False |