Ti/Al Multi-Layered Sheets: Accumulative Roll Bonding (Part A) Article Swipe

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Jan Romberg , J. Freudenberger , Hansjörg Bauder , Georg Plattner , Hans Krug , Frank Holländer , Juliane Scharnweber , Andy Eschke , U. Kühn , H. Klauß , Carl‐Georg Oertel , Werner Skrotzki , J. Eckert , L. Schultz ·

YOU? · · 2016 · Open Access · · DOI: https://doi.org/10.3390/met6020030

Co-deformation of Al and Ti by accumulative roll bonding (ARB) with intermediate heat treatments is utilized to prepare multi-layered Ti/Al sheets. These sheets show a high specific strength due to the activation of various hardening mechanisms imposed during deformation, such as: hardening by grain refinement, work hardening and phase boundary hardening. The latter is even enhanced by the confinement of the layers during deformation. The evolution of the microstructure with a special focus on grain refinement and structural integrity is traced, and the correlation to the mechanical properties is shown.

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Materials science Accumulative roll bonding Microstructure Hardening (computing) Grain boundary Deformation mechanism Deformation (meteorology) Composite material Grain size Metallurgy Layer (electronics)

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Type: article
Language: en
Landing Page: https://doi.org/10.3390/met6020030
PDF: https://www.mdpi.com/2075-4701/6/2/30/pdf?version=1454398174
OA Status: gold
Cited By: 29
References: 49
Related Works: 10
OpenAlex ID: https://openalex.org/W2266712113

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DOI: https://doi.org/10.3390/met6020030

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Title: Ti/Al Multi-Layered Sheets: Accumulative Roll Bonding (Part A)

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Type: article

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Language: en

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Publication year: 2016

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Publication date: 2016-02-02

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Authors: Jan Romberg, J. Freudenberger, Hansjörg Bauder, Georg Plattner, Hans Krug, Frank Holländer, Juliane Scharnweber, Andy Eschke, U. Kühn, H. Klauß, Carl‐Georg Oertel, Werner Skrotzki, J. Eckert, L. Schultz

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Landing page: https://doi.org/10.3390/met6020030

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PDF URL: https://www.mdpi.com/2075-4701/6/2/30/pdf?version=1454398174

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Concepts: Materials science, Accumulative roll bonding, Microstructure, Hardening (computing), Grain boundary, Deformation mechanism, Deformation (meteorology), Composite material, Grain size, Metallurgy, Layer (electronics)

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Cited by: 29

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