Validation of sequence test method of Pb-free solder joint for automotive electronics Article Swipe
A Young Kim
,
Chulmin Oh
,
Won Sik Hong
·
YOU?
·
· 2015
· Open Access
·
· DOI: https://doi.org/10.5781/jwj.2015.33.3.25
YOU?
·
· 2015
· Open Access
·
· DOI: https://doi.org/10.5781/jwj.2015.33.3.25
Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and auto-motive electronics have to eliminate toxic substance from electronic devices and system. Specifically, reli-ability issue of lead-free solder joint have an increasing demand for the car electronics caused by ELV banning. The authors prepared engine control unit and cabin electronics soldered with Sn-3.0Ag-0.5Cu (SAC305). To compare with the degradation characteristics of solder joint strength, thermal cycling test (TC), power-thermal cycling test (PTC) and series tests were conducted. Series tests were conducted for TC and PTC combined stress test using the same sample in sequence and continuously. TC test was per-formed at -40~125 ℃ and soak time 10 min for 1000 cycles. PTC test was applied by pulse power and full function conditions during 100 cycles. Combined stress test was tested in accordance with automotive company standard. Solder joint degradation was observed by optical microscopy and environment scanning electron microscopy (ESEM). In addition, to compare with deterioration of bond strength of quad flat pack-age (QFP) and chip components, we have measured lead pull and shear strength. Based on the series test results, consequently, we have validated of series test method for lifetime and reliability of Pb-free solder joint in automotive electronics.Key Words : Pb-free solder, Solder joint, Series reliability, Automotive electronics, DegradationISSN 1225-6153Online ISSN 2287-8955
Related Topics
Concepts
Automotive industry
Soldering
Joint (building)
Automotive electronics
Electronics
Test (biology)
Sequence (biology)
Manufacturing engineering
Materials science
Engineering
Automotive engineering
Structural engineering
Metallurgy
Electrical engineering
Chemistry
Geology
Paleontology
Biochemistry
Aerospace engineering
Metadata
- Type
- article
- Language
- en
- Landing Page
- https://doi.org/10.5781/jwj.2015.33.3.25
- http://society.kisti.re.kr/sv/SV_svpsbs03V.do?method=download&cn1=JAKO201521839155608
- OA Status
- diamond
- Cited By
- 1
- References
- 10
- Related Works
- 10
- OpenAlex ID
- https://openalex.org/W2283032447
All OpenAlex metadata
Raw OpenAlex JSON
- OpenAlex ID
-
https://openalex.org/W2283032447Canonical identifier for this work in OpenAlex
- DOI
-
https://doi.org/10.5781/jwj.2015.33.3.25Digital Object Identifier
- Title
-
Validation of sequence test method of Pb-free solder joint for automotive electronicsWork title
- Type
-
articleOpenAlex work type
- Language
-
enPrimary language
- Publication year
-
2015Year of publication
- Publication date
-
2015-06-30Full publication date if available
- Authors
-
A Young Kim, Chulmin Oh, Won Sik HongList of authors in order
- Landing page
-
https://doi.org/10.5781/jwj.2015.33.3.25Publisher landing page
- PDF URL
-
https://society.kisti.re.kr/sv/SV_svpsbs03V.do?method=download&cn1=JAKO201521839155608Direct link to full text PDF
- Open access
-
YesWhether a free full text is available
- OA status
-
diamondOpen access status per OpenAlex
- OA URL
-
https://society.kisti.re.kr/sv/SV_svpsbs03V.do?method=download&cn1=JAKO201521839155608Direct OA link when available
- Concepts
-
Automotive industry, Soldering, Joint (building), Automotive electronics, Electronics, Test (biology), Sequence (biology), Manufacturing engineering, Materials science, Engineering, Automotive engineering, Structural engineering, Metallurgy, Electrical engineering, Chemistry, Geology, Paleontology, Biochemistry, Aerospace engineeringTop concepts (fields/topics) attached by OpenAlex
- Cited by
-
1Total citation count in OpenAlex
- Citations by year (recent)
-
2025: 1Per-year citation counts (last 5 years)
- References (count)
-
10Number of works referenced by this work
- Related works (count)
-
10Other works algorithmically related by OpenAlex
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| abstract_inverted_index.cabin | 53 |
| abstract_inverted_index.issue | 29 |
| abstract_inverted_index.joint | 33, 67, 142, 201 |
| abstract_inverted_index.power | 122 |
| abstract_inverted_index.pulse | 121 |
| abstract_inverted_index.shear | 178 |
| abstract_inverted_index.tests | 79, 83 |
| abstract_inverted_index.toxic | 20 |
| abstract_inverted_index.using | 93 |
| abstract_inverted_index.(RoHS, | 5 |
| abstract_inverted_index.Series | 82, 211 |
| abstract_inverted_index.Solder | 141, 209 |
| abstract_inverted_index.Union, | 12 |
| abstract_inverted_index.caused | 42 |
| abstract_inverted_index.demand | 37 |
| abstract_inverted_index.during | 127 |
| abstract_inverted_index.engine | 49 |
| abstract_inverted_index.joint, | 210 |
| abstract_inverted_index.method | 193 |
| abstract_inverted_index.sample | 96 |
| abstract_inverted_index.series | 78, 183, 191 |
| abstract_inverted_index.solder | 32, 66, 200 |
| abstract_inverted_index.stress | 91, 131 |
| abstract_inverted_index.tested | 134 |
| abstract_inverted_index.(ESEM). | 154 |
| abstract_inverted_index.-40~125 | 106 |
| abstract_inverted_index.Pb-free | 199, 207 |
| abstract_inverted_index.applied | 119 |
| abstract_inverted_index.authors | 47 |
| abstract_inverted_index.company | 139 |
| abstract_inverted_index.compare | 60, 158 |
| abstract_inverted_index.control | 50 |
| abstract_inverted_index.cycles. | 115, 129 |
| abstract_inverted_index.cycling | 70, 74 |
| abstract_inverted_index.devices | 24 |
| abstract_inverted_index.optical | 147 |
| abstract_inverted_index.solder, | 208 |
| abstract_inverted_index.system. | 26 |
| abstract_inverted_index.thermal | 69 |
| abstract_inverted_index.Abstract | 0 |
| abstract_inverted_index.Combined | 130 |
| abstract_inverted_index.European | 11 |
| abstract_inverted_index.banning. | 45 |
| abstract_inverted_index.combined | 90 |
| abstract_inverted_index.electron | 152 |
| abstract_inverted_index.function | 125 |
| abstract_inverted_index.lifetime | 195 |
| abstract_inverted_index.measured | 174 |
| abstract_inverted_index.observed | 145 |
| abstract_inverted_index.pack-age | 167 |
| abstract_inverted_index.prepared | 48 |
| abstract_inverted_index.results, | 185 |
| abstract_inverted_index.scanning | 151 |
| abstract_inverted_index.sequence | 98 |
| abstract_inverted_index.soldered | 55 |
| abstract_inverted_index.strength | 163 |
| abstract_inverted_index.(SAC305). | 58 |
| abstract_inverted_index.2287-8955 | 218 |
| abstract_inverted_index.addition, | 156 |
| abstract_inverted_index.conducted | 85 |
| abstract_inverted_index.eliminate | 19 |
| abstract_inverted_index.lead-free | 31 |
| abstract_inverted_index.standard. | 140 |
| abstract_inverted_index.strength, | 68 |
| abstract_inverted_index.strength. | 179 |
| abstract_inverted_index.substance | 21 |
| abstract_inverted_index.validated | 189 |
| abstract_inverted_index.Automotive | 213 |
| abstract_inverted_index.accordance | 136 |
| abstract_inverted_index.automotive | 138, 203 |
| abstract_inverted_index.conditions | 126 |
| abstract_inverted_index.conducted. | 81 |
| abstract_inverted_index.electronic | 23 |
| abstract_inverted_index.increasing | 36 |
| abstract_inverted_index.microscopy | 148, 153 |
| abstract_inverted_index.per-formed | 104 |
| abstract_inverted_index.auto-motive | 15 |
| abstract_inverted_index.components, | 171 |
| abstract_inverted_index.degradation | 63, 143 |
| abstract_inverted_index.electronics | 13, 16, 41, 54 |
| abstract_inverted_index.environment | 150 |
| abstract_inverted_index.regulations | 4 |
| abstract_inverted_index.reliability | 197 |
| abstract_inverted_index.electronics, | 214 |
| abstract_inverted_index.reli-ability | 28 |
| abstract_inverted_index.reliability, | 212 |
| abstract_inverted_index.Specifically, | 27 |
| abstract_inverted_index.consequently, | 186 |
| abstract_inverted_index.continuously. | 100 |
| abstract_inverted_index.deterioration | 160 |
| abstract_inverted_index.environmental | 3 |
| abstract_inverted_index.power-thermal | 73 |
| abstract_inverted_index.Sn-3.0Ag-0.5Cu | 57 |
| abstract_inverted_index.1225-6153Online | 216 |
| abstract_inverted_index.DegradationISSN | 215 |
| abstract_inverted_index.characteristics | 64 |
| abstract_inverted_index.electronics.Key | 204 |
| cited_by_percentile_year.max | 95 |
| cited_by_percentile_year.min | 91 |
| countries_distinct_count | 1 |
| institutions_distinct_count | 3 |
| citation_normalized_percentile.value | 0.12820851 |
| citation_normalized_percentile.is_in_top_1_percent | False |
| citation_normalized_percentile.is_in_top_10_percent | False |