Adam Letize
YOU?
Author Swipe
View article: Developing a Non-Cyanide Gold Bath Free of Heavy Metals for Via-Fill Applications
Developing a Non-Cyanide Gold Bath Free of Heavy Metals for Via-Fill Applications Open
Electrochemically filling vias and trenches using gold solutions is increasingly important in developing electronic devices with strict reliability requirements in the compound semiconductor field. The difficulty in developing these soluti…
View article: Metastable Fine Grain Cu for Hybrid Bonding Applications
Metastable Fine Grain Cu for Hybrid Bonding Applications Open
Utilizing metastable fine-grain copper offers an opportunity to implement low-thermal budget hybrid bonding techniques. We outline several methods for characterizing fine-grain structures and a screening process to refine these structures.…
View article: Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding
Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding Open
We discuss two electrochemical plating approaches for nanotwinned copper (ECP nt-Cu) - Gen 1 and Gen 2. These two approaches allow control over columnar width and transition layer thickness on Cu substrates, enabling the filling of nanotwi…
View article: Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding
Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding Open
We discuss two electrochemical plating approaches for nanotwinned copper (ECP nt-Cu)—Gen 1 and Gen 2. These two approaches allow control over columnar width and transition layer thickness on Cu substrates, enabling the filling of nanotwinn…
View article: A high-uniformity, high-purity copper pillar ECP process with limited acid concentration
A high-uniformity, high-purity copper pillar ECP process with limited acid concentration Open
The requirements for wafer-level packaging (WLP) are becoming more and more stringent both from a sustainability perspective and process performance. For instance, there is a demand for continuous process improvement for within die uniform…