Akram Ben Ahmed
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View article: Early degradation of silicon heterojunction PV modules installed on horizontal single-axis trackers in desert climate
Early degradation of silicon heterojunction PV modules installed on horizontal single-axis trackers in desert climate Open
We present our latest findings on the early degradation of photovoltaic (PV) silicon heterojunction (HJT) modules installed in harsh desert climates for about two and half years. The results are compared with the benchmark modules with mon…
View article: Hardware Design and Evaluation of an FPGA-Based Network Switch Supporting Asynchronous Traffic Shaping for Time Sensitive Networking
Hardware Design and Evaluation of an FPGA-Based Network Switch Supporting Asynchronous Traffic Shaping for Time Sensitive Networking Open
Time Sensitive Networking (TSN) has been widely adopted to respond to the growing need for reliable and latency-bound communication in 5G/Post5G applications. It introduces a set of new open standards to conventional IEEE 802.3 Ethernet ne…
View article: A Multi-FPGA Implementation of FM-Index Based Genomic Pattern Search
A Multi-FPGA Implementation of FM-Index Based Genomic Pattern Search Open
FPGA clusters that consist of multiple FPGA boards have been gaining interest in recent times. Massively parallel processing with a stand-alone heterogeneous FPGA cluster with SoC- style FPGAs and mid-scale FPGAs is promising with cost-per…
View article: METICULOUS: An FPGA-based Main Memory Emulator for System Software Studies
METICULOUS: An FPGA-based Main Memory Emulator for System Software Studies Open
Due to the scaling problem of the DRAM technology, non-volatile memory devices, which are based on different principle of operation than DRAM, are now being intensively developed to expand the main memory of computers. Disaggregated memory…
View article: A Multi-Tenant Resource Management System for Multi-FPGA Systems
A Multi-Tenant Resource Management System for Multi-FPGA Systems Open
FPGA (Field Programmable Gate Array) based accelerators are attracting significant interest in cloud computing systems. Combining multi-FPGA systems with cloud computing brings a new perspective to the reconfigurable computing research. Ho…
View article: Remote Dynamic Reconfiguration of a Multi-FPGA System FiC (Flow-in-Cloud)
Remote Dynamic Reconfiguration of a Multi-FPGA System FiC (Flow-in-Cloud) Open
Multi-FPGA systems have been receiving a lot of attention as a low cost and energy efficient system for Multi-access Edge Computing (MEC). For such purpose, a bare-metal multi-FPGA system called FiC (Flow-in-Cloud) is under development. In…
View article: Eco-Friendly Preparation, Characterization and Application of Nano Tech Pigmented Inkjet Inks and Comparison of Particle Size Effect and Printing Processes
Eco-Friendly Preparation, Characterization and Application of Nano Tech Pigmented Inkjet Inks and Comparison of Particle Size Effect and Printing Processes Open
By acknowledging the importance of Nano tech inkjet inks, the “top down” method of nanotechnology was followed for manufacturing the Nano tech inkjet inks of pigment Yellow 14 powder 100 % dried and pigment Blue 15.1 (100 % dried powder) a…
View article: Thermal distribution and reliability prediction for 3D Networks-on-Chip
Thermal distribution and reliability prediction for 3D Networks-on-Chip Open
As one of the most promising technologies to reduce footprint, power consumption and wire latency, Three Dimensional Integrated Circuits (3D-ICs) is considered as the near future for VLSI system. Combining with the Network-on-Chip infrastr…
View article: Report on power, thermal and reliability prediction for 3D Networks-on-Chip
Report on power, thermal and reliability prediction for 3D Networks-on-Chip Open
By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lowe…
View article: Report on power, thermal and reliability prediction for 3D\n Networks-on-Chip
Report on power, thermal and reliability prediction for 3D\n Networks-on-Chip Open
By combining Three Dimensional Integrated Circuits with the Network-on-Chip\ninfrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip\ncommunication paradigm brings several advantages on lower power, smaller\nfootprint and l…
View article: 2D Parity Product Code for TSV online fault correction and detection
2D Parity Product Code for TSV online fault correction and detection Open
Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs). However, the reliability issues due to the low yield rates and the sensitivity to thermal hotspots and stress issues are preven…
View article: A Non-Blocking Non-Degrading Multiple Defects Link Testing Method for 3D-Networks-on-Chip
A Non-Blocking Non-Degrading Multiple Defects Link Testing Method for 3D-Networks-on-Chip Open
As one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs), Through-Silicon-Via (TSV) acts as the inter-layer link inside 3D Networks-on-Chip. However, the reliability issues due to the low yield rates and the sen…
View article: A Thermal-Aware On-Line Fault Tolerance Method for TSV Lifetime Reliability in 3D-NoC Systems
A Thermal-Aware On-Line Fault Tolerance Method for TSV Lifetime Reliability in 3D-NoC Systems Open
Through-Silicon-Via (TSV) based 3D Integrated Circuits (3D-IC) are one of the most advanced architectures by providing low power consumption, shorter wire length and smaller footprint. However, 3D-ICs confront lifetime reliability due to h…