Chenyi Hou
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View article: IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints
IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints Open
The current miniaturization trend of microelectronic devices drives the size of solder joints to continually scale down. The miniaturized joints considerably increase intermetallic compounds (IMCs) volume fraction to trigger mechanical rel…