C. Bailey
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View article: Exploring Links Between Informal Learning, Library Provision, and Recidivism Rates in the USA (1974 to 2024)
Exploring Links Between Informal Learning, Library Provision, and Recidivism Rates in the USA (1974 to 2024) Open
We propose a thematic literature review of informal learning and library provision in United States carceral facilities over the last fifty years of mass incarceration (1974 to 2024). We will explore the reported impacts of library provisi…
View article: Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging
Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging Open
Fan-out wafer-level packaging (FOWLP) addresses the demand for higher interconnect densities by offering reduced form factor, improved signal integrity, and enhanced performance. However, FOWLP faces manufacturing challenges such as coeffi…
View article: ImmuneLENS characterizes systemic immune dysregulation in aging and cancer
ImmuneLENS characterizes systemic immune dysregulation in aging and cancer Open
View article: Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies
Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies Open
Wafer-level packaging (WLP) is a pivotal semiconductor packaging technology that enables heterogeneously integrated advanced semiconductor packages with high-density electrical interconnections through its efficient and highly reliable man…
View article: Package Modeling and Analysis for Heterogeneous Integration
Package Modeling and Analysis for Heterogeneous Integration Open
View article: Duration and Geochemical Evolution of Triassic and Jurassic Magmatism along the Eastern North American Margin
Duration and Geochemical Evolution of Triassic and Jurassic Magmatism along the Eastern North American Margin Open
View article: HTS library plate rejuvenation using a DMSO-rich atmosphere
HTS library plate rejuvenation using a DMSO-rich atmosphere Open
Dry DMSO can rapidly pull water vapor out of the air due to its hygroscopic nature. This is a well-documented problem within drug discovery, particularly within high-throughput screening (HTS). This hydration is caused by atmospheric moist…
View article: A prognostic and health management approach using colour fade to determine the condition of silk in a museum display environment
A prognostic and health management approach using colour fade to determine the condition of silk in a museum display environment Open
Silk is highly susceptible to fade, often resulting in colour loss to the fabric even when displayed in controlled museum environments. This study applies the engineering-inspired Prognostics and Health Management (PHM) approach to assess …
View article: Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction
Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction Open
This work presents a new approach for performing a parametric study and examining nonlinear material behaviours of a coupled thermal-mechanical model of a Power Electronics Module (PEM) by integrating the Finite Element Method (ANSYS-FEM) …
View article: Thermal-Mechanical Analysis of a Power Module with Parametric Model Order Reduction
Thermal-Mechanical Analysis of a Power Module with Parametric Model Order Reduction Open
This paper presents parametric model order reduction (pMOR) by the Lagrange approach of matrix interpolation for the thermal-mechanical and reliability study of a power electronics module (PEM) with nonlinear behaviours. Most previous rese…
View article: Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module
Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module Open
A damage mechanics-based numerical approach for the prediction of the damage evolution in wirebond structures of the power electronic module (PEM) is presented. A simplistic damage evolution model is developed in an in-house finite element…
View article: CJN volume 50 issue 4 Cover and Front matter
CJN volume 50 issue 4 Cover and Front matter Open
An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
View article: Experiences of Adversity and Validity of Baseline Concussion Testing
Experiences of Adversity and Validity of Baseline Concussion Testing Open
Context Neurocognitive testing is a critical tool in the management of sport-related concussions. Adversity during childhood and adolescence affects cognitive tasks, behavioral outcomes, and academic performance. Adversity may be important…
View article: Modeling Insights Into the Assembly Challenges of Focal Plane Arrays
Modeling Insights Into the Assembly Challenges of Focal Plane Arrays Open
Ongoing technological advances in photodetector material growth and processing, readout integrated circuits, and robust hybridization (packaging) methods for assembling high-resolution and small-pitch size pixel arrays are the main enablin…
View article: MVRLR: Multiple Perspectives Feature Representation Based on Low-rank Representation Learning for Short Video
MVRLR: Multiple Perspectives Feature Representation Based on Low-rank Representation Learning for Short Video Open
In recent years, with the rapid development of the Internet, multimedia information and its processing technology began to flourish. Today, smart terminals represented by smartphones are becoming more and more popular, and the era of mobil…
View article: Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators
Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators Open
Purpose This study aims to provide an insight into the relationship between design parameters and thermal performance of plate fin heat sinks (PFHSs) incorporating longitudinal vortex generators (VGs) inside a PFHS channel. Design/methodol…
View article: Advantages of the extended finite element method for the analysis of crack propagation in power modules
Advantages of the extended finite element method for the analysis of crack propagation in power modules Open
View article: Curation of new green space indicator for the U.S.: Accessible & recreational park cover (PAD-US-AR)
Curation of new green space indicator for the U.S.: Accessible & recreational park cover (PAD-US-AR) Open
Most spatial epidemiological studies of nature-health relationships use generalized green space measures. For instance, the normalized difference vegetative index (NDVI) is prominent despite its criticisms, such as its inability to differe…
View article: GNE-064: A Potent, Selective, and Orally Bioavailable Chemical Probe for the Bromodomains of SMARCA2 and SMARCA4 and the Fifth Bromodomain of PBRM1
GNE-064: A Potent, Selective, and Orally Bioavailable Chemical Probe for the Bromodomains of SMARCA2 and SMARCA4 and the Fifth Bromodomain of PBRM1 Open
Bromodomains are acetyllysine recognition domains present in a variety of human proteins. Bromodomains also bind small molecules that compete with acetyllysine, and therefore bromodomains have been targets for drug discovery efforts. Highl…
View article: A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints Open
This paper presents a multi-scale modelling approach to investigate the\nunderpinning mechanisms of microstructure-sensitive damage of single crystal\nSn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board\nassembly subj…
View article: Analysis of Igbt Wire Bonds Failure Using Extended Finite Element Method
Analysis of Igbt Wire Bonds Failure Using Extended Finite Element Method Open
View article: IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Components, Packaging, and Manufacturing Technology Society Information Open
View article: IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Components, Packaging, and Manufacturing Technology Society Information Open
View article: Applying Model Order Reduction to the Reliability Prediction of Power Electronic Module Wirebond Structure
Applying Model Order Reduction to the Reliability Prediction of Power Electronic Module Wirebond Structure Open
Predicting the reliability of power electronics module wirebond structures requires accurate computer models to investigate the design space constraints in a computationally efficient manner. This paper details a model-order reduction (MOR…
View article: IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Components, Packaging, and Manufacturing Technology Society Information Open
View article: IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Components, Packaging, and Manufacturing Technology Society Information Open
View article: Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks
Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks Open
Purpose The purpose of the study is to optimise the cross-sectional shape of passively cooled horizontally mounted pin-fin heat sink for higher cooling performance and lower material usage. Design/methodology/approach Multi-objective shape…
View article: IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Components, Packaging, and Manufacturing Technology Society Information Open
View article: IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Components, Packaging, and Manufacturing Technology Society Information Open
View article: Welcome from the ECTC Sponsoring Organization
Welcome from the ECTC Sponsoring Organization Open
On behalf of the IEEE Electronics Packaging Society (EPS), I am delighted to welcome you to the 71st Electronic Components and Technology Conference -the world's premier event for electronics packaging.Starting 71 years ago, ECTC continues…