Explanipedia

Comparison of pressure-less Ag sinter-bonding properties with varying substrate surface finishes and Ag particle shapes and sizes: Influence of necking region and fracture behavior Open

Dong-Bok Lee, Jee-Yeon Park, Eun-Chae Noh, Chulmin Oh, Jeong‐Won Yoon · 2025

A Study of the Technological Development Direction and Economic Security of the AI Semiconductor Industry: With Emphasis on an Analysis Using U.S. Patent Data Open

Dong-Yeon Son, Jong-Ho Lee, Chulmin Oh · 2023

Low-Temperature Sinterable Cu@Ag Paste with Superior Strength Driven by Pre-Heating Process Open

Miso Won, Dajung Kim, Hyun-Seung Yang, Chulmin Oh · 2023

To preserve the structural integrity of power semiconductor devices, ensuring a reliable connection between wide-bandgap (WBG) chips and their substrates at temperatures above 200 °C is crucial. Therefore, easily processable chip-attach ma…

Low-Temperature Sinterable Cu@Ag Paste with Superior Strength Driven by Pre-Heating Process Open

Miso Won, Dajung Kim, Hyun-Seung Yang, Chulmin Oh · 2022

Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module Open

Mi-Song Kim, Chulmin Oh, Won Sik Hong · 2019

We have developed pressureless silver sintering module using zirconia toughened alumina (ZTA) substrate made of active metal brazing (AMB) and SiC device for power module. The silver paste was printed with a metal mask of 80, 120, and 150 …

Effect of Air-HAST Conditions on Sn Whisker Growth Open

Chulmin Oh, Sangjoo Oh, Dajung Kim, Won Sik Hong, Keun-Soo Kim · 2019

Sn whiskers are one of the major causes of failure in fine-pitch electronics because of the short distance between the leads in an electronic package. In various whisker mechanisms, it takes a long time to grow a whisker due to Sn corrosio…

Bonding Property and Reliability for Press-fit Interconnection Open

Sangjoo Oh, Dajung Kim, Won Sik Hong, Chulmin Oh · 2019

Ultrasonic Bonding Property of Aluminum Wire for Power Conversion Module of Automotive Open

Ji-Yeon Park, Chulmin Oh, Deokhee Won, Won Sik Hong · 2018

This study verified ultrasonic bonding reliability of 15 mil and 6 mil aluminum wires for power conversion module of automotive. Aluminum wires were bonded on aluminum metalized Si chip using by ultrasonic bonding process. To confirm their…

Improvement in Thermomechanical Reliability of Power Conversion Modules Using SiC Power Semiconductors: A Comparison of SiC and Si via FEM Simulation Open

Cheolgyu Kim, Chulmin Oh, Yun-Hwa Choi, Kyung-Oun Jang, Taek‐Soo Kim · 2018

The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders Open

Yujin Park, Junghwan Bang, Chulmin Oh, Won Kee Hong, Namhyun Kang · 2017

Solder joints are the main weak points of power modules used in harsh environments. For the power module of electric vehicles, the maximum operating temperature of a chip can reach 175 °C under driving conditions. Therefore, it is necessar…

Effects of High Temperature-moisture on Corrosion and Mechanical Properties for Sn-system Solder Joints Open

Jeong-A Kim, Yujin Park, Chulmin Oh, Won Sik Hong, Yong-Ho Ko , et al. · 2017

The effect of high temperature-moisture on corrosion and mechanical properties for Sn-0.7Cu, Sn-3.0Ag-0.5Cu (SAC305) solders on flexible substrate was studied using Highly Accelerated Temperature/Humidity Stress Test (HAST) followed by thr…

Cu Corrosion Test Method for Lead-Free Solders Open

Mi-Song Kim, Won Sik Hong, Chulmin Oh, Keun‐Soo Kim · 2017

A soldering temperature of (235Â±3) Â°C is described in ISO 9455-15 for the copper corrosion test. However, this temperature is not suitable for performing lead-free solder pastes. We evaluated the compatibility of a lead-free solder paste…

Solder Joint Fatigue Life of Flexible Impact Sensor Module for Automotive Electronics Open

Jiyeon Park, Mi-Song Kim, Chulmin Oh, Sang Do, Jong Dock Seo , et al. · 2017

To improve the sensitivity of impact sensor modules for automotive air bag systems, we developed a flexible module.The impact sensor was soldered with Sn-3.0Ag-0.5Cu(SAC305) solder on a flexible printed circuit board (FPCB) with an organic…

Nano-volcanic Eruption of Silver Open

Shih‐kang Lin, Shijo Nagao, Emi Yokoi, Chulmin Oh, Hao Zhang , et al. · 2016

Manufacturing Technology for Tape Casting and Soft Magnetic Powder Using by Recycling Scrap of Fe-Si Electrical Sheet Open

Won Sik Hong, Sang Hyun Kim, Jiyeon Park, Chulmin Oh, Woo Sung Lee , et al. · 2016

This study focused on examining the possibility for recycling of Fe-Si electric sheet. We manufactured Fe-6.5Si mother alloy using by Fe-Si electric sheet scrap for transformer core materials. And then, soft magnetic alloy powder which dia…

Validation of sequence test method of Pb-free solder joint for automotive electronics Open

A Young Kim, Chulmin Oh, Won Sik Hong · 2015

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and auto-motive electronics have to eliminate toxic substance from electronic devices and system. Specifically, reli-ability issue of lead-free solder…

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