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View article: Search for non-resonant Higgs bosons pair production in the $bb\tau\tau$ final state at CMS
Search for non-resonant Higgs bosons pair production in the $bb\tau\tau$ final state at CMS Open
A search for the non-resonant production of Higgs boson pairs (HH) via the gluon-gluon and vector boson fusion processes in final states with two bottom quarks and two tau leptons is presented. The search uses data from proton-proton colli…
View article: Development of silicon pixel sensors for the High Luminosity upgrade of the CMS experiment at LHC and search for Higgs boson pair production in the $bar b au^+au^- :$ final state at $sqrt{s}$ = 13 TeV
Development of silicon pixel sensors for the High Luminosity upgrade of the CMS experiment at LHC and search for Higgs boson pair production in the $bar b au^+au^- :$ final state at $sqrt{s}$ = 13 TeV Open
Durante il mio percorso di dottorato mi sono occupato principalmente dello sviluppo di nuovi sensori a pixel in Silicio per l’upgrade dell’esperimento CMS in vista della fase ad alta luminosità del collisionatore LHC (HL – LHC o LHC fase 2…
View article: Characterization of planar and 3D Silicon pixel sensors for the high luminosity phase of the CMS experiment at LHC
Characterization of planar and 3D Silicon pixel sensors for the high luminosity phase of the CMS experiment at LHC Open
The High Luminosity upgrade of the CERN LHC collider (HL-LHC) demands for a new, high-radiation tolerant solid-state pixel sensor capable of surviving fluencies up to a few $10^{16}~ \\rm{n_{eq}/cm^2}$ at $\\sim 3 \\, \\rm{cm} $ from the i…
View article: Test beam characterization of irradiated 3D pixel sensors
Test beam characterization of irradiated 3D pixel sensors Open
Due to the large expected instantaneous luminosity, the future HL-LHC upgrade sets strong requirements on the radiation hardness of the CMS detector Inner Tracker. Sensors based on 3D pixel technology, with its superior radiation tolerance…
View article: Performances of highly irradiated 3d and planar pixel sensors interconnected to the RD53A readout chip
Performances of highly irradiated 3d and planar pixel sensors interconnected to the RD53A readout chip Open
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new highly radiation tolerant silicon pixel sensors, capable of withstanding fluences up to 2.3 × 1016 neq/cm2 (1 MeV equivalent neutrons). In this paper resu…
View article: R&D for new silicon pixel sensors for the High Luminosity phase of the CMS experiment at LHC
R&D for new silicon pixel sensors for the High Luminosity phase of the CMS experiment at LHC Open
The High Luminosity upgrade of the CERN LHC collider (HL-LHC) demands a new high-radiation-tolerant solid-state pixel sensor capable of surviving fluencies up to a few 10(16) n(eq)/cm(2) at similar to 3cm from the interaction point. To thi…
View article: Beam Test Results of Thin n-in-p 3D and Planar Pixel Sensors for the High Luminosity LHC Tracker Upgrade at CMS
Beam Test Results of Thin n-in-p 3D and Planar Pixel Sensors for the High Luminosity LHC Tracker Upgrade at CMS Open
This paper describes the development of new 3D and planar silicon pixel sensors designed for the Compact Muon Solenoid (CMS) Phase-2 Upgrade at High Luminosity LHC (HL-LHC). The project is funded by INFN and sensors are produced in collabo…
View article: Performance of new radiation tolerant thin n-in-p Silicon pixel sensors for the CMS experiment at High Luminosity LHC
Performance of new radiation tolerant thin n-in-p Silicon pixel sensors for the CMS experiment at High Luminosity LHC Open
The High Luminosity upgrade of the CERN-LHC (HL-LHC) demands for a new high-radiation tolerant solid- state pixel sensor capable of surviving fluencies up to a few 10 16 particles cm 2 at ∼3 cm from the interaction point. To this extent th…