Dao-Long Chen
YOU?
Author Swipe
View article: Effect of flip-chip ball grid array structure on capillary underfill flow
Effect of flip-chip ball grid array structure on capillary underfill flow Open
During the capillary underfill (CUF) process in flip-chip packaging, issues like incomplete filling, voids, wire sweeping, and overflow can impact product reliability and the relatively long filling time required. Therefore, finding ways t…
View article: Thermal Performance Enhancement of Dual Side Molding SiP Module for 5G Application
Thermal Performance Enhancement of Dual Side Molding SiP Module for 5G Application Open
The package structural System-in-Package (SiP) has been widely used for recent years. A substrate-based platform was proposed to place lots of heterogeneous components such as RF front-end modules, WiFi modules and passives into the smartp…
View article: Optimization of Thermal Design and Mold Flow Process for 3D SiP Structure
Optimization of Thermal Design and Mold Flow Process for 3D SiP Structure Open
With the advent of the 5G era, major package and testing plants have been taking frequent action recently. Obviously, with higher and higher performance requirements, SiP is a functional package integrated multiple functional chips, includ…
View article: A New <i>b</i> Value Estimation Method in Rock Acoustic Emission Testing
A New <i>b</i> Value Estimation Method in Rock Acoustic Emission Testing Open
The Gutenberg‐Richter (G‐R) relationship has been regarded as the fundamental description of the size distribution from large‐scale‐earthquake to small‐scale‐laboratory rock ruptures. However, because deviation from the G‐R relationship ha…