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View article: Composition Design of High-Entropy Alloys: A Brief Review
Composition Design of High-Entropy Alloys: A Brief Review Open
High-entropy alloys (HEAs) have attracted significant interest since their conceptualization in 2004, owing to their exceptional properties such as high strength, low-temperature fracture toughness and corrosion resistance. HEAs typically …
View article: Influence of sintering temperature on dicing performances of metal-bonded diamond blades on sapphire
Influence of sintering temperature on dicing performances of metal-bonded diamond blades on sapphire Open
A novel Ti–Al-Diamond metal matrix composite (MMC) material has been recently developed for fabricating diamond blade that is an indispensable tool for the mechanical dicing of optoelectronic devices. This work aims to achieve a deep under…
View article: Microstructure and Bonding Strength of Low-Temperature Sintered Ag/Nano-Ag Films/Ag Joints
Microstructure and Bonding Strength of Low-Temperature Sintered Ag/Nano-Ag Films/Ag Joints Open
Nano-Ag paste is one of the most widely used die-attachment materials in modern electronic devices, which are gaining continuously increasing application in transportation industries. The nano-Ag film in a pre-formed dimension and free fro…
View article: Superior Room Temperature Compressive Plasticity of Submicron Beta‐Phase Gallium Oxide Single Crystals
Superior Room Temperature Compressive Plasticity of Submicron Beta‐Phase Gallium Oxide Single Crystals Open
Bulk‐scale (01)‐oriented monoclinic beta‐phase gallium oxide (β‐Ga 2 O 3 ) single crystals are brittle and fracture at low compressive strains. Here, it is reported that submicron β‐Ga 2 O 3 pillars exhibit an exceptional room temperature …
View article: Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite
Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite Open
In this work, the reactive wetting and infiltration behaviors of a newly designed Sn-V binary alloy were comprehensively explored on porous graphite for the first time. It was discovered that 0.5 wt.% addition of V can obviously improve th…
View article: Deformation and removal of semiconductor and laser single crystals at extremely small scales
Deformation and removal of semiconductor and laser single crystals at extremely small scales Open
Semiconductor and laser single crystals are usually brittle and hard, which need to be ground to have satisfactory surface integrity and dimensional precision prior to their applications. Improvement of the surface integrity of a ground cr…
View article: Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys
Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys Open
Synthetic diamond is an important carbonous material that has widespread applications ranging from machine tools to the next-generation wafer of powder devices. Understanding of its wetting behaviours is therefore essential for the develop…
View article: Wettability and Interface Reaction of Sn-Cr powder alloy on Poly-crystalline Diamond (PCD)
Wettability and Interface Reaction of Sn-Cr powder alloy on Poly-crystalline Diamond (PCD) Open
In this work, the isothermal wetting of the Sn–Cr powder alloy containing 1.0, 2.0 and 4.0 wt.% Cr on Poly-crystalline diamond (PCD) substrates was investigated using a sessile drop method. The addition of active Cr significantly improved …