Edward O. Shaffer
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View article: Development of a Low-Dielectric-Constant Polymer for the Fabrication of Integrated Circuit Interconnect
Development of a Low-Dielectric-Constant Polymer for the Fabrication of Integrated Circuit Interconnect Open
For faster, smaller, and higher performance integrated circuits, a low dielectric constant insulator is required to replace silicon dioxide. Here the properties of a new dielectric—SiLK resin, a solution of a low-molecular-weight aromatic …
View article: Measuring/predicting the adhesion of polymeric coatings
Measuring/predicting the adhesion of polymeric coatings Open
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995.