Eric Chason
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View article: Kinetic model for stress in sputter-deposited alloy thin films and its application to the vanadium–tungsten alloy system
Kinetic model for stress in sputter-deposited alloy thin films and its application to the vanadium–tungsten alloy system Open
The use of thin films made of alloys, i.e., containing multiple metal species, can enhance their properties. However, as with single-element films, residual stress in the films can limit their performance. A model is proposed for relating …
View article: Elastic Modulus of Polycrystalline Halide Perovskite Thin Films on Substrates
Elastic Modulus of Polycrystalline Halide Perovskite Thin Films on Substrates Open
Using an innovative combination of multi-beam-optical stress-sensor (MOSS) curvature and X-ray diffraction (XRD) techniques, the Young's modulus (E) of polycrystalline MAPbI3 metal-halide perovskite (MHP) thin films attached to Si substrat…
View article: Understanding residual stress in thin films: Analyzing wafer curvature measurements for Ag, Cu, Ni, Fe, Ti, and Cr with a kinetic model
Understanding residual stress in thin films: Analyzing wafer curvature measurements for Ag, Cu, Ni, Fe, Ti, and Cr with a kinetic model Open
An analytical model for the evolution of residual stress in polycrystalline thin films is used to analyze numerous previously reported wafer curvature measurements obtained for a variety of materials and processing conditions. The model, w…
View article: Fundamental Investigations of Mechanical and Chemical Degradation Mechanisms in Lithium Ion Battery Materials (Final Technical Report)
Fundamental Investigations of Mechanical and Chemical Degradation Mechanisms in Lithium Ion Battery Materials (Final Technical Report) Open
The objective of our effort under the DOE EPSCoR Implementation grant is to establish a comprehensive and internationally recognized research program at Brown University and University of Rhode Island in understanding degradation mechanism…
View article: Determination of Stresses in Incrementally Deposited Films From Wafer-Curvature Measurements
Determination of Stresses in Incrementally Deposited Films From Wafer-Curvature Measurements Open
We report closed-form formulas to calculate the incremental-deposition stress, the elastic relaxation stress, and the residual stress in a finite-thickness film from a wafer-curvature measurement. The calculation shows how the incremental …
View article: The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni
The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni Open
Measurements were performed to study the influence of growth rate (plating current), grain size, and electrolyte concentration on stress evolution in Ni electrodeposited from an additive-free Ni sulfamate bath. The stress measurements were…
View article: Kinetic model for thin film stress including the effect of grain growth
Kinetic model for thin film stress including the effect of grain growth Open
Residual stress during thin film deposition is affected by the evolution of the microstructure. This can occur because subsurface grain growth directly induces stress in the film and because changing the grain size at the surface affects t…
View article: Review Article: Stress in thin films and coatings: Current status, challenges, and prospects
Review Article: Stress in thin films and coatings: Current status, challenges, and prospects Open
The issue of stress in thin films and functional coatings is a persistent problem in materials science and technology that has congregated many efforts, both from experimental and fundamental points of view, to get a better understanding o…
View article: DOE Final Report: A Unified Understanding of Residual Stress in Thin Films: Kinetic Models, Experiments and Simulations
DOE Final Report: A Unified Understanding of Residual Stress in Thin Films: Kinetic Models, Experiments and Simulations Open
Thin films are critical for a wide range of advanced technologies. However, the deposited films often have high levels of residual stress that can limit their performance or lead to failure. The stress is known to depend on many variables,…
View article: Epitaxial lift-off of electrodeposited single-crystal gold foils for flexible electronics
Epitaxial lift-off of electrodeposited single-crystal gold foils for flexible electronics Open
Lifting off gold films A method for growing and removing single-crystal gold films can be used to create a flexible and transparent substrate for devices. Mahenderkar et al. grew gold films on the face of a silicon wafer and then used phot…
View article: Numerical Solution of Moving Phase Boundary and Diffusion-Induced Stress of Sn Anode in the Lithium-Ion Battery
Numerical Solution of Moving Phase Boundary and Diffusion-Induced Stress of Sn Anode in the Lithium-Ion Battery Open
Here, we have previously observed a large transient stress in Sn film anodes at the beginning of the Sn-Li2Sn5 phase transformation. To understand this behavior, we use numerical modeling to simulate the kinetics of the 1-D moving boundary…
View article: Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models
Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models Open
Residual stress is a long-standing issue in thin film growth. Better understanding and control of film stress would lead to enhanced performance and reduced failures. In this work, we review how thin film stress is measured and interpreted…
View article: A kinetic model for stress generation in thin films grown from energetic vapor fluxes
A kinetic model for stress generation in thin films grown from energetic vapor fluxes Open
We have developed a kinetic model for residual stress generation in thin films grown from energetic vapor fluxes, encountered, e.g., during sputter deposition. The new analytical model considers sub-surface point defects created by atomic …
View article: <i>In-situ</i> synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation
<i>In-situ</i> synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation Open
We have performed X-ray synchrotron micro-diffraction measurements to study the processes controlling the formation of hillocks and whiskers in Sn layers on Cu. The studies were done in real-time on Sn layers that were electro-deposited im…
View article: Experimental Calibration of a Cahn-Hilliard Phase-Field Model for Phase Transformations in Li-Sn Electrodes
Experimental Calibration of a Cahn-Hilliard Phase-Field Model for Phase Transformations in Li-Sn Electrodes Open
Experiments, numerical simulations, and analytical calculations are used to\ncalibrate a diffuse-interface Cahn-Hilliard model of Li-Sn thin film electrodes\nthat experience a transformation from Sn to Li2Sn5. It is shown that a\nconcentra…