F. Nemouchi
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View article: Boron distribution in two-phase superconducting silicon-on-insulator by atom probe tomography
Boron distribution in two-phase superconducting silicon-on-insulator by atom probe tomography Open
We investigate with Atom Probe Tomography (APT) the distribution of boron in a thin superconducting Silicon-On-Insulator film (33 nm) obtained by high-dose ion implantation (2.5 × 1016 at/cm2) and single-pulse laser melting (160 ns). Only …
View article: Enhancing superconductivity in CoSi2 films with laser annealing
Enhancing superconductivity in CoSi2 films with laser annealing Open
Laser annealing was employed to trigger the solid-state reaction of a thin Co film (2.5 nm) with undoped Si. A metastable disilicide layer was obtained after one laser pulse close to the melt threshold. Its diffraction pattern, relaxed lat…
View article: Superconductivity in laser-annealed monocrystalline silicon films: The role of boron implant
Superconductivity in laser-annealed monocrystalline silicon films: The role of boron implant Open
33 nm thick silicon on insulator films were implanted with boron at high dose (1.5 × 1016 or 2.5 × 1016 at/cm2) and low energy (3 or 4 keV), then further annealed with 160 ns laser pulses. When the laser energy is set such as to lead to th…
View article: Feasibility of Wafer Exchange for European Edge AI Pilot Lines
Feasibility of Wafer Exchange for European Edge AI Pilot Lines Open
This paper compares the contamination monitoring of the three largest microelectronics research organizations in Europe, CEA-Leti, imec and Fraunhofer. The aim is to align the semiconductor infrastructure of the three research institutes t…
View article: Influence of dual Ge/C pre-amorphization implantation on the Ni1−Pt Si phase nucleation and growth mechanisms
Influence of dual Ge/C pre-amorphization implantation on the Ni1−Pt Si phase nucleation and growth mechanisms Open
View article: Superconducting V3Si for quantum circuit applications
Superconducting V3Si for quantum circuit applications Open
View article: Study of the Ti/InGaAs solid-state reactions: Phase formation sequence and diffusion schemes
Study of the Ti/InGaAs solid-state reactions: Phase formation sequence and diffusion schemes Open
View article: Integration of the Ni/InP system on a 300 mm platform for III-V/Si hybrid lasers
Integration of the Ni/InP system on a 300 mm platform for III-V/Si hybrid lasers Open
The integration of III-V/Si hybrid lasers on a 300 mm platform for photonic applications requires the development of dedicated CMOS-compatible contacts, for which nickel-based ones are very good candidates. In this scope, this work present…
View article: Building blocks of silicon photonics
Building blocks of silicon photonics Open
International audience
View article: Redistribution of phosphorus during Ni0.9Pt0.1-based silicide formation on phosphorus implanted Si substrates
Redistribution of phosphorus during Ni0.9Pt0.1-based silicide formation on phosphorus implanted Si substrates Open
Phosphorus diffusion and its distribution during the solid-state reactions between Ni0.9Pt0.1 and implanted Si substrates are studied. Silicidation is achieved through a first rapid thermal annealing followed by a selective etching and a d…
View article: Three-dimensional reciprocal-space map measurements for ultrathin polycrystalline materials
Three-dimensional reciprocal-space map measurements for ultrathin polycrystalline materials Open
The engineering of materials has a significant importance in the miniaturization of microelectronic devices considering the fact that many mechanical and electronic properties of devices are strongly dependent on the coexistent phases and …
View article: Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM
Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM Open
View article: Phase formation sequence in the Ti/InP system during thin film solid-state reactions
Phase formation sequence in the Ti/InP system during thin film solid-state reactions Open
The metallurgical properties of the Ti/InP system meet a great interest for its use as a contact in the scope of various applications such as the Si Photonics. The investigations conducted on this system highlight the initiation of a react…
View article: Ultra-thin dielectric insertions for contact resistivity lowering in advanced CMOS: Promises and challenges
Ultra-thin dielectric insertions for contact resistivity lowering in advanced CMOS: Promises and challenges Open
International audience
View article: Reaction of Ni film with In0.53Ga0.47As: Phase formation and texture
Reaction of Ni film with In0.53Ga0.47As: Phase formation and texture Open
The solid-state reaction between Ni and In0.53Ga0.47As on an InP substrate was studied by X-ray diffraction (XRD) and scanning transmission electron microscopy-energy-dispersive X-ray spectroscopy techniques. Due to the monocrystalline str…
View article: Contacts for monolithic 3D architecture: Study of Ni0.9Co0.1 silicide formation
Contacts for monolithic 3D architecture: Study of Ni0.9Co0.1 silicide formation Open
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View article: Towards contact integration for III–V/Silicon heterogeneous photonics devices
Towards contact integration for III–V/Silicon heterogeneous photonics devices Open
International audience
View article: Study of the formation and degradation of intermetallics formed by solid-state reaction of Ni on InGaAs
Study of the formation and degradation of intermetallics formed by solid-state reaction of Ni on InGaAs Open
International audience
View article: Étude de la texture cristallographique de composés intermétalliques obtenus par réaction à l’état solide entre un film mince de Ni et un substrat InGaAs/Si
Étude de la texture cristallographique de composés intermétalliques obtenus par réaction à l’état solide entre un film mince de Ni et un substrat InGaAs/Si Open
International audience
View article: In situ cleaning of InGaAs surfaces prior to low contact resistance metallization
In situ cleaning of InGaAs surfaces prior to low contact resistance metallization Open
View article: Cleaning of InGaAs and InP Layers for Nanoelectronics and Photonics Contact Technology Applications
Cleaning of InGaAs and InP Layers for Nanoelectronics and Photonics Contact Technology Applications Open
InGaAs and InP layers were treated by using Ar and He direct plasmas coupled with wet chemical treatments. InP surfaces are more sensitive to the various treatments than the InGaAs ones. Suitable and efficient treatments have been proposed…
View article: InGaAs surface pretreatment prior to metal solid-state reactions for low resistance contacts
InGaAs surface pretreatment prior to metal solid-state reactions for low resistance contacts Open
International audience
View article: Influence of the substrate on the solid-state reaction of ultra-thin Ni film with a In<inf>0.53</inf>Ga<inf>0.47</inf>As under-layer by means of full 3D reciprocal space mapping
Influence of the substrate on the solid-state reaction of ultra-thin Ni film with a In0.53Ga0.47As under-layer by means of full 3D reciprocal space mapping Open
International audience
View article: In situ cleaning/passivation of surfaces for contact technology on III-V materials
In situ cleaning/passivation of surfaces for contact technology on III-V materials Open
International audience