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View article: ATLASPix3 serial powering and multi-chip module studies for future HV-CMOS tracker
ATLASPix3 serial powering and multi-chip module studies for future HV-CMOS tracker Open
High voltage CMOS pixel sensors are proposed in many future particle physics experiments such as the HL-LHC upgrades and future circular colliders. The ATLASPix3 chip consists of 49104 pixels of dimension 50 μm × 150 μm, realised in 180 nm…
View article: Development of a test system for data links of the ATLAS Inner Tracker (ITk) upgrade silicon pixel detector
Development of a test system for data links of the ATLAS Inner Tracker (ITk) upgrade silicon pixel detector Open
This contribution introduces a novel test system developed to evaluate the signal transmission quality in high-speed data links for the 2026 Inner Tracker (ITk) upgrade of the ATLAS experiment. Using an FPGA-based data acquisition (DAQ) fr…
View article: Development of a Test System for Data Links of the ATLAS Inner Tracker (ITk) Upgrade Silicon Pixel Detector
Development of a Test System for Data Links of the ATLAS Inner Tracker (ITk) Upgrade Silicon Pixel Detector Open
This contribution introduces a novel test system developed to evaluate the signal transmission quality in high-speed data links for the 2026 Inner Tracker (ITk) upgrade of the ATLAS experiment. Using an FPGA-based data acquisition (DAQ) fr…
View article: The ATLASPix3.1 CMOS pixel sensor testbeam performance and serial powering characterisation
The ATLASPix3.1 CMOS pixel sensor testbeam performance and serial powering characterisation Open
High-voltage CMOS (HV-CMOS) pixel technology is being considered for future Higgs factory experiments. The ATLASPix3.1 chip, with a pitch of 50 μm × 150 μm, fabricated using TSI 180 nm HV-CMOS technology, is a full reticle-size monolithic …