G. Traversi
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View article: Performance results of the first version of the MIZAR ASIC for the PBR mission
Performance results of the first version of the MIZAR ASIC for the PBR mission Open
The Multi-channel Intergrated Zone-sampling Analogue-memory based Readout (MIZAR) ASIC is a new type of front-end electronics which has been developed for the detection of the optical Cherenkov signals by Extensive Air Showers directly obs…
View article: ASIX: Single-photon, energy resolved X-ray imaging with 50 μm hexagonal hybrid pixel
ASIX: Single-photon, energy resolved X-ray imaging with 50 μm hexagonal hybrid pixel Open
The Analog Spectral Imager for X-rays is a technology demonstrator of a small-pixel Hybrid Pixel Detector (HPD) designed for applications such as X-ray diffraction, synchrotron-based material science, and soft X-ray astrophysics requiring …
View article: Upgrade of the Belle II Vertex Detector with Depleted Monolithic Active Pixel Sensors
Upgrade of the Belle II Vertex Detector with Depleted Monolithic Active Pixel Sensors Open
The Belle II experiment, operating at the SuperKEKB e + e - collider, is developing a new pixelated vertex detector (VTX) to handle an higher luminosity, up to 6 × 10 35 cm -2 s -1 . The VTX will feature 5–6 layers, with a material budget …
View article: Performance Results of the first version of the MIZAR ASIC for the PBR mission
Performance Results of the first version of the MIZAR ASIC for the PBR mission Open
View article: ARCADIA fully depleted CMOS MAPS development with LFoundry 110 nm CIS
ARCADIA fully depleted CMOS MAPS development with LFoundry 110 nm CIS Open
Fully depleted CMOS sensors represent a significant step forward in radiation detection, combining the advantages of monolithic active pixel sensors with the enhanced signal collection efficiency of depleted bulk materials. The ARCADIA Col…
View article: Upgrade of the Belle II vertex detector with depleted monolithic CMOS active pixel sensors
Upgrade of the Belle II vertex detector with depleted monolithic CMOS active pixel sensors Open
International audience
View article: A 28 nm CMOS front-end circuit with in-pixel flash ADC for high-rate hybrid detectors
A 28 nm CMOS front-end circuit with in-pixel flash ADC for high-rate hybrid detectors Open
View article: OBELIX: A monolithic pixel sensor with triggered readout for the Belle II upgrade
OBELIX: A monolithic pixel sensor with triggered readout for the Belle II upgrade Open
View article: RD53 pixel readout integrated circuits for ATLAS and CMS HL-LHC upgrades
RD53 pixel readout integrated circuits for ATLAS and CMS HL-LHC upgrades Open
The RD53 collaboration has since 2013 developed new hybrid pixel detector chips with 50 × 50 μm 2 pixels for the HL-LHC upgrades of the ATLAS and CMS experiments at CERN. A common architecture, design and verification framework has been de…
View article: The DMAPS upgrade of the Belle II Vertex Detector
The DMAPS upgrade of the Belle II Vertex Detector Open
International audience
View article: A Time-over-Threshold asynchronous front-end in 28 nm CMOS for the readout of pixel detectors in extreme radiation environments
A Time-over-Threshold asynchronous front-end in 28 nm CMOS for the readout of pixel detectors in extreme radiation environments Open
This work describes the design, in a 28 nm CMOS technology, of a front-end channel for the readout of pixel sensors in future particle accelerators. The channel being developed leverages the Time-Over-Threshold technique for the numerical …
View article: The OBELIX chip for the Belle II VTX upgrade
The OBELIX chip for the Belle II VTX upgrade Open
International audience
View article: 28 nm front-end channels for the readout of pixel sensors in future high-rate applications
28 nm front-end channels for the readout of pixel sensors in future high-rate applications Open
This work is concerned with the design and the characterization of front-end channels, developed in a 28 nm CMOS technology, conceived for the readout of pixel sensors in future, high-rate applications at the next generation facilities. Tw…
View article: Austrochip 2023 Panel Discussion
Austrochip 2023 Panel Discussion Open
Detectors of future High Energy Physics (HEP) experiments will require advanced pixel readout processors to be operated in environments with unprecedented levels of radiation and particle rates.The 28 nm CMOS process is the major commercia…
View article: A synchronous comparator architecture for the design of deadtimeless front-ends in high-rate pixellated detectors
A synchronous comparator architecture for the design of deadtimeless front-ends in high-rate pixellated detectors Open
High-rate, pixellated detectors in present and future particle tracking applications call for advanced front-end circuits enabling the efficient readout of the signals delivered by the sensor. A compact, synchronous comparator enabling the…
View article: Development and Testing of a Miniaturized Platform for Photoplethysmography
Development and Testing of a Miniaturized Platform for Photoplethysmography Open
This paper presents the design and characterization of a miniaturized wearable electronic system for photoplethysmography. The system is conceived with the purpose of monitoring people during their normal duties or during physical activity…
View article: A Charge Sensitive Amplifier in a 28 nm CMOS Technology for Pixel Detectors at Future Particle Colliders
A Charge Sensitive Amplifier in a 28 nm CMOS Technology for Pixel Detectors at Future Particle Colliders Open
This paper is concerned with the design of a Charge Sensitive Amplifier (CSA) in a 28 nm CMOS technology. The CSA discussed in this work is conceived for High Energy Physics (HEP) experiments at next-generation colliders, where pixel detec…
View article: Characterization and verification of the Shunt-LDO regulator and its protection circuits for serial powering of the ATLAS and CMS pixel detectors
Characterization and verification of the Shunt-LDO regulator and its protection circuits for serial powering of the ATLAS and CMS pixel detectors Open
The Shunt-LDO regulator has been integrated in the ATLAS and the CMS pixel detector RD53 front-end chip to implement the serial powering scheme which both experiments have chosen as the baseline option for the HL-LHC upgrade. The performan…
View article: Winter: A Novel Low Power Modular Platform for Wearable and IoT Applications
Winter: A Novel Low Power Modular Platform for Wearable and IoT Applications Open
View article: Classification of Essential Tremor and Parkinson’s Tremor Based on a Low-Power Wearable Device
Classification of Essential Tremor and Parkinson’s Tremor Based on a Low-Power Wearable Device Open
Among movement disorders, essential tremor is by far the most common, as much as eight times more prevalent than Parkinson’s disease. Although these two conditions differ in their presentation and course, clinicians do not always recognize…
View article: RD53 analog front-end processors for the ATLAS and CMS experiments at the High-Luminosity LHC
RD53 analog front-end processors for the ATLAS and CMS experiments at the High-Luminosity LHC Open
This work discusses the design and the main results relevant to the characterization of analog front-end processors in view of their operation in the pixel detector readout chips of ATLAS and CMS at the High-Luminosity LHC. The front-end c…
View article: Design and test of current-mode DACs for threshold tuning of front-end channels for the High Luminosity LHC
Design and test of current-mode DACs for threshold tuning of front-end channels for the High Luminosity LHC Open
This work is concerned with the design and the characterization of digital-to-analog current converters, developed in a 65 nm CMOS technology, conceived for threshold tuning of front-end channels at the High-Luminosity LHC experiment upgra…
View article: Stabilization and Protection of the Shunt-LDO regulator for the HL-LHC pixel detector upgrades
Stabilization and Protection of the Shunt-LDO regulator for the HL-LHC pixel detector upgrades Open
Serial powering is the baseline option for the pixel detectors in both the ATLAS and the CMS experiments targeting the phase II HL-LHC upgrade. The Shunt-LDO regulator is integrated in the front-end chips to generate the required supply vo…
View article: RD53A: a large scale prototype for HL-LHC silicon pixel detector phase 2 upgrades
RD53A: a large scale prototype for HL-LHC silicon pixel detector phase 2 upgrades Open
The Phase 2 upgrades of silicon pixel detectors at HL-LHC experiments feature extreme require- ments, such as: 50x50 μm pixels, high rate (3 GHz/cm2), unprecedented radiation levels (1 Grad), high readout speed and serial powering. As a co…
View article: Algorithms for Threshold Dispersion Minimization of the CHIPIX65 Asynchronous Front-End
Algorithms for Threshold Dispersion Minimization of the CHIPIX65 Asynchronous Front-End Open
This work discusses four different algorithms for the minimization of threshold dispersion inmultichannel readout circuits for pixel detectors. These algorithms, which are based on differentmethods (e.g. charge scans, threshold scans, etc)…
View article: Signal and Noise Performance of a 110-nm CMOS Technology for Photon Science Applications
Signal and Noise Performance of a 110-nm CMOS Technology for Photon Science Applications Open
This paper presents a study of the noise behavior of MOSFET devices belonging to a 110-nm CMOS technology in view of applications to the design of low-noise, low-power analog circuits in X-ray detection at free electron lasers (FELs) and t…
View article: Test results and prospects for RD53A, a large scale 65 nm CMOS chip for pixel readout at the HL-LHC
Test results and prospects for RD53A, a large scale 65 nm CMOS chip for pixel readout at the HL-LHC Open
View article: First test results of the CHIPIX65 asynchronous front-end connected to a 3D sensor
First test results of the CHIPIX65 asynchronous front-end connected to a 3D sensor Open
View article: Phase-II Associative Memory ASIC Specifications
Phase-II Associative Memory ASIC Specifications Open
This documents defines the specifications for the Associative Memory ASIC for Phase-II. The work-flow toward the final ASIC is organized in the following three steps • AM08 prototype: small area MPW prototype to test all the full custom fe…
View article: Characterization of SLVS Driver and Receiver in a 65 nm CMOS Technology for High Energy Physics Applications
Characterization of SLVS Driver and Receiver in a 65 nm CMOS Technology for High Energy Physics Applications Open
This work is concerned with the design and characterization of an SLVS transmitter/receiver pair,to be used for I/O links in High Energy Physics applications. Core transistors with a powersupply of 1.2 V have been considered in the design …