Hiroshi Makibuchi
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View article: XPS Investigation of Diffusion-Bonded Homogeneous Cu-Cu and Heterogeneous Cu-Al Junctions
XPS Investigation of Diffusion-Bonded Homogeneous Cu-Cu and Heterogeneous Cu-Al Junctions Open
Diffusion bonding is an excellent technology, and it is expected to open new fields of application. To further develop diffusion bonding technology, it is necessary to investigate the inter-diffusion phenomena that occur at the atomic leve…