Hongze Zhang
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View article: Numerical simulation study on bed combustion of waste incinerator in the alpine region
Numerical simulation study on bed combustion of waste incinerator in the alpine region Open
To optimize the layer combustion effect of the waste incinerator in the alpine region, the numerical simulation of a 750t/d waste incinerator in the alpine region in the three northeastern provinces of China was conducted based on the FLIC…
View article: A Low-temperature Ta<sub>2</sub>O<sub>5</sub> Thin-film Fabricating Method of Integrated MIM Capacitors for Packages with Different Substrates
A Low-temperature Ta<sub>2</sub>O<sub>5</sub> Thin-film Fabricating Method of Integrated MIM Capacitors for Packages with Different Substrates Open
Metal-insulator-metal (MIM) capacitors with high capacitance densities are essential for integrated passive device (IPD). Achieving such densities typically requires complex processes within precisely controlled environments and the use of…
View article: Fabrication of Surface Acoustic Wave Biosensors Using Nanomaterials for Biological Monitoring
Fabrication of Surface Acoustic Wave Biosensors Using Nanomaterials for Biological Monitoring Open
Biosensors are a new type of sensor that utilize biologically sensitive materials and microbially active analytes to measure a variety of biological signals. The purpose of monitoring is achieved by combining these sensitive materials with…
View article: Thermal-Mechanical Property of High Aspect Ratio TSV in Advanced IC integration and Packaging
Thermal-Mechanical Property of High Aspect Ratio TSV in Advanced IC integration and Packaging Open
Advanced packaging of integrated circuits (IC) plays a critical role on the way towards high performance, high density, low power consumption and light weight of electronics. Through-silicon vias (TSV) is the heart of 3D IC integration and…
View article: Al-Sn-Al Bonding Strength Investigation Based on Deep Learning Model
Al-Sn-Al Bonding Strength Investigation Based on Deep Learning Model Open
Al-Sn-Al wafer bonding is a new semiconductor manufacturing technology that plays an important role in device manufacturing. Optimization of the bonding process and testing of the bonding strength remain key issues. However, using only phy…
View article: Microfluidic Silicon Interposer for Thermal Management of Gan Device Integration
Microfluidic Silicon Interposer for Thermal Management of Gan Device Integration Open
View article: Research Progress of Surface Activated Bonding at Room Temperature
Research Progress of Surface Activated Bonding at Room Temperature Open
：With the demand increase of low temperature wafer bonding technology in the semiconductor field, surface activated bonding (SAB) technology has been extensively studied.Compared with other bonding methods, SAB can achieve a strong bonding…
View article: Cost-Effective Copper–Nickel-Based Triboelectric Nanogenerator for Corrosion-Resistant and High-Output Self-Powered Wearable Electronic Systems
Cost-Effective Copper–Nickel-Based Triboelectric Nanogenerator for Corrosion-Resistant and High-Output Self-Powered Wearable Electronic Systems Open
Recent years, triboelectric nanogenerators (TENGs) have attracted increased attention from researchers worldwide. Owing to their conductivity and triboelectric characteristics, metal materials can be made as both triboelectric materials an…
View article: Starch Paper-Based Triboelectric Nanogenerator for Human Perspiration Sensing
Starch Paper-Based Triboelectric Nanogenerator for Human Perspiration Sensing Open
A disposable and ecofriendly starch paper was used to fabricate a triboelectric nanogenerator (TENG) for the sensing of human perspiration. Using cost-effective and commercially accessible materials, the starch paper-based TENG (S-TENG) ca…
View article: Pencil-on-Paper Sensor for Water Detection
Pencil-on-Paper Sensor for Water Detection Open
This paper sets out a simple and affordable method for the manufacture of a water sensor involving drawing marks on paper using a flexible pencil. The sensor indicates flexible endurance variations upon exposure to water or a drying surfac…