How Yuan Hwang
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View article: <i>μ</i> W-level green light generation via quasi- and modal-phase-matched lithium niobate waveguides
<i>μ</i> W-level green light generation via quasi- and modal-phase-matched lithium niobate waveguides Open
Nonlinear frequency conversion in thin-film lithium niobate (TFLN) is a promising method for visible light generation. In particular, efficient green light generation remains challenging due to the lack of direct gain media, making nonline…
View article: Photonic Molecules via Coupled Thin-Film Lithium Niobate Fabry-Pérot Photonic Crystal Micro-resonators
Photonic Molecules via Coupled Thin-Film Lithium Niobate Fabry-Pérot Photonic Crystal Micro-resonators Open
We demonstrate a photonic molecule platform based on photonic crystal (PhC) Fabry-Pérot micro-resonators on thin-film lithium niobate, featuring standing-wave resonances confined between PhC mirrors. By adjusting the number of PhC unit cel…
View article: Integrated bright source of polarization-entangled photons using lithium niobate photonic chips
Integrated bright source of polarization-entangled photons using lithium niobate photonic chips Open
Quantum photonics has rapidly advanced as a key area for developing quantum technologies by harnessing photons' inherent quantum characteristics, particularly entanglement. Generation of entangled photon pairs, known as Bell states, is cru…
View article: High-Q photonic crystal Fabry-Perot micro-resonator in thin-film lithium niobate
High-Q photonic crystal Fabry-Perot micro-resonator in thin-film lithium niobate Open
Thin-film lithium niobate (TFLN) has emerged as a powerful platform for integrated nonlinear and quantum photonics, owing to its strong optical nonlinearities, wide transparency window, and electro- and piezo-optic properties. However, con…
View article: Fabrication of a 3D mode size converter for efficient edge coupling in photonic integrated circuits
Fabrication of a 3D mode size converter for efficient edge coupling in photonic integrated circuits Open
We demonstrate efficient edge couplers by fabricating a 3D mode size converter on a lithium niobate-on-insulator photonic platform. The 3D mode size converter is fabricated using an etching process that employs a Si external mask to provid…
View article: Etching-Free Fabrication and Integration of 45° Micro-Mirror for Surface-Compatible Photonic Packaging
Etching-Free Fabrication and Integration of 45° Micro-Mirror for Surface-Compatible Photonic Packaging Open
we demonstrate how micro-mirrors can enable surface-normal coupling of light to a photonic integrated circuit (PIC) equipped with edge couplers. Most micro-mirrors are fabricated using etching techniques with a crystallographic direction d…
View article: Silicon Photonic MEMS: Exploiting Mechanics at the Nanoscale to Enhance Photonic Integrated Circuits
Silicon Photonic MEMS: Exploiting Mechanics at the Nanoscale to Enhance Photonic Integrated Circuits Open
With the maturing and the increasing complexity of Silicon Photonics technology, novel avenues are pursued to reduce power consumption and to provide enhanced functionality: exploiting mechanical movement in advanced Silicon Photonic Integ…
View article: Co-optimizing grating couplers for hybrid integration of InP and SOI photonic platforms
Co-optimizing grating couplers for hybrid integration of InP and SOI photonic platforms Open
Grating couplers are widely used optical interfaces in integrated photonics, especially on the Silicon-On-Insulator (SOI) platform. Their design has been optimized for coupling light between a Photonic Integrated Circuit (PIC) and a single…
View article: Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre
Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre Open
We report on the flip chip packaging of Micro-Electro-Mechanical System (MEMS)-based digital silicon photonic switching device and the characterization results of 12 × 12 switching ports. The challenges in packaging N2 electrical and 2N op…
View article: Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices
Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices Open
Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-P…