Explanipedia

Rice phyllospheric Pantoea spp. suppress blast and bacterial blight diseases Open

Wenda Sun, Qiao Liu, Huilin Chen, Xiaofang Xie, Zhuan Zhang , et al. · 2025

Overall, this study established a microbiome method for identifying the rice bacterial communities of agricultural significance, with capacity of rice disease management and/or growth promotion.

Chevrel Phase Materials: Advances in Synthesis and Thermoelectric Applications Open

Zhenyu Chen, Zong Ming Jiang, Shengnan Zhang, Botao Shao, Chengshan Li , et al. · 2025

This review provides a comprehensive overview of the recent advancements in the synthesis and thermoelectric properties of Chevrel phase (CP) composites. CPs have garnered significant attention due to their unique crystal structure and pot…

Ultra-low limit of detection of a carcinoembryonic antigen fiber sensor based on microfiber Open

Jinlong Wan, Senyu Wang, Sirong Zhou, Hongbo Qiu, Rongguo Lu , et al. · 2025

Fiber optic sensors have been widely applied to address issues such as cardiovascular diseases, pathogen detection, and cancer biomarker detection. In this work, an ultra-low limit of detection, high-specificity, and label-free optical fib…

Solute-induced precipitation nanosized Ti-rich phase greatly enhances the plasticity of Mo-Ti-Zr alloys Open

Shilei Li, Ping Hu, Hairui Xing, Fengxiang Wang, Wen Zhang , et al. · 2025

RETRACTED: Harnessing the power of AI and IoT for real-time CO2 emission monitoring Open

Kaizhe Fan, Quanjun Li, 真理子設楽, Qian Li, Jianfeng Li , et al. · 2024

A tracking control method for electricity-carbon emission forecasting Open

Hongyin Chen, Songcen Wang, Jianfeng Li, Yaoxian Yu, Dezhi Li , et al. · 2024

Pose Estimation Based on Bidirectional Visual–Inertial Odometry with 3D LiDAR (BV-LIO) Open

Gang Peng, Qiang Gao, Xu Yue, Jianfeng Li, Dengyin Zhang , et al. · 2024

Due to the limitation of a single sensor such as only camera or only LiDAR, the Visual SLAM detects few effective features in the case of poor lighting or no texture. The LiDAR SLAM will also degrade in an unstructured environment and open…

Thermal Design of Stacked Power Modules for Electric Drive Applications Open

Jianfeng Li, Yuekang Du, Xingzhi Wang, Liangjie Liu, Yong Pang , et al. · 2024

This paper reports the thermal design of a stacked arrangement inserting four IGBT modules between five heat sinks to achieve good cooling performance while enabling them to be installed into the limited space. Such stacked four IGBT modul…

NOVEL INSTRUMENTATION FOR THE MEASUREMENT OF THE UNSTEADY PRESSURE DISTRIBUTION AROUND A WING UNDERGOING STALL FLUTTER OSCILLATIONS Open

Jianfeng Li, Grigorios Dimitriadis, Fan Gu, Q CHEN · 2023

Review of the design of power ultrasonic generator for piezoelectric transducer Open

Kuan Zhang, Guofu Gao, Chongyang Zhao, Yi Wang, Yan Wang , et al. · 2023

The power ultrasonic generator (PUG) is the core device of power ultrasonic technology (PUT), and its performance determines the application of this technology in biomedicine, semiconductor, aerospace, and other fields. With the high deman…

A Tracking Control Method for Electricity-Carbon Emission Forecasting Open

Hongyin Chen, Songcen Wang, Jianfeng Li, Yaoxian Yu, Dezhi Li , et al. · 2023

EFFECTS OF CONSTITUTIVE MODE L PARAMETERS ON FINITE ELEMENT SIMULATION PROCESS FOR HARD M ILLING OF AISI H13 STEEL Open

S. Zhang, Biao Li, Jianfeng Li, Jia Man · 2021

During the metal cutting process, finite element (FE) simulation has been acknowledged as an efficient way to provide designers more in-depth understanding. Furthermore, constitutive model parameters of the experimental material play a cru…

Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process Open

Jingru Dai, Jianfeng Li, Pearl Agyakwa, Martin Corfield, C. Mark Johnson · 2021

This study investigates the power cycling reliability of nanosilver sintered joints formed by a time-reduced sintering process, designed for use on a die bonder. A range of sintering parameters, reflecting different levels of manufacturabi…

Erosion wear behavior of NiCr+Cr3C2–NiCr coating under multi–impact angle and novel coating structure design Open

Haiyang Lu, Yanle Li, Fangyi Li, Jianfeng Li, Liming Wang , et al. · 2021

Peer Review #1 of "Data-driven remaining useful life prediction based on domain adaptation (v0.2)" Open

Wen Bingcheng, Ming Xiao, Xue Qi Wang, Xin Zhao, Jianfeng Li , et al. · 2021

As an important part of prognostics and health management, remaining useful life (RUL) prediction can provide users and managers with system life information and improve the reliability of maintenance systems.Data-driven methods are powerf…

Peer Review #1 of "Data-driven remaining useful life prediction based on domain adaptation (v0.1)" Open

Wen Bingcheng, Ming Xiao, Xue Qi Wang, Xin Zhao, Jianfeng Li , et al. · 2021

As an important part of prognostics and health management, remaining useful life (RUL) prediction can provide users and managers with system life information and improve the reliability of maintenance systems.Data-driven methods are powerf…

Characterization of Carbonaceous Deposits on an End-of-Life Engines for Effective Cleaning for Remanufacturing Open

Xing Wang, Jianfeng Li, Xiujie Jia, Mingliang Ma, Yuan Ren · 2021

Remanufacturing is one of the most effective strategies to achieve sustainable manufacturing and restore the performance of end-of-life products. However, the lack of an effective cleaning method to clean carbonaceous deposits severely ham…

Enhanced mechanical properties, water resistance, thermal stability, and biodegradation of the starch-sisal fibre composites with various fillers Open

Maocheng Ji, Fangyi Li, Jianyong Li, Jianfeng Li, Chuanwei Zhang , et al. · 2020

The poor performance and high cost of the starch-sisal fibre composites with open-cell structures prevent their usage as biodegradable biomass to replace plastics. Therefore, inorganic fillers [talcum powder (TP), CaCO3 (CC)] and a bio-fil…

Applications of Neural Networks for Spectrum Prediction and Inverse Design in the Terahertz Band Open

Jianfeng Li, Yingzhan Li, Yi Cen, Chao Zhang, Tao Luo , et al. · 2020

Terahertz wave has attracted significant attention in recent years, and terahertz devices have been applied in various fields. However, the complicated and time-consuming spectrum prediction and structure design issues have hindered the wi…

Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process Open

Jingru Dai, Jianfeng Li, Pearl Agyakwa, Martin Corfield, C. Mark Johnson · 2020

Application status and technical analysis of chitosan-based medical dressings: a review Open

Shanguo Zhang, Jianyong Li, Jianfeng Li, Na Du, Donghai Li , et al. · 2020

Chitosan has wide applications in the field of medical dressings due to its good biomedical properties.

Research on sensitivity analysis of wind power consumption capability of integrated energy system based on unified optimal power flow model Open

Yongqiang Mu, Chunsheng Wang, Guangyou Kang, Zheng Wang, Tao Jiang , et al. · 2019

A sensitivity analysis method for the wind power capacity of integrated energy systems based on unified optimal power flow is proposed, aiming at the large‐scale grid‐connected wind power problem of integrated energy systems with multiple …

Effects of magnesium hydroxide on the properties of starch/plant fiber composites with foam structure Open

Jinfeng Cui, Fangyi Li, Jianyong Li, Jianfeng Li, Chuanwei Zhang , et al. · 2019

The process and the property of starch-based composite.

Investigation on the effect of laser remelting for laser cladding nickel based alloy Open

Yanzhe Zhao, Jie Sun, Kai Guo, Jianfeng Li · 2018

Laser cladding is a recently developed additive manufacturing technique which is widely used in remanufacturing and sustainable manufacturing fields. However, the surface roughness of laser cladding layer often fails to meet the tribologic…

Packaging technology for a highly integrated 10kV SiC MOSFET module Open

Bassem Mouawad, Christina Di Marino, Jianfeng Li, Robert Skuriat, C. Mark Johnson · 2018

High-voltage SiC devices offer an attractive combination of fast switching and low losses, giving application users unprecedented levels of flexibility in choice of topology and control strategy for medium- and high-voltage power conversio…

Cost Effective Direct-Substrate Jet Impingement Cooling Concept for Power Application Open

Bassem Mouawad, Robert Abebe, Robert Skuriat, Jianfeng Li, Liliana De Lillo , et al. · 2018

Direct substrate jet impingement cooling can eliminate the use of the baseplate and significantly reduce the weight and volume of conventional thermal management solutions. This work demonstrates a cost-effective manufacturing approach bas…

Multi-Chip SiC MOSFET Power Modules for Standard Manufacturing, Mounting and Cooling Open

Alberto Castellazzi, Asad Fayyaz, Emre Gurpinar, Abdallah Hussein, Jianfeng Li , et al. · 2018

Taking full advantage of the superior characteristics of SiC Power MOSFETs in the application requires the development of bespoke packaging solutions. Their design needs to thoroughly encompass electromagnetic and electro-thermal aspects t…

Development of a highly integrated 10 kV SiC MOSFET power module with a direct jet impingement cooling system Open

Bassem Mouawad, Robert Skuriat, Jianfeng Li, C. Mark Johnson, Christina DiMarino · 2018

This paper presents a novel, highly integrated packaging design for Wolfspeed’s 10 kV SiC MOSFETs. These devices offer faster switching performance and lower losses than silicon devices. However, it has been shown that the package can have…

Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling Open

Jingru Dai, Jianfeng Li, Pearl Agyakwa, Martin Corfield, C. Mark Johnson · 2018

13.5 mm × 13.5 mm sintered nano-silver attachments for power devices onto AlN substrates were prepared at 250 ºC and a pressure of 10MPa for 5 minutes and compared with Pb5Sn solder joint die attachments under constant current power cyclin…

Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints Open

Jianfeng Li, Jingru Dai, C. Mark Johnson · 2018

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