J. Franco
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View article: Low-frequency noise characteristics of waveguide-integrated lateral and vertical Ge-on-Si p–i–n photodiodes
Low-frequency noise characteristics of waveguide-integrated lateral and vertical Ge-on-Si p–i–n photodiodes Open
We report forward bias and temperature-dependent low-frequency (LF) noise characteristics of waveguide-integrated Ge-on-Si p–i–n photodiodes across three architectures: doped-Si lateral, doped-Ge and doped-Si lateral, and vertical heteroju…
View article: Characterization of Extended Gamma-Ray Sources with SWGO: Morphological Models and Detection Techniques.
Characterization of Extended Gamma-Ray Sources with SWGO: Morphological Models and Detection Techniques. Open
View article: Molecularly defined auditory neuron subtypes show different vulnerabilities to noise- and age-related synaptopathy in mice
Molecularly defined auditory neuron subtypes show different vulnerabilities to noise- and age-related synaptopathy in mice Open
Neuronal subtype-specific synaptopathy is a hallmark of many forms of neurodegeneration. We examined the cellular basis for synaptic vulnerability in the auditory system, where three subtypes of spiral ganglion neurons (SGNs)—Ia, Ib, and I…
View article: Positive Bias Temperature Instability (PBTI) in n- and p-Channel Polysilicon Thin-Film Transistors (TFTs) for High-Voltage Applications
Positive Bias Temperature Instability (PBTI) in n- and p-Channel Polysilicon Thin-Film Transistors (TFTs) for High-Voltage Applications Open
View article: Characterization of DC performance and low-frequency noise of an array of nMOS Forksheets from 300 K to 4 K
Characterization of DC performance and low-frequency noise of an array of nMOS Forksheets from 300 K to 4 K Open
The DC and low-frequency noise performance of an array of 800 parallel Forksheet MOSFETs were investigated by performing measurements over a wide temperature range from 300 K to 4 K. The array structure allowed to measure a representative …
View article: Characterization and Advanced Modeling of Dielectric Defects in Low-Thermal Budget RMG MOSFETs Using 1/<i>f</i> Noise Analysis
Characterization and Advanced Modeling of Dielectric Defects in Low-Thermal Budget RMG MOSFETs Using 1/<i>f</i> Noise Analysis Open
This study presents a comprehensive investigation of defects in the gate-stack of low-thermal budget replacement metal gate (RMG) MOSFETs treated with novel dielectric passivation techniques using 1/ f noise characterization and advanc…
View article: Probing Band Tail States in MOSFETs at Cryogenic Temperatures through Noise Spectroscopy
Probing Band Tail States in MOSFETs at Cryogenic Temperatures through Noise Spectroscopy Open
View article: Investigating the correlation between interface and dielectric trap densities in aged p-MOSFETs using current-voltage, charge pumping, and 1/f noise characterization techniques
Investigating the correlation between interface and dielectric trap densities in aged p-MOSFETs using current-voltage, charge pumping, and 1/f noise characterization techniques Open
View article: Comphy v3.0—A compact-physics framework for modeling charge trapping related reliability phenomena in MOS devices
Comphy v3.0—A compact-physics framework for modeling charge trapping related reliability phenomena in MOS devices Open
Charge trapping plays an important role for the reliability of electronic devices and manifests itself in various phenomena like bias temperature instability (BTI), random telegraph noise (RTN), hysteresis or trap-assisted tunneling (TAT).…
View article: Understanding the Excess 1/f Noise in MOSFETs at Cryogenic Temperatures
Understanding the Excess 1/f Noise in MOSFETs at Cryogenic Temperatures Open
Characterization, modeling, and development of cryo-temperature CMOS technologies (cryo-CMOS) have significantly progressed to help overcome the interconnection bottleneck between qubits and the readout interface in quantum computers. Neve…
View article: Hot-Carrier Induced Degradation of Ge/Sti Interfaces in Ge-on-Si Junction Devices
Hot-Carrier Induced Degradation of Ge/Sti Interfaces in Ge-on-Si Junction Devices Open
View article: A Pragmatic Model to Predict Future Device Aging
A Pragmatic Model to Predict Future Device Aging Open
To predict long term device aging under use bias, models extracted from voltage accelerated tests must be extrapolated into the future. The traditional model uses a power law, to linearly fit the test data on a log-log plot, and then extra…
View article: Comphy v3.0 -- A Compact-Physics Framework for Modeling Charge Trapping Related Reliability Phenomena in MOS Devices
Comphy v3.0 -- A Compact-Physics Framework for Modeling Charge Trapping Related Reliability Phenomena in MOS Devices Open
Charge trapping plays an important role for the reliability of electronic devices and manifests itself in various phenomena like bias temperature instability (BTI), random telegraph noise (RTN), hysteresis or trap-assisted tunneling (TAT).…
View article: New insights on the excess 1/f noise at cryogenic temperatures in 28 nm CMOS and Ge MOSFETs for quantum computing applications
New insights on the excess 1/f noise at cryogenic temperatures in 28 nm CMOS and Ge MOSFETs for quantum computing applications Open
Cryo-CMOS characterization, modeling, and development have significantly progressed to help overcome the interconnection bottleneck between qubits and the readout interface of quantum computers. Nevertheless, available compact models for c…
View article: Harnessing charge injection in Kelvin probe force microscopy for the evaluation of oxides
Harnessing charge injection in Kelvin probe force microscopy for the evaluation of oxides Open
View article: On The Development of a Reliable Gate Stack for Future Technology Nodes Based on III-V Materials
On The Development of a Reliable Gate Stack for Future Technology Nodes Based on III-V Materials Open
In this work, we discuss how the insertion of a LaSiOx layer in between an in-house IL passivation layer and the high-k has moved the III-V gate stack into the target window for future technology nodes.The insertion of this LaSiOx layer in…
View article: Физические основы самосогласованного моделирования процессов генерации интерфейсных состояний и транспорта горячих носителей в транзисторах на базе структур металл-диэлектрик-кремний
Физические основы самосогласованного моделирования процессов генерации интерфейсных состояний и транспорта горячих носителей в транзисторах на базе структур металл-диэлектрик-кремний Open
A detailed simulation of degradation (caused by hot charge carriers) based on self-consistent consideration of the transport of charge carriers and the generation of defects at the SiO_2/Si interface is carried out for the first time. The …
View article: NBTI-Generated Defects in Nanoscaled Devices: Fast Characterization Methodology and Modeling
NBTI-Generated Defects in Nanoscaled Devices: Fast Characterization Methodology and Modeling Open
Negative bias temperature instability (NBTI)-generated defects (GDs) have been widely observed and known to play an important role in device’s lifetime. However, its characterization and modeling in nanoscaled devices is a challenge due to…
View article: High Mobility In<sub>0.53</sub>Ga<sub>0.47</sub>As MOSFETs With Steep Sub-Threshold Slope Achieved by Remote Reduction of Native III-V Oxides With Metal Electrodes
High Mobility In<sub>0.53</sub>Ga<sub>0.47</sub>As MOSFETs With Steep Sub-Threshold Slope Achieved by Remote Reduction of Native III-V Oxides With Metal Electrodes Open
We have validated that the electrical performances of the In0.53Ga0.47As MOSFETs such as sub-threshold slope (SS) and electron mobility were dependent on interfacial reactions in the metal/highk/InGaAs gate stacks whi…
View article: Understanding charge traps for optimizing Si-passivated Ge nMOSFETs
Understanding charge traps for optimizing Si-passivated Ge nMOSFETs Open
Ge is an attractive channel material offering high hole and electron mobility, and therefore of interest for future p- and n-FET technologies. Ge nFETs can be made through two routes: GeO2/high-k directly on Ge [1] or using a Si-passivated…
View article: An Investigation on Border Traps in III–V MOSFETs With an In<sub>0.53</sub>Ga<sub>0.47</sub>As Channel
An Investigation on Border Traps in III–V MOSFETs With an In<sub>0.53</sub>Ga<sub>0.47</sub>As Channel Open
© 2015 IEEE. Continuing CMOS performance scaling requires developing MOSFETs of high-mobility semiconductors and InGaAs is a strong candidate for n-channel. InGaAs MOSFETs, however, suffer from high densities of border traps, and their ori…
View article: Correlation of interface states/border traps and threshold voltage shift on AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors
Correlation of interface states/border traps and threshold voltage shift on AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors Open
In this paper, three electrical techniques (frequency dependent conductance analysis, AC transconductance (AC-gm), and positive gate bias stress) were used to evaluate three different gate dielectrics (Plasma-Enhanced Atomic Layer Depositi…
View article: 2014 IRPS Paper Awards to be Recognized at 2015 IRPS [6 awards]
2014 IRPS Paper Awards to be Recognized at 2015 IRPS [6 awards] Open
View article: Origins and implications of increased channel hot carrier variability in nFinFETs
Origins and implications of increased channel hot carrier variability in nFinFETs Open
Channel hot carrier (CHC) stress is observed to result in higher variability of degradation in deeply-scaled nFinFETs than bias temperature instability (BTI) stress. Potential sources of this increased variation are discussed and the intri…