Karsten Meier
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View article: A first proposal of diagnostic strategy for microelectronics using resistance measurement under dynamic mechanical loads
A first proposal of diagnostic strategy for microelectronics using resistance measurement under dynamic mechanical loads Open
In the era of the fourth industrial revolution, electronic assemblies are subjected to significant external stresses such as vibration and thermal loads, posing challenges to their reliability. While diagnostic and prognostic tools have be…
View article: Characterization of Embedded and Thinned RF Chips
Characterization of Embedded and Thinned RF Chips Open
This work studies the effect of thinning down chips with transmission line structures for flexible embedding technology. Test chips with 90 Ω grounded coplanar waveguide (GCPW) transmission lines have been designed and manufactured to char…
View article: Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging
Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging Open
In wafer level packaging, polyimide and electroplated copper are dielectric and conducting materials respectively in the so-called redistribution layers. During the wafer fabrication process large amount of stress is generated in those lay…
View article: Ab initio Calculation of Fluid Properties for Precision Metrology
Ab initio Calculation of Fluid Properties for Precision Metrology Open
Recent advances regarding the interplay between ab initio calculations and metrology are reviewed, with particular emphasis on gas-based techniques used for temperature and pressure measurements. Since roughly 2010, several thermophysical …
View article: Numerical study on the influence of material models for tin-based solder alloys on reliability statements
Numerical study on the influence of material models for tin-based solder alloys on reliability statements Open
This paper presents a comparison of three different material models, which are currently used to describe creep behaviour of solder alloys in thermo-mechanical use cases. The first model is the commonly utilized Garofalo approach. This app…