Kerstin Wörhoff
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View article: Flip-Chip Bonding of InP Die on SiN-Based TriPleX Carrier With Novel Laser Soldering
Flip-Chip Bonding of InP Die on SiN-Based TriPleX Carrier With Novel Laser Soldering Open
In this paper, we present a flip-chip bonding concept for InP die on SiN-based TriPleX carrier using laser soldering. The InP die and SiN-based TriPleX carrier include the metalization patterns for commonly used photonic integrated circuit…
View article: 3D-printed optical probes for wafer-level testing of photonic integrated circuits
3D-printed optical probes for wafer-level testing of photonic integrated circuits Open
Wafer-level probing of photonic integrated circuits is key to reliable process control and efficient performance assessment in advanced production workflows. In recent years, optical probing of surface-coupled devices such as vertical-cavi…
View article: Flip-Chip Integration of InP to SiN Photonic Integrated Circuits
Flip-Chip Integration of InP to SiN Photonic Integrated Circuits Open
We present our hybrid InP to SiN TriPleX integration interface with a novel alignment technique and its application to complex photonic integrated circuits. The integration interface comprises vertical alignment stops, which simplify the a…
View article: Liquid crystal phase modulator integration on the TriPleX photonic platform
Liquid crystal phase modulator integration on the TriPleX photonic platform Open
Technology integration of liquid crystal cells for electro-optic modulation has been implemented on the commercial TriPleX photonic platform. Design and fabrication procedure have been optimized for fulfilling the low insertion loss criter…
View article: Low-Loss Si3N4 TriPleX Optical Waveguides: Technology and Applications Overview
Low-Loss Si3N4 TriPleX Optical Waveguides: Technology and Applications Overview Open
An overview of the most recent developments and improvements to the low-loss TriPleX Si3N4 waveguide technology is presented in this paper. The TriPleX platform provides a suite of waveguide geometries (box, double stripe, symmetric single…
View article: Low-loss, broadband and high fabrication tolerant vertically tapered optical couplers for monolithic integration of Si_3N_4 and polymer waveguides
Low-loss, broadband and high fabrication tolerant vertically tapered optical couplers for monolithic integration of Si_3N_4 and polymer waveguides Open
A low-loss, broadband and high fabrication tolerant optical coupler for the monolithic integration of Si3N4 and polymer waveguides is designed and experimentally demonstrated. The coupler is based on the adiabatic vertical tapering of the …
View article: Low-Loss Highly Tolerant Flip-Chip Couplers for Hybrid Integration of Si<sub>3</sub>N<sub>4</sub> and Polymer Waveguides
Low-Loss Highly Tolerant Flip-Chip Couplers for Hybrid Integration of Si<sub>3</sub>N<sub>4</sub> and Polymer Waveguides Open
In this letter, low-loss and highly fabrication-tolerant flip-chip bonded vertical couplers under single-mode condition are demonstrated for the integration of a polymer waveguide chip onto the Si3N4/SiO2 passive platform. The passively al…
View article: Chip based common-path optical coherence tomography system with an on-chip microlens and multi-reference suppression algorithm
Chip based common-path optical coherence tomography system with an on-chip microlens and multi-reference suppression algorithm Open
We demonstrate an integrated optical probe including an on-chip microlens for a common-path swept-source optical coherence tomography system. This common-path design uses the end facet of the silicon oxynitride waveguide as the reference p…
View article: Photonic hybrid assembly through flexible waveguides
Photonic hybrid assembly through flexible waveguides Open
Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photon…
View article: Bimorph actuators in thick SiO<sub>2</sub>for photonic alignment
Bimorph actuators in thick SiO<sub>2</sub>for photonic alignment Open
This paper proposes and tests a design of electro-thermal bimorph actuators for alignment of flexible photonic waveguides fabricated in 16 μm thick SiO2. The actuators are for use in a novel alignment concept for multi-port photonic integr…