A. Lai
YOU?
Author Swipe
View article: QML-FAST - A Fast Code for low-$\ell$ Tomographic Maximum Likelihood Power Spectrum Estimation
QML-FAST - A Fast Code for low-$\ell$ Tomographic Maximum Likelihood Power Spectrum Estimation Open
We present a novel implementation for the quadratic maximum likelihood (QML) power spectrum estimator for multiple correlated scalar fields on the sphere. Our estimator supports arbitrary binning in redshift and multipoles $\ell$ and inclu…
View article: Initial Real-World Experience of Tricuspid Transcatheter Edge-to-Edge Repair in Asia
Initial Real-World Experience of Tricuspid Transcatheter Edge-to-Edge Repair in Asia Open
The early experience with tricuspid TEER in Asia is promising, demonstrating a reasonable device success rate and a high safety profile. Clinical experience is associated with improved device success.
View article: TimeSPOT developments on charged-particle silicon sensors for high intensity 4D-Tracking
TimeSPOT developments on charged-particle silicon sensors for high intensity 4D-Tracking Open
This paper provides a comprehensive overview of recent advances in silicon sensors designed for 4D tracking. These devices are of particular relevance for the next-generation of high intensity collider experiments, where meeting stringent …
View article: KSZ Velocity Reconstruction with ACT and DESI-LS using a Tomographic QML Power Spectrum Estimator
KSZ Velocity Reconstruction with ACT and DESI-LS using a Tomographic QML Power Spectrum Estimator Open
We perform kinetic Sunyaev-Zel'dovich (kSZ) velocity reconstruction on data from ACT DR6 and DESI-LS DR9. To estimate the cross-power between kSZ velocity reconstruction and galaxy density, we make use of a novel quadratic maximum likeliho…
View article: Could we efficiently operate 3D silicon pixel-based tracking detectors irradiated with neutron fluences up to <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" altimg="si4.svg" display="inline" id="d1e449"> <mml:mrow> <mml:mn>1</mml:mn> <mml:mi>⋅</mml:mi> <mml:mn>1</mml:mn> <mml:msup> <mml:mrow> <mml:mn>0</mml:mn> </mml:mrow> <mml:mrow> <mml:mn>18</mml:mn> </mml:mrow> </mml:msup> <mml:mspace width="0.16667em"/> <mml:mn>1</mml:mn> <mml:mspace width="0.16667em"/> <mml:mi mathvariant="normal">MeV</mml:mi> <mml:mspace width="0.16667em"/> <mml:msub> <mml:mrow> <mml:mi mathvariant="normal">n</mml:mi> </mml:mrow> <mml:mrow> <mml:mi mathvariant="normal">eq</mml:mi> </mml:mrow> </mml:msub> <mml:mspace width="0.16667em"/> <mml:msup> <mml:mrow> <mml:mi mathvariant="normal">cm</mml:mi> </mml:mrow> <mml:mrow> <mml:mo>−</mml:mo> <mml:mn>2</mml:mn> </mml:mrow> </mml:msup> </mml:mrow> </mml:math> ?
Could we efficiently operate 3D silicon pixel-based tracking detectors irradiated with neutron fluences up to ? Open
View article: New developments in 3D-trench electrode sensors
New developments in 3D-trench electrode sensors Open
Future high-luminosity hadron collider experiments feature unprecedented levels of event pile-up and extreme radiation environments, calling for sensors capable of 4D tracking, even after significant radiation damage. To this purpose, 3D s…
View article: nuSCOPE: A short-baseline neutrino beam at CERN for high-precision cross-section measurements
nuSCOPE: A short-baseline neutrino beam at CERN for high-precision cross-section measurements Open
A new generation of neutrino cross-section experiments at the GeV scale is crucial in the precision era of oscillation physics and lepton flavor studies. In this document, we present a novel neutrino beam design that leverages the experien…
View article: New developments in 3D-trench electrode sensors
New developments in 3D-trench electrode sensors Open
Future high-luminosity hadron collider experiments feature unprecedented levels of event pile-up and extreme radiation environments, calling for sensors capable of 4D tracking, even after significant radiation damage. To this purpose, 3D s…
View article: Timing-Optimised 3D Silicon Sensor with Columnar Electrode Geometry
Timing-Optimised 3D Silicon Sensor with Columnar Electrode Geometry Open
Among various silicon sensor technologies, 3D silicon sensors demonstrate significant potential for applications requiring exceptional radiation hardness and intrinsic high time resolutions. Silicon pixel sensors with columnar-type electro…
View article: Characterisation of 3D trench silicon pixel sensors irradiated at 1⋅1017 1 MeV neqcm-2
Characterisation of 3D trench silicon pixel sensors irradiated at 1⋅1017 1 MeV neqcm-2 Open
The 3D trench silicon pixel sensors developed by the TimeSPOT collaboration have demonstrated exceptional performance, even after exposure to extreme radiation fluences up to . This study assesses the radiation tolerance of these sensors …
View article: A 4D-tracker demonstrator based on the Timespot1, a CMOS 28-nm ASIC
A 4D-tracker demonstrator based on the Timespot1, a CMOS 28-nm ASIC Open
View article: Characterisation of highly irradiated 3D trench silicon pixel sensors for 4D tracking with 10 ps timing accuracy
Characterisation of highly irradiated 3D trench silicon pixel sensors for 4D tracking with 10 ps timing accuracy Open
3D trench silicon pixel sensors, recently developed by the TimeSPOT collaboration, have shown excellent performance in terms of spatial resolution, timing precision and detection efficiency. The combination of these three features make the…
View article: A prototype 4D-tracking demonstrator based on the TimeSPOT developments
A prototype 4D-tracking demonstrator based on the TimeSPOT developments Open
We present first results obtained with a prototype 4D-tracking demonstrator, using sensors and electronics developed within the TimeSPOT project, and tested on a positive charged pion beam at CERN SPS. The setup consists of five small trac…
View article: Recent developments in the IGNITE project on front-enddesign in CMOS 28-nm technology
Recent developments in the IGNITE project on front-enddesign in CMOS 28-nm technology Open
The IGNITE project (INFN Ground-up INITiative-on micro-Electronics developments) is developing solutions on integrated micro-systems aimed at the next generation of high-luminosity experiment at the LHC. A test ASIC, designed in CMOS 28-nm…
View article: Design and simulation of modified 3D-trench electrode sensors
Design and simulation of modified 3D-trench electrode sensors Open
Future experiments at high-luminosity hadron colliders will involve unprecedent levels of pile up, calling for ultrafast detectors in order to add time information to distinguish between particle tracks. The unique geometry of 3D sensors e…
View article: Erratum: Intrinsic timing properties of ideal 3D-trench silicon sensor with fast front-end electronics
Erratum: Intrinsic timing properties of ideal 3D-trench silicon sensor with fast front-end electronics Open
View article: Intrinsic timing properties of ideal 3D-trench silicon sensor with fast front-end electronics
Intrinsic timing properties of ideal 3D-trench silicon sensor with fast front-end electronics Open
This paper describes the fundamental timing properties of a single-pixel sensor for charged particle detection based on the 3D-trench silicon structure. We derive the results both analytically and numerically by considering a simple ideal …
View article: Position-resolved timing characterisation tests of hexagonal and trench 3D silicon detectors
Position-resolved timing characterisation tests of hexagonal and trench 3D silicon detectors Open
Position-resolved timing characterisation tests were performed on individual pixels of hexagonal and trench 3D silicon sensors. An IR laser was used to deposit energy equivalent to 1 MIP with a 1μm spatial resolution onto each sensor, whic…
View article: Charged-particle timing with 10 ps accuracy using TimeSPOT 3D trench-type silicon pixels
Charged-particle timing with 10 ps accuracy using TimeSPOT 3D trench-type silicon pixels Open
For the next generation of vertex detectors, the accurate measurement of the charged particle timing at the pixel level is considered to be the ultimate solution in experiments operating at very high instantaneous luminosities. This work s…
View article: Intrinsic timing properties of ideal 3D-trench silicon sensor with fast front-end electronics
Intrinsic timing properties of ideal 3D-trench silicon sensor with fast front-end electronics Open
This paper describes the fundamental timing properties of a single-pixel sensor for charged particle detection based on the 3D-trench silicon structure. We derive the results both analytically and numerically by considering a simple ideal …
View article: Timing performances of front-end electronics with 3D-trench silicon sensors
Timing performances of front-end electronics with 3D-trench silicon sensors Open
Detectors based on pixels with timing capabilities are gaining increasing importance in the last years. Next-to-come high-energy physics experiments at colliders require the use of time information in tracking, due to the expected levels o…
View article: 10 ps timing with highly irradiated 3D trench silicon pixel sensors
10 ps timing with highly irradiated 3D trench silicon pixel sensors Open
In this paper the results of a beam test characterization campaign of 3D trench silicon pixel sensors are presented. A time resolution in the order of 10 ps was measured both for non-irradiated and irradiated sensors up to a fluence of 2.5…
View article: Picosecond timing resolution with 3D trench silicon sensors
Picosecond timing resolution with 3D trench silicon sensors Open
Future vertex detectors operating in colliders at very high instantaneous luminosity will face great challenges in the event reconstruction due to the increase in track density. To guarantee good detector performance the additional informa…
View article: 4D-tracking in the 10-ps range: A technological perspective
4D-tracking in the 10-ps range: A technological perspective Open
The present paper focuses on recent and ready-to-come advancements concerning high-resolution 4D-tracking with a perspective approach. Four-dimensional-tracking techniques (particle tracking with timing information for each detection point…
View article: Timespot1: A 28nm CMOS Pixel Read-Out ASIC for 4D Tracking at High Rates
Timespot1: A 28nm CMOS Pixel Read-Out ASIC for 4D Tracking at High Rates Open
We present the first characterization results of Timespot1, an ASIC designed in CMOS 28 nm technology, featuring a $32 \times 32$ pixel matrix with a pitch of $55 ~ μm$. Timespot1 is the first small-size prototype, conceived to readout fin…
View article: Front-end Electronics for Timing with pico-seconds precision using 3D Trench Silicon Sensors
Front-end Electronics for Timing with pico-seconds precision using 3D Trench Silicon Sensors Open
The next generation of collider experiments require tracking detectors with extreme performance capabilities in terms of spatial resolution (tens of $μ\text{m}$), radiation hardness ($10^{17}~1~$MeV n$_{eq}/$cm$^2$) and timing resolution (…
View article: A Method Based on Muon System to Monitor LHCb Luminosity
A Method Based on Muon System to Monitor LHCb Luminosity Open
LHCb is one of the four main experiments running at the Large Hadron Collider (LHC) of the European Organization for Nuclear Research. Since 2010, it has been collecting data to study the Physics of b and c quarks. For the past three years…
View article: 4-Dimensional Trackers
4-Dimensional Trackers Open
4-dimensional (4D) trackers with ultra fast timing (10-30 ps) and very fine spatial resolution (O(few $μ$m)) represent a new avenue in the development of silicon trackers, enabling new physics capabilities beyond the reach of the existing …
View article: First measurements on the Timespot1 ASIC: a fast-timing, high-rate pixel-matrix front-end
First measurements on the Timespot1 ASIC: a fast-timing, high-rate pixel-matrix front-end Open
This work presents the first measurements performed on the Timespot1 ASIC. As the second prototype developed for the TimeSPOT project, the ASIC features a 32 × 32 channels hybrid-pixel matrix. Targeted to space-time tracking applications i…