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View article: Renewable Energy Potential Model: Priority Geothermal Leasing Areas ReEDs Results
Renewable Energy Potential Model: Priority Geothermal Leasing Areas ReEDs Results Open
This dataset contains the results of a study conducted by the National Renewable Energy Laboratory (NREL) to identify potential future priority geothermal leasing areas on Bureau of Land Management (BLM) and United States Forest Service (U…
View article: IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control Open
The Ultrasonics, Ferroelectrics, and Frequency Control Society is an organization, within the framework of the IEEE, of members with principal professional interest in ultrasonics, ferroelectrics, and frequency control.The field of interes…
View article: IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control Open
The Ultrasonics, Ferroelectrics, and Frequency Control Society is an organization, within the framework of the IEEE, of members with principal professional interest in ultrasonics, ferroelectrics, and frequency control.The field of interes…
View article: IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control Open
The Ultrasonics, Ferroelectrics, and Frequency Control Society is an organization, within the framework of the IEEE, of members with principal professional interest in ultrasonics, ferroelectrics, and frequency control.The field of interes…
View article: List of Contributors
List of Contributors Open
Conflict and Contradiction in MedievalAllegory and "Piers Plowman," and she is developing a project on ideas
View article: On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology
On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology Open
One of the key enablers for the successful integration of 3-D interconnects using the Through-Silicon Via (TSV) schemes is the control of the mechanical stresses in the Cu TSV itself as well as in the surrounding silicon substrate. The syn…