M.L. Ray
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View article: Artifact-Free Preparation of Plan View TEM Specimens and Its Application to MRAM Devices
Artifact-Free Preparation of Plan View TEM Specimens and Its Application to MRAM Devices Open
Journal Article Artifact-Free Preparation of Plan View TEM Specimens and Its Application to MRAM Devices Get access C S Bonifacio, C S Bonifacio E.A. Fischione Instruments, Inc., Export, PA, USA Corresponding author: cs_bonifacio@fischione…
View article: Elucidating Surface Properties by Correlative TEM and APT Studies of Ideal Mg Specimens Prepared Under Controlled Environments
Elucidating Surface Properties by Correlative TEM and APT Studies of Ideal Mg Specimens Prepared Under Controlled Environments Open
Journal Article Elucidating Surface Properties by Correlative TEM and APT Studies of Ideal Mg Specimens Prepared Under Controlled Environments Get access C S Bonifacio, C S Bonifacio E.A. Fischione Instruments, Inc., Export, PA, USA Corres…
View article: Post-FIB Specimen Preparation of Atom Probe Specimens under Controlled Environments for Correlative Microscopy
Post-FIB Specimen Preparation of Atom Probe Specimens under Controlled Environments for Correlative Microscopy Open
Journal Article Post-FIB Specimen Preparation of Atom Probe Specimens under Controlled Environments for Correlative Microscopy Get access CS Bonifacio, CS Bonifacio E.A. Fischione Instruments, Inc., Export, PA, USA Search for other works b…
View article: Controlled Environments from Sample Preparation to Electron Microscopy Characterization
Controlled Environments from Sample Preparation to Electron Microscopy Characterization Open
Journal Article Controlled Environments from Sample Preparation to Electron Microscopy Characterization Get access CS Bonifacio, CS Bonifacio E.A. Fischione Instruments Inc., Export, PA, USA Corresponding author: [email protected]…
View article: Automatic End-point Detection for Ar+ Milling of FIB in situ and ex situ Lift-out Specimens from Semiconductor Devices
Automatic End-point Detection for Ar+ Milling of FIB in situ and ex situ Lift-out Specimens from Semiconductor Devices Open
An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
View article: Sample preparation for aberration-corrected microscopy of high-quality TEM specimens of advanced integrated circuits
Sample preparation for aberration-corrected microscopy of high-quality TEM specimens of advanced integrated circuits Open
An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
View article: Removal of Ga Implantation on FIB-prepared Atom Probe Specimens Using Small Beam and Low Energy Ar+ Milling
Removal of Ga Implantation on FIB-prepared Atom Probe Specimens Using Small Beam and Low Energy Ar+ Milling Open
An abstract is not available for this content so a preview has been provided. As you have access to this content, a full PDF is available via the ‘Save PDF’ action button.
View article: Advanced Characterization of Emerging Semiconductor Devices Using Low Energy, Broad Ion Beam Argon Milling
Advanced Characterization of Emerging Semiconductor Devices Using Low Energy, Broad Ion Beam Argon Milling Open
View article: Large Area 3D Structural Characterization by Serial Sectioning Using Broad Ion Beam Argon Ion Milling
Large Area 3D Structural Characterization by Serial Sectioning Using Broad Ion Beam Argon Ion Milling Open
Journal Article Large Area 3D Structural Characterization by Serial Sectioning Using Broad Ion Beam Argon Ion Milling Get access P Nowakowski, P Nowakowski E. A. Fischione Instruments, Inc., 9003 Corporate Circle, Export, PA, USA Search fo…
View article: Accurate Removal of Implanted Gallium and Amorphous Damage from TEM Specimens after Focused Ion Beam (FIB) Preparation
Accurate Removal of Implanted Gallium and Amorphous Damage from TEM Specimens after Focused Ion Beam (FIB) Preparation Open
Journal Article Accurate Removal of Implanted Gallium and Amorphous Damage from TEM Specimens after Focused Ion Beam (FIB) Preparation Get access P Nowakowski, P Nowakowski E.A. Fischione Instruments, Inc., Export, PA 15632 USA Search for …