Mark Schultz
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View article: Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications
Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications Open
We report on the successful design and fabrication of optical modules using a 50 micron pitch polymer waveguide interface, integrated for low loss, high density optical data transfer with very low space requirements on a Si photonics die. …
View article: Variable pin fin construction to facilitate compliant cold plates
Variable pin fin construction to facilitate compliant cold plates Open
A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; a…
View article: Near-chip compliant layer for reducing perimeter stress during assembly process
Near-chip compliant layer for reducing perimeter stress during assembly process Open
A heat source (single semiconductor chip or group of closely spaced semiconductor chips of similar height) is provided on a first side of a substrate, which substrate has on said first side a support member comprising a compressible materi…
View article: Pattern bonded finned cold plate
Pattern bonded finned cold plate Open
An apparatus includes a fin pack of parallel plates that protrude from a base, a lid attachable to the fin pack opposite the base, and a brazing material painted onto the lid only in a plurality of wettable regions. The lid is positioned a…
View article: Pin fin compliant heat sink with enhanced flexibility
Pin fin compliant heat sink with enhanced flexibility Open
Methods of using heat sinks include placing a pin fin compliant heat sink on a non-flat surface. The pin fin complaint heat sink has top and bottom plates connected by a plurality of pins arranged vertically between the top and bottom plat…
View article: Information technology equipment cooling method
Information technology equipment cooling method Open
According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools air utilized by the rack of information technology equipment to co…
View article: Information technology equipment cooling system
Information technology equipment cooling system Open
According to one embodiment, a system for removing heat from a rack of information technology equipment may include a sidecar indoor air to liquid heat exchanger that cools warm air generated by the rack of information technology equipment…
View article: Gauging landholder attitudes and willingness towards koala conservation in a Central Queensland region
Gauging landholder attitudes and willingness towards koala conservation in a Central Queensland region Open
The Australian Government recently ‘upgraded’ the status of the koala across New South Wales, the Australian Capital Territory and Queensland from vulnerable to endangered. This change is a result of the impact of prolonged drought, bushfi…
View article: An Internet-Based Weight Loss Intervention Initiated by a Newspaper
An Internet-Based Weight Loss Intervention Initiated by a Newspaper Open
BackgroundAn estimated two-thirds of North Carolina residents are overweight or obese. Mass media, such as newspapers and the Internet, can be used to broadly convey health messages for weight loss.ContextNewspapers have traditionally been…
View article: Enthalpy-based system-model for pumped two-phase cooling systems
Enthalpy-based system-model for pumped two-phase cooling systems Open
The development of embedded chip cooling for 2D and 3D integrated circuits using pumped dielectric refrigerant has gained recent attention due to the ability to manage high heat densities and compatibility with electronics. Recent studies …