Μ. Y. Tsai
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View article: Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor Packaging
Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor Packaging Open
This paper presents a mechanical simulation of image sensor packages, with a particular emphasis on accurately modeling the cure shrinkage and viscoelasticity. Image sensors have a wide application in mobile phones, autonomous vehicles, an…
View article: Intelligent Casting Quality Inspection Method Integrating Anomaly Detection and Semantic Segmentation
Intelligent Casting Quality Inspection Method Integrating Anomaly Detection and Semantic Segmentation Open
Wind power generation plays an important role in renewable energy, and the core casting components have extremely high requirements for precision and quality. In actual practice, we found that an insufficient workforce limits traditional m…
View article: Comparing the Performance of Rolled Steel and 3D-Printed 316L Stainless Steel
Comparing the Performance of Rolled Steel and 3D-Printed 316L Stainless Steel Open
Three-dimensional printing is a non-conventional additive manufacturing process. It is different from the conventional subtractive manufacturing process. It offers exceptional rapid prototyping capabilities and results that conventional su…
View article: Comparing Performance of General Rolled Steel and 3D Printed 316L Stainless Steel
Comparing Performance of General Rolled Steel and 3D Printed 316L Stainless Steel Open
3D printing is a non-traditional additive manufacturing process. It is different from the traditional subtractive manufacturing process. It offers exceptional rapid prototyping capabilities and results that traditional subtractive manufact…
View article: The Study of the Performance of the Diamond Wheel’s Steel and CFRP Hubs in Tungsten Carbide (WC) Grinding
The Study of the Performance of the Diamond Wheel’s Steel and CFRP Hubs in Tungsten Carbide (WC) Grinding Open
Tungsten carbide (WC) has been widely utilized in recent years in the hardware, mechanical, and chemical industries and in national defense because of its high hardness, anti-wear, low temperature, and anti-corrosion properties. However, u…
View article: Measurements and Modelling of Thermally Induced Warpages of DIMM Socket Server PCB Assembly after Solder Reflow Processes
Measurements and Modelling of Thermally Induced Warpages of DIMM Socket Server PCB Assembly after Solder Reflow Processes Open
The thermal warpage of a server-computer-used DIMM socket-PCB assembly after the solder reflow process is studied experimentally, theoretically, and numerically, especially along the socket lines and over the entire assembly. Strain gauge …
View article: Correction factors to biaxial bending strength of thin silicon die in the ball-on-ring test by considering geometric nonlinearity and material anisotropy
Correction factors to biaxial bending strength of thin silicon die in the ball-on-ring test by considering geometric nonlinearity and material anisotropy Open
The ball-on-ring test (BoR) is one of the standard tests for biaxial bending, suggested in ASTM F394-78. This test has been applied to determine the biaxial bending strength of silicon dies to avoid the die edge effect of the three-point b…
View article: Monitoring of Grinding Status of Alumina Grinding Wheel Based on Short-time Fourier Transform
Monitoring of Grinding Status of Alumina Grinding Wheel Based on Short-time Fourier Transform Open
In this study, an accelerometer was installed on a computer numerical control (CNC) grinding machine, and the vibration signal of the accelerometer was processed by short-time Fourier transform (STFT) to observe the correlation between the…
View article: Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges
Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges Open
The thermal warpage problems in integrated circuit (IC) packaging exist in both flip-chip and two-and-a-half dimensional integrated circuits (2.5D IC) packages during manufacturing processes and thermal cycling service. This study proposes…
View article: Surface Roughness Prediction and Parameter Selection for Grinding Process with Computer Numerical Control
Surface Roughness Prediction and Parameter Selection for Grinding Process with Computer Numerical Control Open
We propose a novel intelligent grinding assistance system (IGAS) for the grinding of silicon carbide (SiC) with computer numerical control (CNC).The proposed IGAS predicts surface roughness (Ra) and suggests suitable parameters for the gri…
View article: Novel Abrasive-Impregnated Pads and Diamond Plates for the Grinding and Lapping of Single-Crystal Silicon Carbide Wafers
Novel Abrasive-Impregnated Pads and Diamond Plates for the Grinding and Lapping of Single-Crystal Silicon Carbide Wafers Open
In this study, special ceramic grinding plates impregnated with diamond grit and other abrasives, as well as self-made lapping plates, were used to prepare the surface of single-crystal silicon carbide (SiC) wafers. This novel approach enh…
View article: Backplate-reinforced structures for enhancing solder joint reliability of server CPU assembly under thermal cycling
Backplate-reinforced structures for enhancing solder joint reliability of server CPU assembly under thermal cycling Open
To meet the requirement of the high I/O and fine-pitch interconnects, the conventional insertion-mount socket for central processing unit (CPU) has been changed to surface-mount one with ball grid array. The solder ball joint reliability o…
View article: IMPACT 2020 Contributor Page
IMPACT 2020 Contributor Page Open
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View article: Ultrasonic-Assisted Innovative Polyurethane Tool to Polish Mold Steel
Ultrasonic-Assisted Innovative Polyurethane Tool to Polish Mold Steel Open
High-quality die and mold production is becoming increasingly important in modern mass production. Surface quality is one of the most frequent and stringent customer specifications for machined parts, of which the major consideration and i…
View article: Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges
Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges Open
Measurements of the curvatures and warpages of a printed circuit board (PCB) during a thermal solder reflow process using strain gauges are proposed in this study. In the experiments, a shadow moiré is used for measuring the out-of-plane d…
View article: Investigation of Polishing Pads Impregnated with Fe and Al2O3 Particles for Single-Crystal Silicon Carbide Wafers
Investigation of Polishing Pads Impregnated with Fe and Al2O3 Particles for Single-Crystal Silicon Carbide Wafers Open
This study focuses on the development of a novel polishing pad for SiC wafers. Fe and Al2O3 particles were impregnated in a polyurethane matrix, thus forming a fixed abrasive polishing pad. Four types of pads with different compositions of…