Explanipedia

Structural Design and Analysis of an Automated Cutting Device for a Grass Carp Product Based on SolidWorks Open

Xiang Chen, Jibing Chen, Yiping Wu · 2025

When addressing the issue that the current market sales of fresh aquatic products, which are segmented into sections, mainly rely on manual operations, there are problems such as high labor intensity, low cutting efficiency, and uneven cut…

Structure and Temperature Dependence of Solder Layer and Electric Parameters in IGBT Modules Open

Jibing Chen, Yanfeng Liu, Bowen Liu, Yiping Wu · 2025

IGBT high-power devices are subjected to various extreme working conditions for long periods and are affected by multiple loading conditions, inevitably leading to various aging and failure issues. Among them, the solder layer, as one of t…

Development of a high-entropy alloy with both high corrosion resistance and hardness by data-driven intelligent design methods Open

Qinying Wang, Yiping Wu, Yuhui Song, D. Li, Yuchen Xi , et al. · 2025

Design and Optimization of W-Mo-V High-Speed Steel Roll Material and Its Heat-Treatment-Process Parameters Based on Numerical Simulation Open

Zhiting Zhu, Mingyu Duan, Hao Pi, Zhuo Li, Jibing Chen , et al. · 2024

W-Mo-V high-speed steel (HSS) is a high-alloy high-carbon steel with a high content of carbon, tungsten, chromium, molybdenum, and vanadium components. This type of high-speed steel has excellent red hardness, wear resistance, and corrosio…

Simulation and Assessment of Thermal-Stress Analysis of Welding Materials in IGBT Open

Yang Yang, Jibing Chen, Bowen Liu, Yiping Wu · 2024

Insulated gate bipolar transistors (IGBTs), as an important power semiconductor device, are susceptible to thermal stress, thermal fatigue, and mechanical stresses under high-voltage, high-current, and high-power conditions. Elevated heat …

Pressureless Immersion of Epoxy Resin-Filled Cracks in Faulted Rock Materials Open

Kui Yu, Yong She, Jibing Chen, Xionghui Cai, Yiping Wu · 2024

Epoxy resin, known for its excellent corrosion resistance, water resistance, and high-temperature resistance, is extensively utilized in construction and water-related projects. Within water conservancy projects, natural factors such as wa…

Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review Open

Lei Li, Xinyu Du, Jibing Chen, Yiping Wu · 2024

In electronic packaging products in the service process, the solder joints experience thermal fatigue due to temperature cycles, which have a significant influence on the performance of electronic products and the reliability of solder joi…

The Effect of Epoxy Resin on the Infiltration of Porous Metal Parts Formed through Laser Powder Bed Fusion Open

Jibing Chen, Yanfeng Liu, Yong She, Yang Yang, Xinyu Du , et al. · 2024

Laser powder bed fusion (L-PBF) additive manufacturing technology can print multi-material parts with multiple functions/properties, and has great potential for working in harsh application environments. However, the metal blank formed by …

Design and Optimization of Heat Treatment Process Parameters for High-Molybdenum-Vanadium High-Speed Steel for Rolls Open

Jibing Chen, Yanfeng Liu, Yujie Wang, Rong Xu, Qianyu Shi , et al. · 2023

High-molybdenum-vanadium high-speed steel is a new type of high-hardenability tool steel with excellent wear resistance, castability, and high-temperature red hardness. This paper proposes a composition design of high-molybdenum-vanadium h…

Research on Characterization of Nylon Composites Functional Material Filled with Al2O3 Particle Open

Jibing Chen, Bowen Liu, Maohui Hu, Qianyu Shi, Junsheng Chen , et al. · 2023

This study revolves around the issues raised by the current semiconductor device metal casings (mainly composed of aluminum and its alloys), such as resource and energy consumption, complexity of the production process, and environmental p…

Study of the Solder Characteristics of IGBT Modules Based on Thermal–Mechanical Coupling Simulation Open

Jibing Chen, Bowen Liu, Maohui Hu, Shisen Huang, Shanji Yu , et al. · 2023

The insulated-gate bipolar transistor (IGBT) represents a crucial component within the domain of power semiconductor devices, which finds ubiquitous employment across a range of critical domains, including new energy vehicles, smart grid s…

Effect of Cu content on properties of Cu/Zn+15%SAC0307+xCu/Al joint by ultrasonic excitation at low temperature Open

Qianzhu Xu, Guisheng Gan, Zhaoqi Jiang, Shiqi Chen, Tian Huang , et al. · 2021

Preparation of Cu-Cr-Zr Alloy by Laser Powder Bed Fusion: Parameter Optimization, Microstructure, Mechanical and Thermal Properties for Microelectronic Applications Open

Xiangyao Fang, Weisheng Xia, Qingsong Wei, Yiping Wu, Weiwen Lv , et al. · 2021

Laser powder bed fusion (LPBF) technology is beneficial for the fabrication of thermal conductive materials, integrating with the predesigned structure, which shows a great potential for high heat dissipation applications. Here, a Cu–Cr–Zr…

Active Switching of Toroidal Resonances by Using a Dirac Semimetal for Terahertz Communication Open

Yuanbao Sun, Denggao Liao, Jinjin Xu, Yiping Wu, Lin Chen · 2020

The dynamical switching of a toroidal dipole resonance channel is demonstrated by tuning the Fermi level of a Dirac semimetal film sandwiched between the back substrates. As the Fermi level is increased from 30 to 150 meV, the resonance fr…

Critical Factors for In Vivo Measurements of Human Skin by Terahertz Attenuated Total Reflection Spectroscopy Open

Lixia Wang, Sayon Guilavogui, Henghui Yin, Yiping Wu, Xiaofei Zang , et al. · 2020

Attenuated total reflection (ATR) geometry is a suitable choice for in vivo measurements of human skin due to the deep penetration of the field into the sample and since it makes it easy to measure the reference spectrum. On the other hand…

IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints Open

Ning Ren, Heng Fang, Dong Wang, Chenyi Hou, Yatao Zhao , et al. · 2020

The current miniaturization trend of microelectronic devices drives the size of solder joints to continually scale down. The miniaturized joints considerably increase intermetallic compounds (IMCs) volume fraction to trigger mechanical rel…

Interaction between spoof localized surface plasmon and terahertz vortex beam Open

Yifan Ge, Yiping Wu, Xiaofei Zang, Ying-Hao Yuan, Lin Chen · 2020

We theoretically and experimentally investigate a method of exciting multipole plasmons, including terahertz dark spoof localized surface plasmon (Spoof-LSP) modes, by using normally incident terahertz vortex beam. The vortex beam with ang…

Microstructure and Property of Sn–37Pb Solder Bumps in Ø0.6 mm Ball during Thermal Shock Open

Guisheng Gan, Daquan Xia, Xin Liu, Cong Liu, Hanlin Cheng , et al. · 2019

Sn37Pb solder bumps with Ø0.6 mm ball were used to conduct thermal shock test, microstructure and property of solder bumps were investigated. The experimental results have shown that the shear strength of solder bumps was 62.89 MPa after r…

Ultrasonic-Assisted Soldering of Low-Ag SAC Lead-Free Solder Paste at Low-Temperature Open

Guisheng Gan, Linqiao Gan, Jizhao Guo, Daquan Xia, Chunhong Zhang , et al. · 2018

SAC0307 (Sn-0.3mass%Ag-0.7mass%Cu) lead-free solder pastes were used to complete Cu/Cu joint by ultrasonic-assisted. Effect of nano-Ni particles and temperature on the performance of joint by ultrasonic-assisted with lead-free solder paste…

Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageing Open

Zhiwen Chen, Changqing Liu, Bing An, Yiping Wu, Li Liu · 2017

Refining Mechanism of 7075 Al Alloy by In-Situ TiB2 Particles Open

Guisheng Gan, Bin Yang, Bo Zhang, Xin Jiang, Yunlong Shi , et al. · 2017

The nucleation undercooling of TiB2/7075 Al matrix composites, the microstructure observed after solidification at different cooling rate, and the size and distribution of TiB2 particles were investigated. The experimental results have sho…

Effect of Trace Cu on Microstructure, Spreadability and Oxidation Resistance Property of Sn-<i>x</i>Cu Solders Open

Guisheng Gan, Bida Chen, Yiping Wu, Donghua Yang, Luxin Chi , et al. · 2017

Sn-xCu (x = 0.5, 0.7, 0.9, 1.1, 1.3) solders were prepared to investigate the influence of trace Cu on the microstructure, the spreadability and the oxidation resistance property of Sn-xCu lead-free solder. Researches have shown that the C…

Micro-mechanical and fracture characteristics of Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds under micro-cantilever bending Open

Li Liu, Zhiwen Chen, Changqing Liu, Yiping Wu, Bing An · 2016

Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder Open

Qing-meng Wang, Guisheng Gan, Yunfei Du, Donghua Yang, Guoqi Meng , et al. · 2016

Sn-0.7Cu and Sn-0.7Cu-xGe solder alloys were prepared to investigate the influence of trace Ge on liquid Sn-0.7Cu lead-free solder at high temperature. The spreadability and the wetting force of solders were tested, and the oxidation-resis…

Microstructure and Viscosity of Particles Reinforced 7075 Al Matrix Composites Open

Guisheng Gan, Bin Yang, Qian Gao, Yiping Wu, Mingbo Yang · 2016

In-situ TiB2 particle reinforced 7075 Al alloy was produced by molten salt method (LSM). The effects of TiB2 content on the microstructure, the melting behavior and the viscosity of 7075 Al alloy were investigated. The experimental results…

Perpendicular Growth Characteristics of Cu-Sn Intermetallic Compounds at the Surface of 99Sn-1Cu/Cu Solder Interconnects Open

Zhiwen Chen, Changqing Liu, Yiping Wu, Bing An · 2015

Study of Height Reduction of Sn99Cu1/Cu Solder Joints as a Result of Isothermal Aging Open

Zhiwen Chen, Changqing Liu, Yiping Wu, Bing An, Longzao Zhou · 2015

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