Pradeep Lall YOU? Author Swipe

Last 10y

Characterization of Fatigue Performance for Bulk Epoxy Molding Compound in Sustained High Temperature Exposure up to 1 Year Aging Open

Pradeep Lall, Yunli Zhang · 2025

The reliability of electronic devices is significantly influenced by the fatigue failure of packaging materials under prolonged high-temperature exposure. Epoxy molding compounds (EMCs) are widely used to encapsulate and protect semiconduc…

Using Finite Element Analysis to Analyze the Effects of Paste-to-Ball Volume Ratio and Package Design Parameters on Thermal Cycling Performance of Hybrid SAC-LTS Solder Joints Open

Souvik Chakraborty, Debabrata Mondal, Jeffrey C. Suhling, Pradeep Lall · 2025

Hybrid SAC-LTS (SAC: Sn–Ag–Cu, LTS: Low-Temperature Solder) solder joints are widely adopted in SMT (surface mount technology) processes due to their ability to lower reflow temperatures, thereby limiting package warpage and improving reli…

Characterization of Non-PFAS Underfill Behavior Under Harsh Operating Conditions Open

Pradeep Lall, Madhu Kasturi, Leyton Janowsky, Edward Davis · 2025

Per- and polyfluoroalkyl substances, or PFAS for convenience, are a group of synthetic chemicals that were first produced in the 1940s and are being widely used across a variety of industries. Their unique properties, including their resis…

Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate and High-Impact Polystyrene Substrates Under Sustained High Temperatures for In-Mold Electronics Open

Pradeep Lall, Shriram Kulkarni, Scott Miller · 2025

In-mold electronics (IME) offers a path toward reducing the carbon footprint in automotive platforms through weight reduction. This technology enables the integration of human–machine interfaces directly onto automotive surfaces using addi…

Dynamic Beam-Stabilized, Additive-Printed Flexible Antenna Arrays with On-Chip Rapid Insight Generation Open

Sreeni Poolakkal, Abdullah Islam, Shrestha Bansal, Arpit Rao, Ted Dabrowski , et al. · 2024

Conformal phased arrays promise shape-changing properties, multiple degrees of freedom to the scan angle, and novel applications in wearables, aerospace, defense, vehicles, and ships. However, they have suffered from two critical limitatio…

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Alan Huffman, S Kroehnert , et al. · 2023

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Alan Huffman, S Kroehnert , et al. · 2023

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Alan Huffman, S Kroehnert , et al. · 2023

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Alan Huffman, S Kroehnert , et al. · 2023

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Alan Huffman, S Kroehnert , et al. · 2023

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Alan Huffman, S Kroehnert , et al. · 2023

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Alan Huffman, S Kroehnert , et al. · 2023

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Alan Huffman, S Kroehnert , et al. · 2023

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Alan Huffman, S Kroehnert , et al. · 2023

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2022

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2022

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2022

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2022

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2022

IEEE Components, Packaging, and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2022

IEEE Components, Packaging, and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2022

IEEE Components, Packaging, and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2022

IEEE Components, Packaging, and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2022

IEEE Components, Packaging, and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2022

IEEE Components, Packaging, and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2022

IEEE Components, Packaging, and Manufacturing Technology Society Information Open

K Pearsall, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2022

IEEE Components, Packaging, and Manufacturing Technology Society Information Open

C. Bailey, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2021

IEEE Components, Packaging, and Manufacturing Technology Society Information Open

C. Bailey, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2021

IEEE Components, Packaging, and Manufacturing Technology Society Information Open

C. Bailey, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2021

IEEE Components, Packaging, and Manufacturing Technology Society Information Open

C. Bailey, Ravi Mahajan, Jeffrey C. Suhling, Patrick Thompson, Alan Huffman , et al. · 2021

Fetching topic information...