Richard Coyle
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View article: Implementing Integrative Psychosocial Care for Siblings and Caregivers of Youth with Cancer
Implementing Integrative Psychosocial Care for Siblings and Caregivers of Youth with Cancer Open
Background/Objectives: Psychosocial care for siblings and caregivers of youth with cancer (SCYC) is a critical yet under-implemented component of comprehensive pediatric oncology care, as outlined by the Standards for Psychosocial Care for…
View article: Effects of bismuth on the microstructure and crack propagation in Sn–Ag–Cu-Bi solder joints during thermal cycling
Effects of bismuth on the microstructure and crack propagation in Sn–Ag–Cu-Bi solder joints during thermal cycling Open
Bismuth is added to Sn–Ag–Cu-based solders to increase strength and solder joint reliability but accelerated thermal cycling (ATC) tests have shown variable thermal fatigue performance. To better understand their thermal fatigue mechanisms…
View article: TFV‐DP and FTC‐TP using volumetric absorptive microsampling compared with DBS among persons receiving TDF/FTC or TAF/FTC
TFV‐DP and FTC‐TP using volumetric absorptive microsampling compared with DBS among persons receiving TDF/FTC or TAF/FTC Open
View article: Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi Solder Joints After Thermal Cycling
Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi Solder Joints After Thermal Cycling Open
View article: Intermetallic Compounds in Solder Alloys: Common Misconceptions
Intermetallic Compounds in Solder Alloys: Common Misconceptions Open
Intermetallic compounds (IMC) or intermediate phases are formed between two or more metallic elements in many metal alloy systems. During soldering, an IMC is formed at the soldered interface as the molten solder reacts with an element in …
View article: The role of microstructure in the thermal fatigue of solder joints
The role of microstructure in the thermal fatigue of solder joints Open
Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure and damage in Sn-3Ag-0.5Cu joints throughout a ball grid arr…
View article: Mechanistic understanding of microstructural effects on the thermal fatigue resistance of solder joints
Mechanistic understanding of microstructural effects on the thermal fatigue resistance of solder joints Open
This paper uses a multi-scale crystal plasticity modelling approach to investigate the role of microstructure in the damage of Sn-3Ag-0.5Cu (wt%, SAC305) solder joints subject to thermal cycling. Faithful microstructure modelling has been …
View article: Electromigration in Tin-bismuth Planar Solder Joints
Electromigration in Tin-bismuth Planar Solder Joints Open
The real-time monitoring of electromigration in ball-grid-array solder joints is limited to measuring the electrical resistance increase of the solder joints. Tracking the electromigration induced microstructural changes in solder balls re…
View article: The role of microstructure in the thermal fatigue of solder joints
The role of microstructure in the thermal fatigue of solder joints Open
Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure and damage in Sn-3Ag-0.5Cu joints throughout a ball grid arr…
View article: Correction: Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends
Correction: Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends Open
View article: Pb-Free Solders and Aerospace/Defense (A&D) High Performance Considerations
Pb-Free Solders and Aerospace/Defense (A&D) High Performance Considerations Open
The Aerospace & Defense (A & D) industries maintain a high level of interest in the expansive amount of work performed in developing and qualifying Pb-free solder alloys. The three main areas of interest continue to be thermal cycle, mecha…
View article: Board-Level Reliability of Lead-Frame Based Substrate and Surface Finishing Technology
Board-Level Reliability of Lead-Frame Based Substrate and Surface Finishing Technology Open
Lead-frames have been widely used in the semiconductor package assembly field, and QFN (Quad flat no leads) has the advantages of miniaturization and cost reduction of the semiconductor package. It has had limited use in automotive or defe…
View article: A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints Open
This paper presents a multi-scale modelling approach to investigate the\nunderpinning mechanisms of microstructure-sensitive damage of single crystal\nSn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board\nassembly subj…
View article: Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony
Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony Open
View article: Pb-Free Solder Joint Thermo-Mechanical Modeling: State of the Art and Challenges
Pb-Free Solder Joint Thermo-Mechanical Modeling: State of the Art and Challenges Open
View article: Erratum to: Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends
Erratum to: Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends Open
View article: Economic And Utilization Trends Among Esrd Patients With Anemia: Iv Iron And Erythropoiesis Stimulating Agents
Economic And Utilization Trends Among Esrd Patients With Anemia: Iv Iron And Erythropoiesis Stimulating Agents Open
View article: Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends
Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends Open