Robert Patti
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View article: Micro-Transfer Printing of Repeaters on Passive Interposer
Micro-Transfer Printing of Repeaters on Passive Interposer Open
Silicon-based sensors are central to particle physics experiments and particle tracking detectors. New-generation Large Focal Plane Arrays (LFPAs) cover areas that extend beyond several square meters. Distributing power and transporting da…
View article: A 3D Integrated Energy-Efficient Transceiver Realized by Direct Bond Interconnect of Co-Designed 12 nm FinFET and Silicon Photonic Integrated Circuits
A 3D Integrated Energy-Efficient Transceiver Realized by Direct Bond Interconnect of Co-Designed 12 nm FinFET and Silicon Photonic Integrated Circuits Open
This paper presents the first experimental demonstration of an energy-efficient electronic-photonic co-designed transceiver circuit heterogeneously 3D co-integrated with high-density, low-parasitic Direct Bond Interconnect (DBI ® ) featuri…
View article: Welcome to 3DIC 2021
Welcome to 3DIC 2021 Open
Welcome to 3DIC 2021Welcome.This year the meeting will be held in hybrid mode in Raleigh NC and online.There are 25 pre-registered to come to Raleigh and 100 planning to
View article: 200 mm sensor development using bonded wafers
200 mm sensor development using bonded wafers Open
Sensors fabricated from high resistivity, float zone, silicon material have\nbeen the basis of vertex detectors and trackers for the last 30 years. The\nareas of these devices have increased from a few square cm to $\\> 200\\ m^2$ for\nthe…
View article: New Radiation Tolerant LGAD for High Energy Physics
New Radiation Tolerant LGAD for High Energy Physics Open
Low Gain Avalanche Detectors (LGADS) have recently been studied for applications in high energy physics. However, radiation hardness remains a problem. Here, we propose new LGAD process flow that allows for the creation of a very steep bor…
View article: Phase I Final Technical Report on Energy-Efficient Reconfigurable Universal Accelerator Interconnect
Phase I Final Technical Report on Energy-Efficient Reconfigurable Universal Accelerator Interconnect Open
It is well known that application specific computing systems, optimally designed and configured for a given workload, offer much higher energy-efficiency and throughput than general purpose systems. In modern computing systems, heterogeneo…
View article: Design, Fabrication, and Testing of a Liquid Cooling Platform for High Power 3D-ICs
Design, Fabrication, and Testing of a Liquid Cooling Platform for High Power 3D-ICs Open
3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such level of integration can result in local power dissipation of …
View article: Design, Fabrication, and Testing of a Liquid Cooling Platform for High\n Power 3D-ICs
Design, Fabrication, and Testing of a Liquid Cooling Platform for High\n Power 3D-ICs Open
3D integrated circuit (3D-IC) technology gained acceptance due to the ability\nto achieve extremely high level of integration, where hundreds of ICs are\nstacked vertically. Such level of integration can result in local power\ndissipation …
View article: Through-Silicon-Vias (TSVs) for 3D readout of ASIC for nearly gapless CdZnTe detector arrays
Through-Silicon-Vias (TSVs) for 3D readout of ASIC for nearly gapless CdZnTe detector arrays Open
Wirebonds, although proven for space application and perceived necessary for hybrid sensors like CdZnTe (CZT) detectors, introduce assembly complexity and undesirable gaps between detector units. Thus, they pose a serious challenge in buil…
View article: Fully 3-D Integrated Pixel Detectors for X-Rays
Fully 3-D Integrated Pixel Detectors for X-Rays Open
The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500-μm-thick silicon sensor, a two-tier 34-μm-thick integrated circuit, and a host printed circuit board (PCB). The integrated circuit tiers w…