R. S. Bauer
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View article: Electromigration of Power Devices Part 2: Power Device in Applications in Controlled Environment
Electromigration of Power Devices Part 2: Power Device in Applications in Controlled Environment Open
In the power semiconductor industry, there is a continuous development toward a higher current capability of devices while device’s dimensions shrink. Although higher current is preferred, the reliability risk of the electromigration (EM) …
View article: Electromigration in Power Devices: A Combined Effect of Electromigration and Thermal Migration
Electromigration in Power Devices: A Combined Effect of Electromigration and Thermal Migration Open
In the power semiconductor industry, there is continuous development toward higher maximum current capability of devices while device dimensions shrink. This leads to an increase in current density which the devices have to handle, and rai…
View article: Current divisions and distributed Joule heating of two-dimensional grid microstructures
Current divisions and distributed Joule heating of two-dimensional grid microstructures Open
View article: Multilayered microstructures with shape memory effects for vertical deployment
Multilayered microstructures with shape memory effects for vertical deployment Open
View article: Significant change in threshold for plasma formation and evolution with small variation in copper alloys driven by a mega-ampere current pulse
Significant change in threshold for plasma formation and evolution with small variation in copper alloys driven by a mega-ampere current pulse Open
We report the first observation of a significant change in plasma formation and evolution caused by a small change in the material composition (metal alloy). Thick copper rod alloys were varied in the initial diameter from 0.5 mm to 1.59 m…