Steven Van Put
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View article: A fully packaged silicon photonic Bragg grating temperature sensor with a compact back side interface based on a ball lens
A fully packaged silicon photonic Bragg grating temperature sensor with a compact back side interface based on a ball lens Open
With the increased interest in silicon photonics, smart integration and packaging technologies are essential to transform photonic integrated circuits (PICs) into functional photonic systems. Especially for sensing, the currently existing …
Stretchable Mold Interconnect Optimization: Peeling Automation and Carrierless Techniques Open
The primary bottleneck of the stretchable mold interconnect (SMI) technology is its reliance on carrier boards. These are necessary to handle the meandered circuit during production and to ensure dimensional stability of the flexible circu…
Stretchable Circuits: 3D Multifunctional Composites Based on Large‐Area Stretchable Circuit with Thermoforming Technology (Adv. Electron. Mater. 8/2018) Open
Combining stretchable circuits and thermoforming technology, a method to produce 3D multifunctional polymer composites is described by Yang Yang, Jan Vanfleteren, and co-workers in article number 1800071. A demonstrator consisting of a sev…
A Multiplexed Microfluidic Platform for Bone Marker Measurement: A Proof-of-Concept Open
In this work, we report a microfluidic platform that can be easily translated into a biomarker diagnostic. This platform integrates microfluidic technology with electrochemical sensing and embodies a reaction/detection chamber to measure s…
One-time deformable thermoplastic devices based on flexible circuit board technology Open
This contribution describes an efficient process flow for production of one-time deformable electronic devices based on standard circuit board technology and demonstrates multiple devices fabricated using this technique. The described tech…
Patterning of graphene on silicon-on-insulator waveguides through laser ablation and plasma etching Open
We present the use of femtosecond laser ablation for the removal of monolayer graphene from silicon-on-insulator (SOI) waveguides, and the use of oxygen plasma etching through a metal mask to peel off graphene from the grating couplers att…