S. Kousar
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View article: Laser-Assisted Micro-Solder Bumping for Copper and Nickel–Gold Pad Finish
Laser-Assisted Micro-Solder Bumping for Copper and Nickel–Gold Pad Finish Open
Flip-chip bonding is a key packaging technology to achieve the smallest form factor possible. Using copper as a direct under-bump metal and performing bonding under little force and at a low temperature eliminates the processing step for t…